scholarly journals Digital Exhaust Controller for Pressure Detection on Die Attach Oven Curing Machine

Author(s):  
Rogel Dela Rosa ◽  
Jerome J. Dinglasan ◽  
Frederick Ray Gomez

Innovation on die attach curing process on semiconductor industry play a big role to have a robust process eliminating unwanted gross unit rejection. Resolving failures and hardware breakdowns on the exhaust system of oven curing process are the focus of this paper. Discoloration and contamination due to outgas and fumes that cannot exit the oven chamber are the effects of a failed exhaust system. Addressing the said phenomenon showing simulations, trial runs will be discussed on this paper. Promoting an innovative approach that includes real time monitoring of the system performance, and detection of its failure to prevent continuous operation with failed exhaust system are performed to have an appropriate resolution.

2020 ◽  
Vol 500 (1) ◽  
pp. 388-396
Author(s):  
Tian Z Hu ◽  
Yong Zhang ◽  
Xiang Q Cui ◽  
Qing Y Zhang ◽  
Ye P Li ◽  
...  

ABSTRACT In astronomy, the demand for high-resolution imaging and high-efficiency observation requires telescopes that are maintained at peak performance. To improve telescope performance, it is useful to conduct real-time monitoring of the telescope status and detailed recordings of the operational data of the telescope. In this paper, we provide a method based on machine learning to monitor the telescope performance in real-time. First, we use picture features and the random forest algorithm to select normal pictures captured by the acquisition camera or science camera. Next, we cut out the source image of the picture and use convolutional neural networks to recognize star shapes. Finally, we monitor the telescope performance based on the relationship between the source image shape and telescope performance. Through this method, we achieve high-performance real-time monitoring with the Large Sky Area Multi-Object Fibre Spectroscopic Telescope, including guiding system performance, focal surface defocus, submirror performance, and active optics system performance. The ultimate performance detection accuracy can reach up to 96.7 per cent.


2010 ◽  
Vol 44-47 ◽  
pp. 3254-3258
Author(s):  
Wang Chun Zhu ◽  
Hai Ying Gao ◽  
Zhi Li

In many testing and controlling fields, a long time and continuous data acquisition is in great need to realize real-time monitoring, playback and analysis after signal gathering. The implementation of successive data acquisition module is an important way for the increase of system performance in VXI testing systems. The method of a parallel A/D successive data acquisition module driver design is presented in this paper. Finally, the soft test board of the module is developed.


2021 ◽  
Vol 31 (1) ◽  
pp. 015039
Author(s):  
Jianjian Zhu ◽  
Jinshan Wen ◽  
Chunyang Chen ◽  
Xiao Liu ◽  
Zifeng Lan ◽  
...  

Abstract As one of cost-effective maintenance methods, bonded composite patch repair has been receiving more and more attention in the engineering community since past decades. However, realizing real-time monitoring for curing process of bonded repair patch is difficult for most current techniques. In our work, a method based on electromechanical impedance and system parameters evaluation for structural health monitoring issues was developed, which could implement the online monitoring throughout whole curing process. Compared with the dynamic thermomechanical analysis results, the experiment data matches well. It demonstrates that the proposed approach can effectively monitor the curing process of composite repair patch at a constant temperature of 120 °C. Hence, the presented approach in this paper is expected to be a novel, robust, and real-time monitoring method for structural maintenance with the composite patch.


Author(s):  
Jerome Dinglasan ◽  
Rogel Dela Rosa ◽  
Frederick Ray Gomez

In the world of semiconductor industry, automation plays a big role on every manufacturing plants to improve efficiency, prevent product yield losses, and making sure that top quality products will be delivered on end user. On die attach curing process of manufacturing semiconductor integrated circuits (IC) devices, certain problems occur like wrong Nitrogen (N2) parameter setting on the oven curing machine, with human intervention during setup, causing leadframe oxidation related defects. The paper discussed the importance of automation system on processing semiconductor IC products on die attach curing process, eliminating mostly human intervention on setting up machine parameters, storing and managing programs, restrict unauthorize users from accessing, provide friendly user procedures to prevent human errors and prevent oxidation related defects.


2006 ◽  
Vol 175 (4S) ◽  
pp. 521-521
Author(s):  
Motoaki Saito ◽  
Tomoharu Kono ◽  
Yukako Kinoshita ◽  
Itaru Satoh ◽  
Keisuke Satoh

2001 ◽  
Vol 11 (PR3) ◽  
pp. Pr3-1175-Pr3-1182 ◽  
Author(s):  
M. Losurdo ◽  
A. Grimaldi ◽  
M. Giangregorio ◽  
P. Capezzuto ◽  
G. Bruno

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