Thermal design and analysis for double side cooling 6-in-1 SiC power module

Author(s):  
Gongyue Tang ◽  
Kazunori Yamamoto
Keyword(s):  
Author(s):  
Shiladitya Chakravorty ◽  
Bahgat Sammakia ◽  
Varaprasad Calmidi

Improved performance of semiconductor devices in recent years has resulted in consequent increase in power dissipation. Hence thermal characterization of components becomes important from an overall thermal design perspective of the system. This study looks at a high performance non-isolated point of load power module (a DC to DC converter) meant for advanced computing and server applications. Thermal characteristics of the module were experimentally analyzed by placing the power module on a bare test board (with no insulation) inside a wind tunnel with thermocouples attached to it. There were three devices on this module that dissipate power. There were two FETs (Field Effect Transistors) and an inductor which can be considered as sources. The consolidated power dissipation from the module was calculated by measuring the input voltage and input current while keeping the output voltage and current constant. Temperatures at various points on the module and the test card were recorded for different air flow velocities and overall power dissipation. Subsequently this set up was numerically analyzed using a commercially available computational fluid dynamics (CFD) code with the objective of comparing the results with experimental data previously obtained.


Author(s):  
Bakhtiyar Mohammad Nafis ◽  
Ange Iradukunda ◽  
David Huitink

Power output to electric traction drive systems varies over a wide range during real-world operation. As a result, the inverters, responsible for converting direct current battery (DC) to alternating current (AC) for electric motor operation, experience temperature changes that are important to consider in thermal design of the whole system, as well as implications for reliability in actual use. Because of the implications of temperature on device & system reliability, it is necessary to design appropriate thermal management systems to control their temperatures to meet product reliability goals. This study utilizes US Environmental Protection Agency standard driving schedules as case studies in how driving characteristics result in power module temperature profiles during operation for various heat removal schemes and design efficiencies. The temperature profiles obtained in this study clearly demonstrate a strong relationship between motor power output and inverter heat sink temperature. Moreover, when integrated with various degrees of road incline, the driving schedules show how road and elevation also impacts the need for various cooling technologies. This information can be integrated into use condition analyses for predicting reliability of the electronic components using reliability models developed from accelerated testing and qualifications to ensure the proper certification envelope is demonstrated for any given vehicle and environment, as well as demonstrate the effectiveness of cooling methods for determination of technical and economic feasibility.


2015 ◽  
Vol 821-823 ◽  
pp. 879-883 ◽  
Author(s):  
Tsuyoshi Funaki ◽  
Shuhei Yamamoto ◽  
Shin Harada ◽  
Yuji Iizuka ◽  
Kenji Fukuda ◽  
...  

The thermal management of power module is one of the key important issues for power conversion circuit design. SiC power module is expected to give less conduction and switching loss than conventional Si device, which enables to facilitate the thermal management of a power conversion circuit. This paper develops 2in1 Full-SiC power module and studies the applicability for 600V→300V, 15kW DC-DC buck converter. The feasible thermal design of SiC power module to serve rated operation of the converter circuit is discussed based on the elemental experiments. The developed full-SiC power module realized lower loss and smaller converter circuit than conventional-Si power module.


1988 ◽  
Vol 2 (6) ◽  
pp. 303
Author(s):  
K.J.H. Hacke
Keyword(s):  

2012 ◽  
Vol 132 (3) ◽  
pp. 53-57
Author(s):  
Yuya Shiokawa ◽  
Tatsuya Nakano ◽  
Naoki Maeda ◽  
Masafumi Kimata ◽  
Akihiro Takahata

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