semiconductor contacts
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2022 ◽  
pp. 541-549
Author(s):  
Aaron J. Kaufman ◽  
Raina A. Krivina ◽  
Meikun Shen ◽  
Shannon W. Boettcher

Author(s):  
Michael R. Scudder ◽  
Bin He ◽  
Yaxian Wang ◽  
Akash Rai ◽  
David Cahill ◽  
...  

The principal challenges in current thermoelectric power generation modules is the availability of stable, diffusion-resistant, lossless electrical and thermal metal-semiconductor contacts that do not degrade at the hot end nor...


2020 ◽  
Vol 19 ◽  
pp. 103679
Author(s):  
Abdullah Al Mamun Mazumder ◽  
Md. Soyaeb Hasan ◽  
Ahmed I.M. Iskanderani ◽  
Md. Rafiqul Islam ◽  
Md. Tanvir Hasan ◽  
...  

2020 ◽  
Vol 10 (8) ◽  
pp. 2754
Author(s):  
Yu Zhang ◽  
Xiong Chen ◽  
Hao Zhang ◽  
Xicheng Wei ◽  
Xiangfeng Guan ◽  
...  

Molybdenum disulfide (MoS2) field-effect transistors (FETs) with four different metallic electrodes (Au,Ag,Al,Cu) of drain-source were fabricated by mechanical exfoliation and vacuum evaporation methods. The mobilities of the devices were (Au) 21.01, (Ag) 23.15, (Al) 5.35 and (Cu) 40.52 cm2/Vs, respectively. Unpredictably, the on-state currents of four devices were of the same order of magnitude with no obvious difference. For clarifying this phenomenon, we calculated the Schottky barrier height (SBH) of the four metal–semiconductor contacts by thermionic emission theory and confirmed the existence of Fermi-level pinning (FLP). We suppose the FLP may be caused by surface states of the semiconductor produced from crystal defects.


2020 ◽  
Vol 3 (4) ◽  
pp. 207-215 ◽  
Author(s):  
Seunguk Song ◽  
Yeoseon Sim ◽  
Se-Yang Kim ◽  
Jung Hwa Kim ◽  
Inseon Oh ◽  
...  

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