Thermal Fatigue Model of Aluminium Alloy Die Casting H-13 Dies under Thermo-Mechanical Cycle

In industrial fields, thermal fatigue behavior has recently acquired an important role which is mainly related to the interaction between mechanical and thermal conditions. This paper proposes a thermal fatigue model of H13 tool steel under thermos-mechanical cycles. A test apparatus was used to assess the thermal fatigue resistance of materials to estimate surface crack area when specimens are subjected to thermal cycling. Thermal cycling up to 700°C was used, and crack patterns were examined after 1850, 3000, and 5000 cycles. Temperature distributions were measured at different locations in the test specimens. A model was developed to establish a relationship between mechanical cycling and thermal analysis. From the results, the thermal fatigue resistance was significantly improved over the control parameter after heating and cooling during thermomechanical cycles. The model was applied to determine the best performance and in-service life of die casting tools.

Optimization of Properties for Alumina-Spinel Refractory Castables by CMA (CaO-MgO-Al2O3) Aggregates

Aiming at optimizing properties of alumina-spinel refractory castables, coarse corundum particles were replaced partially with the particles of a novel porous multi-component CMA (CaO-MgO-Al2O3) aggregate in the same size. Properties including the bulk density, apparent porosity, strength, slag corrosion resistance, thermal shock resistance and thermal fatigue resistance of alumina-spinel refractory castables containing CMA aggregates were evaluated contrastively. The results demonstrated that the incorporation of CMA aggregates can significantly improve thermal shock resistance and thermal fatigue resistance of castables, although companying with slight decrease in the bulk density and strength. Moreover, slag penetration resistance of castables can also be enhanced by CMA aggregates with appropriate particle size. The influence of CMA aggregates on properties of alumina-spinel refractory castables depended strongly on their particle size.

Bionic Repair of Thermal Fatigue Cracks in Ductile Iron by Laser Melting with Different Laser Parameters

Nodular iron brake discs typically fail due to serious thermal fatigue cracking, and the presence of graphite complicates the repair of crack defects in ductile iron. This study presents a novel method for remanufacturing ductile iron brake discs based on coupled bionics to repair thermal fatigue cracks discontinuously using bio-inspired crack blocking units fabricated by laser remelting at various laser energy inputs. Then, the ultimate tensile force and thermal fatigue crack resistance of the obtained units were tested. The microhardness, microstructure, and phases of the units were characterized using a digital microhardness meter, optical microscopy, scanning electron microscopy, and X-ray diffraction. It was found that the units without defects positively impacted both the thermal fatigue resistance and tensile strength. The unit fabricated at a laser energy of 165.6 − 15 + 19 J/ mm 2 had sufficient depth to fully close the crack, and exhibited superior anti-cracking and tensile properties. When the unit distance is 3 mm, the sample has excellent thermal fatigue resistance. In addition, the anti-crack mechanism of the units was analysed.

Thermal Fatigue Failure Behavior of Surface/Interface of Plasma Cladding Layer

Co-based coating was prepared by plasma cladding on FV520B substrates. Microstructure of the coatings was observed by scanning electron microscope. Finite element simulation as a predictive method to research the stress distributed after thermal cycling. Thermal fatigue resistance of the coating-substrate was evaluated at temperature of 600 °C, 700 °C, 800 °C, and 900 °C. Results indicate that the surface/interface structure has excellent thermal fatigue resistance at 600 °C, and the thermal fatigue crack initiated near the interface and extended along the grain boundary. The difference of expansion coefficient of the coating and substrate is small near 600 °C, and the difference increased when the temperature climbed above 600 °C. The diffuse elements could be found near the interface after the thermal cycle, and the dislocations and precipitated phase were observed.

Thermal Fatigue Properties of Ultrasonically Bonded Copper Joints

Thermal fatigue generally occurs in ultrasonically bonded copper joints in electronic devices as the bonding substrate is composed of plural materials, leading to differences in the coefficient of thermal expansion. In this study, we found that the thermal fatigue resistance of the ultrasonically bonded copper joints was influenced by the grain size and hardness of the bonding substrate through the evaluation of the thermal fatigue properties. Copper alloys C1020 and C1940 were used as substrate materials to investigate the influence of the initial properties of the bonding material on the thermal fatigue resistance. We evaluated the crack propagation due to thermal fatigue via thermal cycle tests. Microstructural observations of the region fractured because of thermal fatigue revealed that cracks resulting from thermal fatigue did not progress in the fine grain region formed at the bonded interface. It was inferred that grain boundaries were an obstacle to crack propagation. C1940 has higher hardness and finer grains than C1020, and showed a lower decreasing rate of the peel strength and bonding area after the thermal cycling test than C1020 joints. Thus, a hard copper material with fine grains is effective in suppressing thermal fatigue fracture of ultrasonically bonded copper joints.