interface damage
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2021 ◽  
Vol 14 ◽  
Author(s):  
Bouchra Achour ◽  
Allel Mokaddem ◽  
Bendouma Doumi ◽  
Abdelkader Ziadi ◽  
Lahcen Belarbi ◽  
...  

Background: : nowadays, the natural fibers are used in all industrial fields, particular in automotive technology and in civil engineering. this great emergence due to its biodegradability, recyclability and has no environmental effect. Objective: In this article, the effect of raffia, alfa and sisal fibers on the damage of biocomposite materials (raffia/PLA (polylactic acid), alfa/PLA and sisal/PLA), subjected to the same mechanical shear stress, has been investigated. Method: To calculate the damage to the interface, the genetic operator crossing are employed based on the fiber and matrix damage. Result: The results have shown that the raffia / PLA and alfa/PLA biocomposite materials are the better mechanical properties compared to sisal / PLA, this observation has been confirmed by the different values of interface damage of the biocomposite studied. Conclusion: The numerical results are similar and coincide perfectly with the results of Cox where he demonstrated that the Young's modulus of fibers improves the resistance of the interface. These conclusions are in very good agreement with our numerical data presented by the red cloud, and also in good agreement with the work presented by Antoine Le Duigou et al. and the work of Bodros et al. have shown that natural fibers greatly improve the physical characteristics of composite materials.


2021 ◽  
Vol 291 ◽  
pp. 123258
Author(s):  
Xuhao Cui ◽  
Bowen Du ◽  
Hong Xiao ◽  
Rui Zhou ◽  
Gaoran Guo ◽  
...  

2021 ◽  
Vol 1948 (1) ◽  
pp. 012139
Author(s):  
Tao Wang ◽  
Ruixiang Bai ◽  
Changlong Wei ◽  
Xiaodi Huang ◽  
Heshan Bai

Author(s):  
T. Kaiser ◽  
A. Menzel

AbstractMotivated by the influence of (micro-)cracks on the effective electrical properties of material systems and components, this contribution deals with fundamental developments on electro-mechanically coupled cohesive zone formulations for electrical conductors. For the quasi-stationary problems considered, Maxwell’s equations of electromagnetism reduce to the continuity equation for the electric current and to Faraday’s law of induction, for which non-standard jump conditions at the interface are derived. In addition, electrical interface contributions to the balance equation of energy are discussed and the restrictions posed by the dissipation inequality are studied. Together with well-established cohesive zone formulations for purely mechanical problems, the present developments provide the basis to study the influence of mechanically-induced interface damage processes on effective electrical properties of conductors. This is further illustrated by a study of representative boundary value problems based on a multi-field finite element implementation.


2021 ◽  
Vol 114 (1-2) ◽  
pp. 159-171
Author(s):  
Andrea Pardo ◽  
Julie Le Gall ◽  
Robert Heinemann ◽  
Luke Bagshaw

AbstractAlthough substantial research work has been conducted in order to understand and improve the drilling of multi-material aerospace stacks, some key aspects related to process and tool parameters and their impact on the interface quality still need to be addressed. This paper reports on the research conducted to investigate the impact of tool point angle and interlayer gap width on borehole quality, focussing on the interface region. A number of drilling tests were carried out using tools with different point angles and CFRP/titanium stacks with different interlayer gap widths. The results show that the damage on the CFRP interlayer surface is caused by the drilling of the titanium layer, as some of the upwards-travelling titanium chips penetrate into the stack interface. An increase in tool point angle results in larger entry burrs on the titanium interlayer surface, which is attributed to the correlation between tool point angle and thrust force and the capability of tools with low point angles to remove damage generated by surface skidding. The introduction of an interlayer gap promotes the ingress of titanium chips into the stack interface, thereby leading to more pronounced interface damage.


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