Active IR Thermography for Bonding Interface Damage of Glass Curtain Walls

2021 ◽  
Author(s):  
Xiaobin Hong ◽  
Jinfan Lin ◽  
Zeming Ren
Keyword(s):  
Bonding Interface ◽  
Ir Thermography ◽  
Interface Damage

IR Thermography for Temperature Measurements and Fault Location on AlGaN/GaN HEMTs and MMICs

2015 ◽  
Author(s):  
Lény Baczkowski ◽  
Franck Vouzelaud ◽  
Dominique Carisetti ◽  
Nicolas Sarazin ◽  
Jean-Claude Clément ◽  
...  
Keyword(s):  
Fault Location ◽  
Hot Spot ◽  
Life Time ◽  
High Electron Mobility Transistors ◽  
Junction Temperature ◽  
High Electron ◽  
Ir Thermography ◽  
Operating Life ◽  
Gan Hemt ◽  
Electron Mobility Transistors

Abstract This paper shows a specific approach based on infrared (IR) thermography to face the challenging aspects of thermal measurement, mapping, and failure analysis on AlGaN/GaN high electron-mobility transistors (HEMTs) and MMICs. In the first part of this paper, IR thermography is used for the temperature measurement. Results are compared with 3D thermal simulations (ANSYS) to validate the thermal model of an 8x125pm AIGaN/GaN HEMT on SiC substrate. Measurements at different baseplate temperature are also performed to highlight the non-linearity of the thermal properties of materials. Then, correlations between the junction temperature and the life time are also discussed. In the second part, IR thermography is used for hot spot detection. The interest of the system for defect localization on AIGaN/GaN HEMT technology is presented through two case studies: a high temperature operating life test and a temperature humidity bias test.

Subsurface imaging for panel paintings inspection: A comparative study of the ultraviolet, the visible, the infrared and the terahertz spectra

2015 ◽  
Vol 23 (1) ◽  
Author(s):  
A. Bendada ◽  
S. Sfarra ◽  
C. Ibarra−Castanedo ◽  
M. Akhloufi ◽  
J.−P. Caumes ◽  
...  
Keyword(s):  
Subsurface Imaging ◽  
Wide Spread ◽  
Ir Thermography ◽  
Complementary Information ◽  
Ir Sensors ◽  
The World ◽  
Panel Paintings ◽  
Temperature Maps ◽  
Illumination Source ◽  
Ir Reflectography

AbstractInfrared (IR) reflectography has been used for many years for the detection of underdrawings on panel paintings. Advances in the fields of IR sensors and optics have impelled the wide spread use of IR reflectography by several recognized Art Museums and specialized laboratories around the World. The transparency or opacity of a painting is the result of a complex combination of the optical properties of the painting pigments and the underdrawing material, as well as the type of illumination source and the sensor characteristics. For this reason, recent researches have been directed towards the study of multispectral approaches that could provide simultaneous and complementary information of an artwork. The present work relies on non−simultaneous multispectral inspection using a set of detectors covering from the ultraviolet to the terahertz spectra. It is observed that underdrawings contrast increases with wavelength up to 1700 nm and, then, gradually decreases. In addition, it is shown that IR thermography, i.e., temperature maps or thermograms, could be used simultaneously as an alternative technique for the detection of underdrawings besides the detection of subsurface defects.

A Fracture Mechanics Based Parametric Study of the Copper-to-Copper Direct Thermo-Compression Bonded Interface Using Finite Element Method

2013 ◽  
Author(s):  
Ah-Young Park ◽  
Satish Chaparala ◽  
Seungbae Park
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Parametric Study ◽  
Initial Crack ◽  
Bonding Interface ◽  
Interface Condition ◽  
Large Temperature ◽  
Bonded Interface ◽  
The Impact ◽  
Element Method

Through-silicon via (TSV) technology is expected to overcome the limitations of I/O density and helps in enhancing system performance of conventional flip chip packages. One of the challenges for producing reliable TSV packages is the stacking and joining of thin wafers or dies. In the case of the conventional solder interconnections, many reliability issues arise at the interface between solder and copper bump. As an alternative solution, Cu-Cu direct thermo-compression bonding (CuDB) is a possible option to enable three-dimension (3D) package integration. CuDB has several advantages over the solder based micro bump joining, such as reduction in soldering process steps, enabling higher interconnect density, enhanced thermal conductivity and decreased concerns about intermetallic compounds (IMC) formation. Critical issue of CuDB is bonding interface condition. After the bonding process, Cu-Cu direct bonding interface is obtained. However, several researchers have reported small voids at the bonded interface. These defects can act as an initial crack which may lead to eventual fracture of the interface. The fracture could happen due to the thermal expansion coefficient (CTE) mismatch between the substrate and the chip during the postbonding process, board level reflow or thermal cycling with large temperature changes. In this study, a quantitative assessment of the energy release rate has been made at the CuDB interface during temperature change finite element method (FEM). A parametric study is conducted to analyze the impact of the initial crack location and the material properties of surrounding materials. Finally, design recommendations are provided to minimize the probability of interfacial delamination in CuDB.

scholarly journals Interface damage analysis of composite hat-stiffened panels

2021 ◽  
Vol 1948 (1) ◽  
pp. 012139
Author(s):  
Tao Wang ◽  
Ruixiang Bai ◽  
Changlong Wei ◽  
Xiaodi Huang ◽  
Heshan Bai
Keyword(s):  
Damage Analysis ◽  
Stiffened Panels ◽  
Interface Damage

Interface damage and arching mechanism of CRTS II slab track under temperature load

2021 ◽  
Vol 291 ◽  
pp. 123258
Author(s):  
Xuhao Cui ◽  
Bowen Du ◽  
Hong Xiao ◽  
Rui Zhou ◽  
Gaoran Guo ◽  
...  
Keyword(s):  
Slab Track ◽  
Interface Damage ◽  
Temperature Load

scholarly journals Investigation of the turbulent structure in a flame and the effect of small infrasonic exposure on it using IR thermography methods

2020 ◽  
Vol 1709 ◽  
pp. 012018
Author(s):  
E L Loboda ◽  
M V Agafontsev ◽  
A S Klimentiev ◽  
D P Kasymov ◽  
Y A Loboda ◽  
...  
Keyword(s):  
Turbulent Structure ◽  
Ir Thermography

scholarly journals Impact of solar radiation and environmental temperature on Art Nouveau glass windows

2019 ◽  
Vol 7 (1) ◽  
Author(s):  
Teresa Palomar ◽  
Miguel Silva ◽  
Marcia Vilarigues ◽  
Isabel Pombo Cardoso ◽  
David Giovannacci
Keyword(s):  
Chemical Composition ◽  
Solar Radiation ◽  
Surface Temperature ◽  
Environmental Temperature ◽  
Summer Solstice ◽  
Art Nouveau ◽  
Ir Thermography ◽  
Hot Air ◽  
Near Ir ◽  
Air Pocket

Abstract This work presents the results of the evaluation of two Art Nouveau glass windows from the Casa-Museu Dr. Anastácio Gonçalves (Lisbon, Portugal) with IR-thermography during the summer solstice. According to the measurements, the surface temperature of glass depended on the outdoor environmental temperature and, mainly, on the direct solar radiation. Colored glasses presented a higher surface temperature due to the absorption of their chromophores at near-IR wavelengths. Enamels and grisailles showed higher surface temperatures than their support glasses due to both their chemical composition and color. The protective glazing, with small slits in one of the window panels, induced a hot-air pocket in its upper part due to the insufficient ventilation.

Sign in / Sign up

Export Citation Format

Share Document