Effect of the CMT advanced process combined with an active cooling technique on macro and microstructural aspects of aluminum WAAM

Purpose This paper aims to assess the combined effect of the Cold Metal Transfer (CMT) advanced process and of a thermal management technique (near immersion active cooling [NIAC]) on the macro and microstructure of Al wall-like preforms built by wire arc additive manufacturing (WAAM). As specific objective, it sought to provide information on the effects of the electrode-positive/electrode-negative (EP/EN) parameter in the CMT advanced process fundamental characteristics. Design/methodology/approach Initially, bead-on-plate deposits were produced with different EP/EN ratios, still keeping the same deposition rate, and the outcomes on the electrical signal traces and bead formation were analyzed. In a second stage, the EP/EN parameter and the layer edge to water distance (LEWD) parameter from the NIAC technique were systematically varied and the resultant macro and microstructures compared with those formed by applying natural cooling. Findings Constraints of EP/EN setting range were uncovered and discussed. The use of the NIAC technique favors the formation of finer grains. For a given EP/EN value, a variation in the NIAC intensity (LEWD value) showed marginal effect on grain size. When the EP/EN parameter effect is isolated, i.e. for a given LEWD setting, it was observed that an increase in the EP/EN level favors coarser grains. Originality/value Both the EP/EN parameter and the use of an active cooling technique (NIAC) might be used, even in combination, as effective tools for achieving proper macro and microstructure in WAAM of thin wall builds.

Extending Cooling Rate Performance of Fast Scanning Chip Calorimetry by Liquid Droplet Cooling

The liquid droplet cooling technique for fast scanning chip calorimetry (FSC) is introduced, increasing the cooling rate for large samples on a given sensor. Reaching higher cooling rates and using a gas as the cooling medium, the common standard for ultra-fast temperature control in cooling requires reducing the lateral dimensions of the sample and sensor. The maximum cooling rate is limited by the heat capacity of the sample and the heat exchange between the gas and the sample. The enhanced cooling performance of the new liquid droplet cooling technique is demonstrated for both metals and polymers, on examples of solidification of large samples of indium, high-density polyethylene (HDPE) and poly (butylene 2,6-naphthalate) (PBN). It was found that the maximum cooling rate can be increased up to 5 MK/s in room temperature environment, that is, by two orders of magnitude, compared to standard gas cooling. Furthermore, modifying the droplet size and using coolants at different temperatures provide options to adjust the cooling rate in the temperature ranges of interest.

Extending Cooling Rate Performance of Fast Scanning Chip Calorimetry by Liquid Droplet Cooling

The liquid droplet cooling technique for fast scanning chip calorimetry (FSC) is introduced, increasing the cooling rate for large samples on a given sensor. Reaching higher cooling rates and using a gas as the cooling medium, the common standard for ultra-fast temperature control in cooling, requires reducing the lateral dimensions of the sample and sensor. The maximum cooling rate is limited by the heat capacity of the sample and the heat exchange between the gas and the sample. The enhanced cooling performance of the new liquid droplet cooling technique is demonstrated for both metals and polymers, on examples of solidification of large samples of indium, high-density polyethylene (HDPE), and poly (butylene 2,6-naphthalate) (PBN). It was found that the maximum cooling rate can be increased up to 5 MK/s in room temperature environment, that is, by 2 orders of magnitude, compared to standard gas cooling. Furthermore, modifying the droplet size and using coolants at different temperatures provide options to adjust the cooling rate in the temperature ranges of interest.