Effects of Laser Peening with a Pulse Energy of 1.7 mJ on the Residual Stress and Fatigue Properties of A7075 Aluminum Alloy

Laser peening without coating (LPwC) using a palmtop-sized microchip laser has improved the residual stresses (RSs) and fatigue properties of A7075 aluminum alloy. Laser pulses with a wavelength of 1.06 μm and duration of 1.3 ns from a Q-switched Nd:YAG microchip laser were focused onto A7075 aluminum alloy samples covered with water. X-ray diffraction revealed compressive RSs on the surface after irradiation using laser pulses with an energy of 1.7 mJ, spot diameter of 0.3 mm, and density of 100–1600 pulse/mm2. The effects were evident to depths of a few hundred micrometers and the maximum compressive RS was close to the yield strength. Rotation-bending fatigue experiments revealed that LPwC with a pulse energy of 1.7 mJ significantly prolonged the fatigue life and increased the fatigue strength by about 100 MPa with 107 fatigue cycles. The microchip laser used in this study is small enough to fit in the hand or be mounted on a robot arm. The results may lead to the development of tools that extend the service life of various metal parts and structures, especially outdoors where conventional lasers are difficult to apply.

Effect of Laser Peening with a Microchip Laser on Fatigue Life in Butt-Welded High-Strength Steel

Laser peening introduces compressive residual stresses on the surfaces of various materials and is effective in enhancing fatigue strength. Using a small microchip laser, with energies of 5, 10, and 15 mJ, the authors applied laser peening to the base material of an HT780 high-strength steel, and confirmed compressive residual stresses in the near-surface layer. Laser peening with a pulse energy of 15 mJ was then applied to fatigue samples of an HT780 butt-welded joint. It was confirmed that laser peening with the microchip laser prolonged the fatigue life of the welded joint samples to the same level as in previous studies with a conventional laser.

LIDAR altimeter conception for HERA spacecraft

Purpose This paper aims to report the first iteration on the Light Detection and Ranging (LIDAR) Engineering Model altimeter named HELENA. HELENA is a Time of Flight (TOF) altimeter that provides time-tagged distances and velocity measurements. The LIDAR can be used for support near asteroid navigation and provides scientific information. The HELENA design comprises two types of technologies: a microchip laser and low noise sensor. The synergies between these two technologies enable developing a compact instrument for range measurements of up to 14 km. Thermal-mechanical and radiometric simulations of the HELENA telescope are reported in this paper. The design is subjected to vibrational, static and thermal conditions, and it was possible to conclude by the results that the telescope is compliant with the random vibration levels, the static load and the operating temperatures. Design/methodology/approach The Asteroid Impact & Deflection Assessment (AIDA) is a collaboration between the NASA DART mission and ESA Hera mission. The aim scope is to study the asteroid deflection through a kinetic collision. DART spacecraft will collide with Didymos-B, while ground stations monitor the orbit change. HERA spacecraft will study the post-impact scenario. The HERA spacecraft is composed by a main spacecraft and two small CubeSats. HERA will monitor the asteroid through cameras, radar, satellite-to-satellite doppler tracking, LIDAR, seismometry and gravimetry. Findings The HELENA design comprises two types of technologies: a microchip laser and low noise sensor. The synergies between these two technologies enable developing a compact instrument for range measurements of up to 14 km. Originality/value In this paper is reported the first iteration on the LIDAR Engineering Model altimeter named HELENA. HELENA is a TOF altimeter that provides time-tagged distances and velocity measurements. The LIDAR can be used for support near asteroid navigation and provides scientific information. The HELENA design comprises two types of technologies: a microchip laser and low noise sensor. The synergies between these two technologies enable developing a compact instrument for range measurements of up to 14 km.