aluminum copper alloys
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2021 ◽  
Vol 23 (1) ◽  
Author(s):  
Satyajit Mojumder ◽  
Md Shajedul Hoque Thakur ◽  
Mahmudul Islam ◽  
Monon Mahboob ◽  
Mohammad Motalab

Author(s):  
Alejandra S. Román ◽  
Claudia M. Méndez ◽  
Claudio A. Gervasi ◽  
Raúl B. Rebak ◽  
Alicia E. Ares

2019 ◽  
Vol 176 ◽  
pp. 242-249 ◽  
Author(s):  
C. Shashank Kaira ◽  
Tyler J. Stannard ◽  
Vincent De Andrade ◽  
Francesco De Carlo ◽  
Nikhilesh Chawla

Metals ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 781
Author(s):  
Abdulsalam Muhrat ◽  
Hélder Puga ◽  
Joaquim Barbosa

In this study, ultrasonic vibration (USV) was evaluated in preparation of Al–8wt.%Cu alloys at a lab-scale. Moreover, the role of Ti–6Al–4V sonotrode erosion and its contribution in grain refining were analyzed. Based on the experimental conditions/parameters, it was found that the amount of impurities and the associated porosity were significantly reduced in USV treated alloys. Furthermore, USV reduced the time needed for dissolving the alloying element Cu, nevertheless, the best dissolving of Cu in this study was not possible without introducing further holding time. As a result of using a titanium-based sonotrode, a noticeable content of Ti was found in the ultrasonically treated alloys due to sonotrode erosion under USV. The dispersion of TiAl3 promoted, as a main factor, a grain refining effect at relatively constant and high melt temperature, other possible mechanisms of grain refining have been discussed.


2019 ◽  
Author(s):  
V. Sanabria ◽  
S. Gall ◽  
F. Gensch ◽  
R. Nitschke ◽  
S. Mueller

2018 ◽  
Vol 27 (48) ◽  
Author(s):  
María Ángeles Arenas-Vara ◽  
Peter Skeldon ◽  
Sandra Judith García-Vergara

Copper-enriched layers were developed onto aluminum-copper alloys using alkaline etching in sodium hydroxide, for both, sputter deposited and bulk conditions. Enriched alloys were evaluated by potentiodynamic polarization in sodium chloride solution in order to determine the effect of the enriched layers on the pitting potential of the alloys. Rutherford backscattering spectroscopy was employed to quantify the enrichments and their locations just beneath the alumina-based oxides remaining from the etching. For the sputter deposited aluminum-copper alloys, the results show some scattering of the pitting potential data, and no correlation between pitting potential and the alloy enriched layer. In the case of bulk Al-2wt.%Cu alloy, with the copper in solid-solution, the pitting potential increased for the enriched specimens, indicating also a different pit morphology, with respect to the non-enriched alloy.


Author(s):  
В.В. Малашенко

AbstractThe dynamics of dislocations in aged aluminum–copper alloys under high-rate deformation conditions has been studied. An analytic expression for the dynamic yield stress of these alloys is obtained and it is established that its dependence on the copper concentration is nonmonotonic and has a minimum.


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