Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)

2004 ◽

Cited By ~ 2

Author(s):

Wenbiao Zhao ◽

A. Mettas ◽

Xiaolong Zhao ◽

P. Vassiliou ◽

E.A. Elsayed

Keyword(s):

Accelerated Life ◽

Life Model ◽

Accelerated Life Model

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Analysis of dynamic behavior of solder reflow by solder ball test

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308156 ◽

2004 ◽

Cited By ~ 2

Author(s):

An Bing ◽

Zheng Zonglin ◽

Wu Fengshun ◽

Lu Jun ◽

Zhang Xiaodong ◽

...

Keyword(s):

Dynamic Behavior ◽

Solder Ball ◽

Solder Reflow ◽

Ball Test

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Analysis on altimeters' reliability growth test data

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308159 ◽

2004 ◽

Author(s):

Wenhua Mei

Keyword(s):

Test Data ◽

Reliability Growth ◽

Growth Test

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Lifetime of solder joint and delamination in flip chip assemblies

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308169 ◽

2004 ◽

Cited By ~ 1

Author(s):

Zhaonian Cheng

Keyword(s):

Solder Joint ◽

Flip Chip

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Green molding compounds for high temperature automotive applications

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308150 ◽

2004 ◽

Cited By ~ 4

Author(s):

A.A. Gallo

Keyword(s):

High Temperature ◽

Automotive Applications ◽

Molding Compounds

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Astronautic PBGA (plastic ball grid array) solder joints' reliability: under successive-high acceleration shock condition

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308160 ◽

2004 ◽

Author(s):

Qiang Guo ◽

Mei Zhao ◽

Zhen-jun Zhu ◽

Xiao-chang Zhang

Keyword(s):

Solder Joints ◽

Ball Grid Array ◽

Shock Condition ◽

High Acceleration ◽

Plastic Ball ◽

Plastic Ball Grid Array

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A machine vision system of ball grid array inspection on RT-Linux OS

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308154 ◽

2004 ◽

Cited By ~ 1

Author(s):

Xia Nianjiong ◽

Cao Qixin ◽

Fu Zhuang ◽

Jey Lee

Keyword(s):

Machine Vision ◽

Vision System ◽

Ball Grid Array ◽

Machine Vision System

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Design optimization approaches for the thermo-mechanical reliability of land grid array solder joints

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308158 ◽

2004 ◽

Author(s):

Leon Xu ◽

Zben Xue Han ◽

Ren Wei ◽

Bo Ping Wang ◽

T. Reinikainen

Keyword(s):

Design Optimization ◽

Solder Joints ◽

Mechanical Reliability

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Self-tuning regulator control scheme in wire bonding process for reliability

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308155 ◽

2004 ◽

Author(s):

Li Fang ◽

Yuehong Yin ◽

Xinjun Sheng ◽

Han Ding ◽

Zhongqin Lin

Keyword(s):

Wire Bonding ◽

Bonding Process ◽

Control Scheme ◽

Self Tuning

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Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA) part II: reliability performance of the ACA joints

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308163 ◽

2004 ◽

Cited By ~ 6

Author(s):

C.W. Tan ◽

Y.M. Siu ◽

K.K. Lee ◽

Y.C. Chan ◽

L.M. Cheng

Keyword(s):

Smart Card ◽

Conductive Adhesive ◽

Uv Curable ◽

Anisotropic Conductive Adhesive ◽

Reliability Performance

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Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Generalized step stress accelerated life model [LED case study]

Analysis of dynamic behavior of solder reflow by solder ball test

Analysis on altimeters' reliability growth test data

Lifetime of solder joint and delamination in flip chip assemblies

Green molding compounds for high temperature automotive applications

Astronautic PBGA (plastic ball grid array) solder joints' reliability: under successive-high acceleration shock condition

A machine vision system of ball grid array inspection on RT-Linux OS

Design optimization approaches for the thermo-mechanical reliability of land grid array solder joints

Self-tuning regulator control scheme in wire bonding process for reliability

Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA) part II: reliability performance of the ACA joints

Export Citation Format

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Generalized step stress accelerated life model [LED case study]

Analysis of dynamic behavior of solder reflow by solder ball test

Analysis on altimeters' reliability growth test data

Lifetime of solder joint and delamination in flip chip assemblies

Green molding compounds for high temperature automotive applications

Astronautic PBGA (plastic ball grid array) solder joints' reliability: under successive-high acceleration shock condition

A machine vision system of ball grid array inspection on RT-Linux OS

Design optimization approaches for the thermo-mechanical reliability of land grid array solder joints

Self-tuning regulator control scheme in wire bonding process for reliability

Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA) part II: reliability performance of the ACA joints

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)
Latest Publications