Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA) part II: reliability performance of the ACA joints

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308163 ◽

2004 ◽

Author(s):

C.W. Tan ◽

Y.M. Siu ◽

K.K. Lee ◽

Y.C. Chan ◽

L.M. Cheng

Keyword(s):

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Reliability Performance

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Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA.) part I: optimization of the curing conditions

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) ◽

10.1109/beprl.2004.1308162 ◽

2004 ◽

Author(s):

K.K. Lee ◽

K.T. Ng ◽

C.W. Tan ◽

Y.C. Chan ◽

L.M. Cheng

Keyword(s):

Conductive Adhesive ◽

Curing Conditions ◽

Anisotropic Conductive Adhesive

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The effects of bonding parameters on the reliability performance of flexible RFID tag inlays packaged by anisotropic conductive adhesive

2009 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2009.5270585 ◽

2009 ◽

Author(s):

Xiong-hui Cai ◽

Xian-cai Chen ◽

Bing An ◽

Feng-shun Wu ◽

Yi-ping Wu

Keyword(s):

Conductive Adhesive ◽

Rfid Tag ◽

Bonding Parameters ◽

Anisotropic Conductive Adhesive ◽

Reliability Performance

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Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure

Microelectronics Reliability ◽

10.1016/s0026-2714(02)00089-6 ◽

2002 ◽

Vol 42 (8) ◽

pp. 1195-1204 ◽

Author(s):

Y.C Chan ◽

D.Y Luk

Keyword(s):

Flip Chip ◽

Conductive Adhesive ◽

Bonding Pressure ◽

Bonding Parameters ◽

Anisotropic Conductive Adhesive ◽

Reliability Performance

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Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) ◽

10.1109/eptc.2003.1271612 ◽

2004 ◽

Author(s):

M. Teo ◽

S.G. Mhaisalkar ◽

E.H. Wong ◽

Poi-Siong Teo ◽

C.C. Wong ◽

...

Keyword(s):

Material Properties ◽

Flip Chip ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Reliability Performance ◽

Package Reliability

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Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Microelectronics Reliability ◽

10.1016/s0026-2714(02)00079-3 ◽

2002 ◽

Vol 42 (8) ◽

pp. 1185-1194 ◽

Author(s):

Y.C Chan ◽

D.Y Luk

Keyword(s):

Flip Chip ◽

Bonding Temperature ◽

Conductive Adhesive ◽

Bonding Parameters ◽

Anisotropic Conductive Adhesive ◽

Reliability Performance

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Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages

IEEE Transactions on Components and Packaging Technologies ◽

10.1109/tcapt.2004.843175 ◽

2005 ◽

Vol 28 (1) ◽

pp. 157-164 ◽

Author(s):

M. Teo ◽

S.G. Mhaisalkar ◽

E.H. Wong ◽

Poi-Siong Teo ◽

C.C. Wong ◽

...

Keyword(s):

Material Properties ◽

Flip Chip ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Reliability Performance

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Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis ◽

10.1109/hdp.2005.251389 ◽

2005 ◽

Author(s):

Zhaonian Cheng ◽

Liqiang Cao ◽

Peng Sun ◽

Johan Liu

Keyword(s):

Residual Stress ◽

Flip Chip ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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A general weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology

4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. ◽

10.1109/polytr.2004.1402760 ◽

2005 ◽

Author(s):

Johao Liu ◽

Liqiang Cao ◽

Min Xie ◽

Thong-Ngee Goh ◽

Yong Tang

Keyword(s):

Reliability Analysis ◽

Weibull Model ◽

Failure Criteria ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive ◽

Joining Technology

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Development of 3-dimensional memory module using anisotropic conductive adhesive films

Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204) ◽

10.1109/iemte.1998.723054 ◽

2002 ◽

Author(s):

T. Kikkawa ◽

R. Ideda ◽

T. Matsuda ◽

T. Watanabe

Keyword(s):

Conductive Adhesive ◽

Memory Module ◽

3 Dimensional ◽

Anisotropic Conductive Adhesive

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Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

Microelectronic Engineering ◽

10.1016/j.mee.2008.05.038 ◽

2008 ◽

Vol 85 (11) ◽

pp. 2202-2206 ◽

Author(s):

Yong-Sung Eom ◽

Keonsoo Jang ◽

Jong-Tae Moon ◽

Jae-Do Nam ◽

Jong-Min Kim

Keyword(s):

Melting Point ◽

Mechanical Characterization ◽

Conductive Adhesive ◽

Anisotropic Conductive Adhesive

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