Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium
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Published By IEEE

0780320379

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Analysis the slider resonate characteristic in liquid-phase epitaxy manufacturing process

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404733 ◽

2002 ◽

Author(s):

Fang-Lin Chaoi ◽

Yu-Lin Chao

Keyword(s):

Liquid Phase ◽

Liquid Phase Epitaxy ◽

Manufacturing Process

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Benchmarking and QFD: accelerating the successful implementation of no clean soldering

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404741 ◽

2002 ◽

Cited By ~ 2

Author(s):

S. Gutierrez ◽

C. Tulkoff

Keyword(s):

Successful Implementation

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On clustering of defects and yield of SMT assemblies

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404688 ◽

2002 ◽

Cited By ~ 1

Author(s):

M.M.V. Tegethoff ◽

T.W. Chen

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Rapid prototyping using laser created interconnects

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404737 ◽

2002 ◽

Cited By ~ 1

Author(s):

R. Lee ◽

W. Moreno ◽

N. Saini

Keyword(s):

Rapid Prototyping

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Trends of marketing and technology in TFT-LCD

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404738 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Morimoto

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Sequential experiments to characterize processing equipment-maximizing information content while restraining costs

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404665 ◽

2002 ◽

Author(s):

J.E. Reece

Keyword(s):

Information Content ◽

Processing Equipment ◽

Sequential Experiments

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Intelligent enhancements for conventional layout systems to support the design of printed circuit boards

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404719 ◽

2002 ◽

Author(s):

K. Feldmann ◽

M. Koch ◽

A. Rothhaupt

Keyword(s):

Printed Circuit Boards ◽

Circuit Boards ◽

Printed Circuit

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Low temperature plasma deposition of silicon nitride to produce ultra-reliable, high performance, low cost Sealed Chip-on-Board (SCOB) assemblies

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404718 ◽

2002 ◽

Cited By ~ 2

Author(s):

R.M. Kubacki

Keyword(s):

Silicon Nitride ◽

Low Temperature ◽

High Performance ◽

Plasma Deposition ◽

Low Cost ◽

Low Temperature Plasma ◽

Temperature Plasma

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Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404695 ◽

2002 ◽

Cited By ~ 13

Author(s):

D. Shangguan ◽

A. Achari

Keyword(s):

Electronics Packaging ◽

Lead Free ◽

Automotive Electronics

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Rapid prototyping of application-specific signal processors (RASSP) through the use of concurrent engineering CAD tools and frameworks

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium ◽

10.1109/iemt.1994.404721 ◽

2002 ◽

Author(s):

J.J. Welsh ◽

J.E. Saultz ◽

M.A. Richards ◽

R. Reitmeyer

Keyword(s):

Rapid Prototyping ◽

Concurrent Engineering ◽

Cad Tools ◽

Specific Signal ◽

Signal Processors ◽

Application Specific

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Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Analysis the slider resonate characteristic in liquid-phase epitaxy manufacturing process

Benchmarking and QFD: accelerating the successful implementation of no clean soldering

On clustering of defects and yield of SMT assemblies

Rapid prototyping using laser created interconnects

Trends of marketing and technology in TFT-LCD

Sequential experiments to characterize processing equipment-maximizing information content while restraining costs

Intelligent enhancements for conventional layout systems to support the design of printed circuit boards

Low temperature plasma deposition of silicon nitride to produce ultra-reliable, high performance, low cost Sealed Chip-on-Board (SCOB) assemblies

Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications

Rapid prototyping of application-specific signal processors (RASSP) through the use of concurrent engineering CAD tools and frameworks

Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium
Latest Publications