Study of optical and luminescent properties of the epitaxial garnet films doped with Ce3+

Ce-doped (Pb, Gd)3(Al, Ga)5O12 and Ce-doped (Bi, Gd)3(Al, Ga)5O12 single crystalline garnet films were grown using liquid-phase epitaxy method from supercooled PbO–B2O3- and Bi2O3–B2O3-based melt solutions on substrates from Gd3Ga5O12, Gd3(Al, Ga)5O12 and Y3Ga5O12 single crystals. Optical absorption, photo- and cathodoluminescent and scintillation properties of the films were studied. Ce-doped (Pb,Gd)3(Al, Ga)5O12 and Ce-doped (Bi, Gd)3(Al, Ga)5O12 garnet films can be used as a fast phosphor and scintillation screens.

DEPOSITION OF Al/SnAl OHMIC CONTACT ON SILICON FROM A LIQUID PHASE

Background. Single- and multi-layer metal films are widely utilized in modern electronics and optoelectronics as ohmic contacts. As a rule, the films are deposited by thermal evaporation, ion sputtering and chemical vapour deposition. However the methods of deposition from a liquid phase are the most simple and cost-effective. Thus the ohmic contact deposition by these methods is still an actual problem. Objective. The purpose of the paper is to study the possibility of deposition of multi-layer ohmic metal films over a semiconductor wafer surface from a liquid phase, particularly by scanning liquid phase epitaxy technique. Methods. In this work we considered the influence of a long-term temperature gradient at the interface metallic solution-melt – semiconductor wafer on the possibility of deposition of multi-layer ohmic metal films on the semiconductor wafer surface during segmental contact between the solution-melt and the wafer. For this purpose we carried out the simulation of heat transport process, wafer wetting process as well as the process of wafer cleansing off the solution-melt taking into account capillary phenomena in the mask openings using the method of scanning liquid phase epitaxy. For experimental confirmation of adequacy of the model proposed we carried out the deposition of Al/SnAl layer on silicon wafer in the above mentioned conditions. Results. We have deposited the contact layer Al/SnAl on the surface of silicon wafer from Al-Sn solution-melt by scanning liquid phase epitaxy technique using supplementary heater for the wafer and mask installed in the apparatus. The contact layer is made as three identical pads located at different distance one from each other. By the analysis of current-voltage characteristic we determined that the metallic film contact with the semiconductor is a non-rectifying, i.e. ohmic contact. The specific contact resistance was determined by the Transmission Line Method using linear configuration of the contact pads (LTLM). Its value was 7.2∙10-4 Ohm·cm2. Conclusions. The principal possibility of obtaining of multi-layer ohmic contacts to the semiconductor by scanning liquid phase epitaxy technique in conditions of segmental contact between the solution-melt and the wafer as well as long-term gradient at the contact interface was shown. The conditions were realized by using extra heating of the wafer back side and the high-temperature mask through which the solution-melt contacted the wafer.

Technological features of the method of liquid-phase epitaxy when growing InP/GaInAsP heterostructures

Semiconductor devices of quantum electronics based on InP/GaInAsP heterostructures require the creation of non-defective chips for emitting devices and photodetectors. The production of such chips is impossible without a thorough technological study of the growth processes of epitaxial structures. One of the important problems in relation to the growth of such structures is the growth defects associated with the process of dissociation of indium phosphide on the surface during their growth. The aim of the work was the investigation of the process and mechanism of destruction (dissociation) of the surface of indium phosphide substrates in the range of growth temperatures of structures, as well as the study of methods andtechniques that allow minimize the process of dissociation of surface of indium phosphide.The work provides studies of the growth processes of InP/GaInAsP heterostructures, from the liquid phase, taking into account the degradation processes of the growth surface and the mechanisms for the formation of dissociation defects.The schemes of the dissociation process of the InP on the surface of the substrate and the formation of the defective surface of the substrate were analysed. At the same time, technological methods allowing to minimize the dissociation of the surface compound during the process of liquid-phase epitaxy were shown. The original design of a graphite cassette allowing to minimize the dissociation of the indium phosphide substrate in the process of liquid-phase epitaxy was proposed

Growing epitaxial layers of InP/InGaAsP heterostructures on the profiled InP surfaces by liquid-phase epitaxy

The effect of various planes was studied when growing epitaxial layers by liquid-phase epitaxy (LPE) on the profiled InP substrates. The studies allowed obtaining buried heterostructures in the InP/InGaAsP system and creating highly efficient laser diodes and image sensors.It was found that protruding mesa strips or in-depth mesa strips in the form of channels formed by the {111}А, {111}B, {110}, {112}A, or {221}A family of planes can be obtained with the corresponding selection of an etching agent, strip orientation, and a method of obtaining a masking coating. It was noted that in the case of the polarity of axes being in the direction of <111>, the cut of mesa strips was conducted along the most densely packaged planes. This cut led to the difference in rates of both chemical etching and epitaxial burying of profiled surfaces.The cut was made along the planes at a low dissolution rate {111}A for a sphalerite lattice, to which the studied material, indium phosphide, belongs. Analysis of planes {110} and {Ī10} showed that the location of the most densely packaged planes {111}A and {111}B relative to them is different.