Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
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Integration of low-k spin-on polymer and Cu for Damascene

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854288 ◽

2005 ◽

Cited By ~ 1

Author(s):

W. Chang ◽

W.C. Chiou ◽

L.J. Li ◽

L.C. Chao ◽

S.M. Jang ◽

...

Keyword(s):

Low K

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Preliminary study on dependency of basic properties of porous silica ILD thin film on CMP compatibility

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854283 ◽

2005 ◽

Author(s):

H. Hanahata ◽

M. Miyamoto ◽

T. Kamata ◽

S. Matsuno ◽

T. Tanabe

Keyword(s):

Thin Film ◽

Porous Silica ◽

Basic Properties ◽

Preliminary Study

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Physical modeling of rinsing and cleaning of submicron trenches

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854278 ◽

2002 ◽

Author(s):

Hong Lin ◽

A.A. Busnaina ◽

I.I. Suni

Keyword(s):

Physical Modeling

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Single mask metal-insulator-metal (MIM) capacitor with copper damascene metallization for sub-0.18 μm mixed mode signal and system-on-a-chip (SoC) applications

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854297 ◽

2002 ◽

Author(s):

Ruichen Liu ◽

Cheng-Yih Lin ◽

E. Harris ◽

S. Merchant ◽

S.W. Downey ◽

...

Keyword(s):

Mixed Mode ◽

Metal Insulator ◽

Metal Insulator Metal ◽

System On A Chip

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Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854339 ◽

2002 ◽

Cited By ~ 1

Author(s):

D. Louis ◽

A. Beverina ◽

C. Arvet ◽

E. Lajoinie ◽

C. Peyne ◽

...

Keyword(s):

State Of The Art ◽

Cleaning Process ◽

Low K ◽

Copper State

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Characterization and integration of porous extra low-k (XLK) dielectrics

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854294 ◽

2002 ◽

Cited By ~ 1

Author(s):

Changming Jin ◽

J. Wetzel

Keyword(s):

Low K

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A copper drift-model for the low-κ polymer DVS-BCB

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854328 ◽

2002 ◽

Author(s):

T. Hoernig ◽

K. Melzer ◽

U. Schubert ◽

H. Geisler ◽

J.W. Barthar

Keyword(s):

Drift Model

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New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854286 ◽

2002 ◽

Author(s):

P. Gayet ◽

C. Lair ◽

E. van den Vegt

Keyword(s):

New Method ◽

Dual Damascene ◽

Low K

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Plasma treatment after interconnect metal etch for recovery of plasma charge-induced damages

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854307 ◽

2002 ◽

Author(s):

Shin Seung Park ◽

Chang Ju Choi ◽

Jin Woong Kim ◽

Jeong Mo Hwang

Keyword(s):

Plasma Treatment

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Copper-SiOC-AirGap integration in a double level metal interconnect

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) ◽

10.1109/iitc.2000.854347 ◽

2002 ◽

Cited By ~ 2

Author(s):

O. Demolliens ◽

Y. Morand ◽

M. Fayolle ◽

M. Cochet ◽

M. Assous ◽

...

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Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Integration of low-k spin-on polymer and Cu for Damascene

Preliminary study on dependency of basic properties of porous silica ILD thin film on CMP compatibility

Physical modeling of rinsing and cleaning of submicron trenches

Single mask metal-insulator-metal (MIM) capacitor with copper damascene metallization for sub-0.18 μm mixed mode signal and system-on-a-chip (SoC) applications

Cleaning process strategies compatible with low-k dielectric and copper: state of the art, evolution and perspectives

Characterization and integration of porous extra low-k (XLK) dielectrics

A copper drift-model for the low-κ polymer DVS-BCB

New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

Plasma treatment after interconnect metal etch for recovery of plasma charge-induced damages

Copper-SiOC-AirGap integration in a double level metal interconnect

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)
Latest Publications