Empirical Modeling of the Time-Dependent Structural Build-Up of Lead-Free Solder Pastes Used in the Electronics Assembly Applications

2011 ◽  
pp. 168-168-18
Author(s):  
S. Mallik ◽  
N. N. Ekere ◽  
R. Bhatti
Keyword(s):  
Empirical Modeling ◽  
Time Dependent ◽  
Lead Free ◽  
Lead Free Solder ◽  
Electronics Assembly ◽  
Solder Pastes ◽  
Free Solder

Evaluating print performance of Sn-Ag-Cu lead-free solder pastes used in electronics assembly process

2011 ◽  
Author(s):  
S. Mallik ◽  
R. Bauer ◽  
F. Hübner ◽  
N. N. Ekere ◽  
Francisco Chinesta ◽  
...  
Keyword(s):  
Lead Free ◽  
Lead Free Solder ◽  
Assembly Process ◽  
Electronics Assembly ◽  
Solder Pastes ◽  
Free Solder

Structural Assessment of Lead Free Solder Joint of Miniaturized Electronics Assembly

2018 ◽  
Vol 10 (5) ◽  
Author(s):  
Zuraihana Bachok ◽  
◽  
Abdullah Aziz Saad ◽  
Fakhrozi Che Ani ◽  
Azman Jalar ◽  
...  
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Electronics Assembly ◽  
Structural Assessment ◽  
Free Solder

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

2007 ◽  
Vol 4 (3) ◽  
pp. 112-120 ◽  
Author(s):  
John Lau ◽  
Todd Castello ◽  
Dongkai Shangguan ◽  
Walter Dauksher ◽  
Joe Smetana ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Surface Finish ◽  
Failure Modes ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Organic Solderability Preservative ◽  
Solder Pastes ◽  
Free Solder

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling.

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