The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders

2011 ◽  
pp. 89-89-32
Author(s):  
Konstantina Lambrinou ◽  
Werner Engelmaier
Keyword(s):  
Lead Free ◽  
Brittle Transition ◽  
Microstructural Aspect ◽  
Ductile To Brittle Transition ◽  
Lead Free Solders

The Microstructural Aspect of the Ductile-to-Brittle Transition of Tin-Based Lead-Free Solders

2010 ◽  
Vol 7 (7) ◽  
pp. 103064 ◽  
Author(s):  
Konstantina Lambrinou ◽  
Werner Engelmaier ◽  
N. Prabhu ◽  
S. W. Dean
Keyword(s):  
Lead Free ◽  
Brittle Transition ◽  
Microstructural Aspect ◽  
Ductile To Brittle Transition ◽  
Lead Free Solders

Electromigration induced ductile-to-brittle transition in lead-free solder joints

2006 ◽  
Vol 89 (14) ◽  
pp. 141914 ◽  
Author(s):  
Fei Ren ◽  
Jae-Woong Nah ◽  
K. N. Tu ◽  
Bingshou Xiong ◽  
Luhua Xu ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Brittle Transition ◽  
Ductile To Brittle Transition ◽  
Free Solder

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9zn Lead-Free Solders Al-Loy

Materials ◽  
2021 ◽  
Vol 14 (10) ◽  
pp. 2549
Author(s):  
Wenchao Yang ◽  
Jun Mao ◽  
Yueyuan Ma ◽  
Shuyuan Yu ◽  
Hongping He ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Microstructure Evolution ◽  
Electrochemical Corrosion ◽  
Lead Free ◽  
Nacl Solution ◽  
Rich Phase ◽  
Yttrium Addition ◽  
Electrochemical Corrosion Behavior ◽  
Lead Free Solders ◽  
Addition Amount

Electrochemical corrosion behavior of ternary tin-zinc-yttrium (Sn-9Zn-xY) solder alloys were investigated in aerated 3.5 wt.% NaCl solution using potentiodynamic polarization techniques, and the microstructure evolution was obtained by scanning electron microscope (SEM). Eight different compositions of Sn-9Zn-xY (x = 0, 0.02, 0.04, 0.06, 0.08, 0.10, 0.20, and 0.30 wt.%) were compared by melting. The experimental results show that when the content of Y reached 0.06 wt.%, the grain size of Zn-rich phase became the smallest and the effect of grain refinement was the best, but there was no significant effect on the melting point. With the increases of Y content, the spreading ratio first increased and then decreased. When the content of Y was 0.06 wt.%, the Sn-9Zn-0.06Y solder alloy had the best wettability on the Cu substrate, which was increased by approximately 20% compared with Sn-9Zn. Besides, the electrochemical corrosion experimental shows that the Y can improve the corrosion resistance of Sn-9Zn system in 3.5 wt.% NaCl solution, and the corrosion resistance of the alloy is better when the amount of Y added is larger within 0.02–0.30 wt.%. Overall considering all performances, the optimal performance can be obtained when the addition amount of Y is 0.06.

scholarly journals The nucleation of the Izmit and Düzce earthquakes: Some mechanical logic on where and how ruptures began

2021 ◽  
Author(s):  
Michel Bouchon ◽  
Hayrullah Karabulut ◽  
Mustafa Aktar ◽  
Serdar Özalaybey ◽  
Jean Schmittbuhl ◽  
...  
Keyword(s):  
Strike Slip ◽  
Seismic Events ◽  
Fault Geometry ◽  
Brittle Transition ◽  
The North ◽  
Impending Rupture ◽  
Natural Tendency ◽  
Ductile To Brittle Transition ◽  
Mechanical Logic ◽  
Rupture Speed

Summary In spite of growing evidence that many earthquakes are preceded by increased seismic activity, the nature of this activity is still poorly understood. Is it the result of a mostly random process related to the natural tendency of seismic events to cluster in time and space, in which case there is little hope to ever predict earthquakes? Or is it the sign that a physical process that will lead to the impending rupture has begun, in which case we should attempt to identify this process. With this aim we take a further look at the nucleation of two of the best recorded and documented strike-slip earthquakes to date, the 1999 Izmit and Düzce earthquakes which ruptured the North Anatolian Fault over ∼200 km. We show the existence of a remarkable mechanical logic linking together nucleation characteristics, stress loading, fault geometry and rupture speed. In both earthquakes the observations point to slow aseismic slip occurring near the ductile-to-brittle transition zone as the motor of their nucleation.

scholarly journals Probing the Statistical Validity of the Ductile-to-Brittle Transition in Metallic Nanowires Using GPU Computing

2013 ◽  
Vol 9 (12) ◽  
pp. 5558-5566 ◽  
Author(s):  
William R. French ◽  
Amulya K. Pervaje ◽  
Andrew P. Santos ◽  
Christopher R. Iacovella ◽  
Peter T. Cummings
Keyword(s):  
Gpu Computing ◽  
Metallic Nanowires ◽  
Brittle Transition ◽  
Statistical Validity ◽  
Ductile To Brittle Transition
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