Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
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2007 ◽
Vol 47
(2-3)
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pp. 215-222
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1989 ◽
Vol 111
(4)
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pp. 255-260
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2010 ◽
Vol 8
(3)
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pp. 267-285
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2014 ◽