Proceedings Electronic Components and Technology, 2005. ECTC '05.
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150 μm Pitch Pb-Free Flipchip Packaging with Cu/Low-k Interconnects

2005 ◽  
Author(s):  
Seung Wook Yoon ◽  
V. Kripesh ◽  
A. Viswanath ◽  
Hong Yu Li ◽  
M.K. Iyer
Keyword(s):  
Low K

DC-34.1 Gbps Single Mode Parallel Optical Interconnecting Module with Low Height MT Receptacle Connector for 10 Tbps

2005 ◽  
Author(s):  
Toshiyuki Okayasu ◽  
Yusuke Hayase ◽  
Atsushi Ono ◽  
Daisuke Watanabe ◽  
Takehiro Shirai ◽  
...  
Keyword(s):  
Single Mode

Drop Impact: Fundamentals and Impact Characterisation of Solder Joints

2005 ◽  
Author(s):  
E.H. Wong ◽  
R. Rajoo ◽  
Y.W. Mai ◽  
S.K.W. Seah ◽  
K.T. Tsai ◽  
...  
Keyword(s):  
Solder Joints ◽  
Drop Impact
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