2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

Nonlinear mechanical springs for counteracting nonlinearities in gap-closing electrostatic actuators

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103156 ◽

2015 ◽

Author(s):

Ben Rivlin ◽

Shai Shmulevich ◽

Aharon Joffe ◽

David Elata

Keyword(s):

Electrostatic Actuators ◽

Nonlinear Mechanical ◽

Gap Closing

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Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103155 ◽

2015 ◽

Author(s):

S. Mukherjee ◽

B. Zhou ◽

A. Dasgupta ◽

T.R. Bieler

Keyword(s):

Single Crystal ◽

Multiscale Modeling ◽

Transient Creep ◽

Creep Response

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New simulation method for Deep Trench Termination diode (DT2) using mixed-mode TCAD sentaurus

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103122 ◽

2015 ◽

Author(s):

F. Baccar ◽

H. Arbess ◽

L. Theolier ◽

S. Azzopardi ◽

E. Woirgard

Keyword(s):

Mixed Mode ◽

Simulation Method ◽

Deep Trench ◽

Tcad Sentaurus

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Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103080 ◽

2015 ◽

Cited By ~ 4

Author(s):

A. Sasi ◽

A. Yadur ◽

P. Gromala

Keyword(s):

Integrated Circuits ◽

Selection Of

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Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103078 ◽

2015 ◽

Cited By ~ 2

Author(s):

B. Ozturk ◽

P. Lou ◽

P. Gromala ◽

C. Silber ◽

K.M.B. Jansen ◽

...

Keyword(s):

Interface Strength ◽

Automotive Applications ◽

Adhesive Interface

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CFD simulations of wave soldering on through-hole printed circuit assemblies

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103125 ◽

2015 ◽

Cited By ~ 1

Author(s):

A. Yuile ◽

S. Wiese

Keyword(s):

Cfd Simulations ◽

Printed Circuit ◽

Wave Soldering ◽

Through Hole

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Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103137 ◽

2015 ◽

Author(s):

M. Lederer ◽

A. Lassnig ◽

G. Khatibi ◽

M. Delshadmanesh

Keyword(s):

Mechanical Testing ◽

Reliability Assessment ◽

Ball Bonds

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Analytical, numerical and experimental approach to thermal analysis and design of a travelling wave tube

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103098 ◽

2015 ◽

Cited By ~ 2

Author(s):

W. Wiejak ◽

A. Wymyslowski

Keyword(s):

Thermal Analysis ◽

Experimental Approach ◽

Travelling Wave ◽

Wave Tube ◽

Analysis And Design

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Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103119 ◽

2015 ◽

Cited By ~ 2

Author(s):

Steffen Hartmann ◽

Alexey Shaporin ◽

Sascha Hermann ◽

Jens Bonitz ◽

Marc Heggen ◽

...

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulations ◽

Sensor Applications ◽

In Situ Experiments ◽

Metal Interfaces ◽

Dynamics Simulations

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Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ◽

10.1109/eurosime.2015.7103150 ◽

2015 ◽

Cited By ~ 2

Author(s):

Uwe Zschenderlein ◽

Karthik Suresh ◽

Mario Baum ◽

Bernhard Wunderle

Keyword(s):

Mechanical Characterization ◽

Bending Tests

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2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Nonlinear mechanical springs for counteracting nonlinearities in gap-closing electrostatic actuators

Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal

New simulation method for Deep Trench Termination diode (DT2) using mixed-mode TCAD sentaurus

Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE

Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

CFD simulations of wave soldering on through-hole printed circuit assemblies

Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing

Analytical, numerical and experimental approach to thermal analysis and design of a travelling wave tube

Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics

Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests

Export Citation Format

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and MicrosystemsLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Nonlinear mechanical springs for counteracting nonlinearities in gap-closing electrostatic actuators

Multiscale modeling of the anisotropic transient creep response of heterogeneous SAC single crystal

New simulation method for Deep Trench Termination diode (DT2) using mixed-mode TCAD sentaurus

Simulation driven design of novel integrated circuits - Part 1: Selection of the materials based on the Virtual DoE

Characterization and simulation of LTCC/adhesive and alloy 42/adhesive interface strength for automotive applications

CFD simulations of wave soldering on through-hole printed circuit assemblies

Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing

Analytical, numerical and experimental approach to thermal analysis and design of a travelling wave tube

Towards nanoreliability of CNT-based sensor applications: Investigations of CNT-metal interfaces combining molecular dynamics simulations, advanced in situ experiments and analytics

Mechanical characterization of sintered nanoparticles for advanced electrical and thermal joints: σ-ε-transformation in micro bending tests

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Latest Publications