Radiation crosslinking of linear polyethyleneimine‐based nanoparticles grafted to poly(glycidyl methacrylate) via trimethylolpropane triacrylate as potential electronic packaging material

2021 ◽  
Vol 138 (21) ◽  
pp. 50470
Author(s):  
Saber Ibrahim ◽  
Salah Lotfy
Keyword(s):  
Electronic Packaging ◽  
Glycidyl Methacrylate ◽  
Packaging Material ◽  
Trimethylolpropane Triacrylate ◽  
Radiation Crosslinking ◽  
Electronic Packaging Material

Characterizing the temperature dependence of electronic packaging-material properties

JOM ◽  
1995 ◽  
Vol 47 (6) ◽  
pp. 31-35 ◽  
Author(s):  
Chia-Yu Fu ◽  
Charles Ume
Keyword(s):  
Temperature Dependence ◽  
Material Properties ◽  
Electronic Packaging ◽  
Packaging Material ◽  
Electronic Packaging Material

Study on Preparation of SiC Preform for Electronic Packaging Material

2020 ◽  
Author(s):  
Mengqin Chen ◽  
Yuelong Bai ◽  
Zhifeng Zhang ◽  
Hansen Zheng ◽  
Zhuoran Zhang
Keyword(s):  
Electronic Packaging ◽  
Packaging Material ◽  
Electronic Packaging Material

Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material

2008 ◽  
Vol 202 (12) ◽  
pp. 2540-2544 ◽  
Author(s):  
H.F. Zhao ◽  
W.Z. Tang ◽  
C.M. Li ◽  
G.C. Chen ◽  
F.X. Lu ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Packaging Material ◽  
Al Composite ◽  
Electronic Packaging Material ◽  
Conductive Properties

Rice husk agricultural waste-derived low ionic content carbon–silica nanocomposite for green reinforced epoxy resin electronic packaging material

2017 ◽  
Vol 78 ◽  
pp. 493-499 ◽  
Author(s):  
Ya-Yu Hsieh ◽  
Yun-Chih Tsai ◽  
Jia-Rung He ◽  
Ping-Feng Yang ◽  
Hong-Ping Lin ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Rice Husk ◽  
Electronic Packaging ◽  
Agricultural Waste ◽  
Packaging Material ◽  
Ionic Content ◽  
Electronic Packaging Material ◽  
Silica Nanocomposite

Research Progress of Diamond/Al Composites

2013 ◽  
Vol 873 ◽  
pp. 379-383
Author(s):  
Yong Zheng Liu
Keyword(s):  
Composite Materials ◽  
Physical Properties ◽  
Electronic Packaging ◽  
Packaging Material ◽  
Research Progress ◽  
Packaging Materials ◽  
Al Composite ◽  
Materials Research ◽  
Electronic Packaging Material ◽  
New Generation

Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. The paper on the diamond/Al composite materials research at home and abroad was summarized in detail.

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