Study on Preparation of SiC Preform for Electronic Packaging Material

2020 ◽  
Author(s):  
Mengqin Chen ◽  
Yuelong Bai ◽  
Zhifeng Zhang ◽  
Hansen Zheng ◽  
Zhuoran Zhang
Keyword(s):  
Electronic Packaging ◽  
Packaging Material ◽  
Electronic Packaging Material

Research Progress of Diamond/Al Composites

2013 ◽  
Vol 873 ◽  
pp. 379-383
Author(s):  
Yong Zheng Liu
Keyword(s):  
Composite Materials ◽  
Physical Properties ◽  
Electronic Packaging ◽  
Packaging Material ◽  
Research Progress ◽  
Packaging Materials ◽  
Al Composite ◽  
Materials Research ◽  
Electronic Packaging Material ◽  
New Generation

Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. The paper on the diamond/Al composite materials research at home and abroad was summarized in detail.

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