Research Progress of Diamond/Al Composites

2013 ◽  
Vol 873 ◽  
pp. 379-383
Author(s):  
Yong Zheng Liu
Keyword(s):  
Composite Materials ◽  
Physical Properties ◽  
Electronic Packaging ◽  
Packaging Material ◽  
Research Progress ◽  
Packaging Materials ◽  
Al Composite ◽  
Materials Research ◽  
Electronic Packaging Material ◽  
New Generation

Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. The paper on the diamond/Al composite materials research at home and abroad was summarized in detail.

Microstructure and Thermal Physical Properties of a β­SiCp/Al Composite for Electronic Packaging Produced by Powder Metallurgy

2017 ◽  
Vol 727 ◽  
pp. 565-570
Author(s):  
Yan Yan Shi ◽  
Xiao Gang Wang ◽  
Jun Tao Liu
Keyword(s):  
Physical Properties ◽  
Electronic Packaging ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Weight Ratio ◽  
Pressing Method ◽  
Al Composite ◽  
The Relationship ◽  
Thermal Physical Properties ◽  
Sic Particle

The fabrication and thermal physical properties contain thermal conductivity (TC) and coefficient of thermal expansion (CTE) using 40%、50%、60% vol% β-SiC particle reinforced Al composite for electronic packaging respectively have been analyzed. The composites were produced by ball milling and pressing method. The composite which fabricated by tri-sized β-SiC particle with a weight ratio of 17:7:1,vol% of 50% and 60%.The dense and morphology were investigated. The relationship between volume fraction of β-SiC particle and thermal physical properties was discussed. Changed the volume fraction of β-SiC particle will led to a decreasing or increasing of TC and CTE. It found that values of TC and CTE were achieved their maximum balance when using tri-sized β-SiC particle of 160μm ,125μm as well as 38μm with a weight ratio of 17:7:1 and 50%vol of β-SiC particle reinforcing.

Research Progress on Preparation of SiC/Al for Electronic Packaging by Liquid Infiltration

2021 ◽  
Vol 1035 ◽  
pp. 906-917
Author(s):  
Meng Qin Chen ◽  
Yue Long Bai ◽  
Zhi Feng Zhang
Keyword(s):  
Electronic Packaging ◽  
Volume Fraction ◽  
High Volume ◽  
Development Trend ◽  
Research Progress ◽  
Preparation Methods ◽  
Advantages And Disadvantages ◽  
Liquid Infiltration ◽  
Al Composite ◽  
The Development Trend

High volume fraction SiC/Al composite material, with its excellent thermal properties and flexible preparation process, has been widely used in the field of electronic packaging. In the paprer, the development of SiC/Al materials for electronic packaging and their preparation methods are reviewed. The preparation processes for preparing SiC/Al by liquid infiltration are mainly introduced. The advantages and disadvantages of several important processes are analyzed. Finally, the development trend of SiC/Al for electronic packaging prepared by liquid infiltration is prospected.

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