Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material

2008 ◽  
Vol 202 (12) ◽  
pp. 2540-2544 ◽  
Author(s):  
H.F. Zhao ◽  
W.Z. Tang ◽  
C.M. Li ◽  
G.C. Chen ◽  
F.X. Lu ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Packaging Material ◽  
Al Composite ◽  
Electronic Packaging Material ◽  
Conductive Properties

Research Progress of Diamond/Al Composites

2013 ◽  
Vol 873 ◽  
pp. 379-383
Author(s):  
Yong Zheng Liu
Keyword(s):  
Composite Materials ◽  
Physical Properties ◽  
Electronic Packaging ◽  
Packaging Material ◽  
Research Progress ◽  
Packaging Materials ◽  
Al Composite ◽  
Materials Research ◽  
Electronic Packaging Material ◽  
New Generation

Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. The paper on the diamond/Al composite materials research at home and abroad was summarized in detail.

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