Characterizing the temperature dependence of electronic packaging-material properties

Chia-Yu Fu; Charles Ume

doi:10.1007/bf03221201

Characterizing the temperature dependence of electronic packaging-material properties

JOM ◽

10.1007/bf03221201 ◽

1995 ◽

Vol 47 (6) ◽

pp. 31-35 ◽

Cited By ~ 9

Author(s):

Chia-Yu Fu ◽

Charles Ume

Keyword(s):

Temperature Dependence ◽

Material Properties ◽

Electronic Packaging ◽

Packaging Material ◽

Electronic Packaging Material

Rice Husk-derived Hierarchical Micro/Mesoporous Carbon-Silica Nanocomposite as Superior Filler for Green Electronic Packaging Material

Journal of the Chinese Chemical Society ◽

10.1002/jccs.201600827 ◽

2017 ◽

Vol 64 (4) ◽

pp. 427-433 ◽

Cited By ~ 6

Author(s):

Ya-Yu Hsieh ◽

Yun-Chih Tsai ◽

Hong-Ping Lin ◽

Chun-Han Hsu

Keyword(s):

Rice Husk ◽

Electronic Packaging ◽

Mesoporous Carbon ◽

Packaging Material ◽

Electronic Packaging Material ◽

Silica Nanocomposite

Kinetics study of thermal decomposition of electronic packaging material

Chemical Engineering Journal ◽

10.1016/s1385-8947(03)00181-5 ◽

2004 ◽

Vol 98 (1-2) ◽

pp. 39-51 ◽

Cited By ~ 39

Author(s):

Tzong-Horng Liou

Keyword(s):

Thermal Decomposition ◽

Electronic Packaging ◽

Packaging Material ◽

Kinetics Study ◽

Electronic Packaging Material

Fabrication of SiCp/Cu–Al electronic packaging material by pressureless infiltration method

Materials Science and Technology ◽

10.1179/1743284712y.0000000152 ◽

2013 ◽

Vol 29 (3) ◽

pp. 326-331 ◽

Cited By ~ 3

Author(s):

L Yang ◽

M Zhang

Keyword(s):

Electronic Packaging ◽

Packaging Material ◽

Pressureless Infiltration ◽

Electronic Packaging Material ◽

Infiltration Method

Demonstration of TC1050, encapsulated TPG graphite, as an electronic packaging material

10.1117/12.259837 ◽

1996 ◽

Author(s):

Mark J. Montesano

Keyword(s):

Electronic Packaging ◽

Packaging Material ◽

Electronic Packaging Material

Study on Preparation of SiC Preform for Electronic Packaging Material

2020 21st International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept50128.2020.9202555 ◽

2020 ◽

Author(s):

Mengqin Chen ◽

Yuelong Bai ◽

Zhifeng Zhang ◽

Hansen Zheng ◽

Zhuoran Zhang

Keyword(s):

Electronic Packaging ◽

Packaging Material ◽

Electronic Packaging Material

Pyrolysis kinetics of electronic packaging material in a nitrogen atmosphere

Journal of Hazardous Materials ◽

10.1016/s0304-3894(03)00244-9 ◽

2003 ◽

Vol 103 (1-2) ◽

pp. 107-123 ◽

Cited By ~ 21

Author(s):

Tzong-Horng Liou

Keyword(s):

Electronic Packaging ◽

Nitrogen Atmosphere ◽

Packaging Material ◽

Pyrolysis Kinetics ◽

Electronic Packaging Material ◽

Kinetics Of

Thermal conductive properties of Ni–P electroless plated SiCp/Al composite electronic packaging material

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2007.09.019 ◽

2008 ◽

Vol 202 (12) ◽

pp. 2540-2544 ◽

Cited By ~ 20

Author(s):

H.F. Zhao ◽

W.Z. Tang ◽

C.M. Li ◽

G.C. Chen ◽

F.X. Lu ◽

...

Keyword(s):

Electronic Packaging ◽

Packaging Material ◽

Al Composite ◽

Electronic Packaging Material ◽

Conductive Properties

Radiation crosslinking of linear polyethyleneimine‐based nanoparticles grafted to poly(glycidyl methacrylate) via trimethylolpropane triacrylate as potential electronic packaging material

Journal of Applied Polymer Science ◽

10.1002/app.50470 ◽

2021 ◽

Vol 138 (21) ◽

pp. 50470

Author(s):

Saber Ibrahim ◽

Salah Lotfy

Keyword(s):

Electronic Packaging ◽

Glycidyl Methacrylate ◽

Packaging Material ◽

Trimethylolpropane Triacrylate ◽

Radiation Crosslinking ◽

Electronic Packaging Material

Rice husk agricultural waste-derived low ionic content carbon–silica nanocomposite for green reinforced epoxy resin electronic packaging material

Journal of the Taiwan Institute of Chemical Engineers ◽

10.1016/j.jtice.2017.06.010 ◽

2017 ◽

Vol 78 ◽

pp. 493-499 ◽

Cited By ~ 9

Author(s):

Ya-Yu Hsieh ◽

Yun-Chih Tsai ◽

Jia-Rung He ◽

Ping-Feng Yang ◽

Hong-Ping Lin ◽

...

Keyword(s):

Epoxy Resin ◽

Rice Husk ◽

Electronic Packaging ◽

Agricultural Waste ◽

Packaging Material ◽

Ionic Content ◽

Electronic Packaging Material ◽

Silica Nanocomposite

Research Progress of Diamond/Al Composites

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.873.379 ◽

2013 ◽

Vol 873 ◽

pp. 379-383

Author(s):

Yong Zheng Liu

Keyword(s):

Composite Materials ◽

Physical Properties ◽

Electronic Packaging ◽

Packaging Material ◽

Research Progress ◽

Packaging Materials ◽

Al Composite ◽

Materials Research ◽

Electronic Packaging Material ◽

New Generation

Due to the good physical properties of diamond, diamond/Al composites as a new generation electronic packaging material receive more and more attention. It is one of the greatest potential for the development of packaging materials. The paper on the diamond/Al composite materials research at home and abroad was summarized in detail.