scholarly journals Front Cover: In Situ Investigation of the Thermal Decomposition of Cl4 (CH3 CN)W(N i Pr) During Simulated Chemical Vapor Deposition (Eur. J. Inorg. Chem. 32/2019)

2019 ◽  
Vol 2019 (32) ◽  
pp. 3645-3645
Author(s):  
Michelle M. Nolan ◽  
Seo Young Kim ◽  
Arijit Koley ◽  
Tim Anderson ◽  
Lisa McElwee-White
Keyword(s):  
Thermal Decomposition ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Front Cover ◽  
In Situ Investigation

scholarly journals In Situ Investigation of the Thermal Decomposition of Cl4 (CH3 CN)W(N i Pr) During Simulated Chemical Vapor Deposition

2019 ◽  
Vol 2019 (32) ◽  
pp. 3661-3666 ◽  
Author(s):  
Michelle M. Nolan ◽  
Seo Young Kim ◽  
Arijit Koley ◽  
Tim Anderson ◽  
Lisa McElwee-White
Keyword(s):  
Thermal Decomposition ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
In Situ Investigation

In Situ Investigation of the Thermal Decomposition of Cl4 (CH3 CN)W(N i Pr) During Simulated Chemical Vapor Deposition

2019 ◽  
Vol 2019 (32) ◽  
pp. 3646-3646
Author(s):  
Michelle M. Nolan ◽  
Seo Young Kim ◽  
Arijit Koley ◽  
Tim Anderson ◽  
Lisa McElwee-White
Keyword(s):  
Thermal Decomposition ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
In Situ Investigation

scholarly journals Real-time in-situ Investigation of III-V Nanowire Growth using Custom-designed Hybrid Chemical Vapor Deposition-TEM

2017 ◽  
Vol 23 (S1) ◽  
pp. 1716-1717 ◽  
Author(s):  
Kimberly Dick Thelander ◽  
L. Reine Wallenberg ◽  
Axel R. Persson ◽  
Marcus Tornberg ◽  
Daniel Jacobsson ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Real Time ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Nanowire Growth ◽  
In Situ Investigation

In situ study of electron beam-induced chemical vapor deposition of Au in an environmental TEM

1995 ◽  
Vol 53 ◽  
pp. 256-257
Author(s):  
J. Drucker ◽  
R. Sharma ◽  
J. Kouvetakis ◽  
K.H.J. Weiss
Keyword(s):  
Electron Beam ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Quantum Effect ◽  
Line Drawing ◽  
Chemical Vapor ◽  
Environmental Cell ◽  
Engineering Changes ◽  
Kinetics Of

Patterning of metals is a key element in the fabrication of integrated microelectronics. For circuit repair and engineering changes constructive lithography, writing techniques, based on electron, ion or photon beam-induced decomposition of precursor molecule and its deposition on top of a structure have gained wide acceptance Recently, scanning probe techniques have been used for line drawing and wire growth of W on a silicon substrate for quantum effect devices. The kinetics of electron beam induced W deposition from WF6 gas has been studied by adsorbing the gas on SiO2 surface and measuring the growth in a TEM for various exposure times. Our environmental cell allows us to control not only electron exposure time but also the gas pressure flow and the temperature. We have studied the growth kinetics of Au Chemical vapor deposition (CVD), in situ, at different temperatures with/without the electron beam on highly clean Si surfaces in an environmental cell fitted inside a TEM column.

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