Effects of metal foam on exergy and entropy of nanofluids in a heat sink applied for thermal management of electronic components

2020 ◽  
Vol 44 (13) ◽  
pp. 10628-10651
Author(s):  
Cong Qi ◽  
Tiantian Chen ◽  
Jianglin Tu ◽  
Yuying Yan
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Metal Foam ◽  
Electronic Components

Thermal management of power electronics with liquid cooled metal foam heat sink

2021 ◽  
Vol 163 ◽  
pp. 106796
Author(s):  
Yongtong Li ◽  
Liang Gong ◽  
Bin Ding ◽  
Minghai Xu ◽  
Yogendra Joshi
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Heat Sink ◽  
Metal Foam

Numerical Study of Cyclic Melting and Solidification of Nano Enhanced Phase Change Material Based Heat Sink in Thermal Management of Electronic Components

2016 ◽  
Author(s):  
S. K. Sahoo ◽  
M. K. Das ◽  
P. Rath
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Management ◽  
Forced Convection ◽  
Heat Sink ◽  
Volume Concentration ◽  
Nano Particles ◽  
Nano Particle ◽  
Electronic Components ◽  
Change Material

The Present investigation has been carried out to study the performance of nano enhanced phase change material (NEPCM) based heat sink for thermal management of electronic components. Enthalpy based finite volume method is used for the analysis of phase change process in NEPCM. To enhance the thermal conductivity of phase change material (PCM), copper oxide nano particles of volume fractions 1%, 2.5% and 5% are added to PCM. A heat flux of 2500 W/m2 is taken as input to the heat sink. The thermal performance of the heat sink with PCM is compared with NEPCM for each volume fraction of nano particle for both finned and unfinned configurations. It is observed that the nano particle volume concentration plays a major role in removing the heat from the chip in case of unfinned heat sink configuration. However, for finned heat sink configuration, the volume concentration effect is not appreciable. In addition, the performance of NEPCM based finned heat sink is studied under cyclic loading in both natural and forced convection boundary conditions. It is observed that under forced convection the solidification time is reduced.

Investigation of Phase Change Material Integrated With High Thermal Conductive Carbon Foam Inside Heat Sinks for Thermal Management of Electronic Components

2021 ◽  
Author(s):  
Anuj Kumar ◽  
Rohit Kothari ◽  
Santosh K. Sahu ◽  
Shailesh I. Kundalwal ◽  
Akhalesh Sharma
Keyword(s):  
Phase Change ◽  
Thermal Management ◽  
Heat Sink ◽  
Phase Change Materials ◽  
Carbon Foam ◽  
Heat Sinks ◽  
Vacuum Impregnation ◽  
Electronic Components ◽  
Impregnation Technique ◽  
Composite Heat

Abstract In recent years phase change materials (PCMs) have emerged as a promising material for various thermal management applications. However, the lower thermal conductivity of PCM is a major hindrance in its widespread use. In the present study, an experimental investigation is carried out using high thermal conductive carbon foam (CF) embedded with PCM inside heat sink for thermal management of electronic components. Various configurations of heat sinks such as unfinned heat sink without PCM, unfinned heat sink integrated with PCM, unfinned heat sink integrated with CF-PCM composite, two finned heat sink integrated with PCM, and two finned heat sink integrated with CF-PCM composite are investigated. The vacuum impregnation technique is employed to infiltrate the PCM inside the CF. Heat flux is varied in the range of 1.5 to 2.5 kW/m2. Temperature variation of the heat sink base is used to compare the performance of various heat sinks. Unfinned heat sink without and with PCM is used for baseline comparison. Enhancement ratios are presented for various set point temperatures (SPT) such as 65 and 75°C. The highest enhancement ratio of 4.98 is obtained for two fin CF-PCM composite heat sink.

Experimental Investigations on Thermal Performance of PCM Based Heat Sink for Passive Cooling of Electronic Components

2018 ◽  
Author(s):  
Rohit Kothari ◽  
Pawan Mahalkar ◽  
Santosh K. Sahu ◽  
Shailesh I. Kundalwal
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Metal Foam ◽  
Volume Fraction ◽  
Electronic Devices ◽  
Operating Time ◽  
Thermal Control ◽  
Experimental Investigations ◽  
Electronic Components ◽  
Critical Set

In the present experimental study, an attempt has been made to study the efficient thermal management system based on phase change material for cooling of portable electronic devices. Paraffin wax is used as PCM to keep the temperature of electronic devices below critical temperature by absorbing thermal energy released by electronic components. PCM is filled inside the heat sink made of aluminum. Four different configuration of heat sink such as unfinned heat sink filled with pure PCM, two finned heat sink filled with pure PCM, unfinned heat sink filled with MF-PCM composite and two finned heat sink filled with MF-PCM composite are used in the present investigation to enhance the operating time of heat sink to reach critical set point temperature. Unfinned heat sink filled with and without PCM is used for baseline comparison. Effect of volume fraction of PCM, effect of heat flux and enhancement in operating time are reported in this study. Enhancement ratios are obtained for various heat sink configurations. The comparison of thermal performance of different configuration shows that higher enhancement ratio and effective thermal control is obtained with two finned metal foam heat sink.

Sign in / Sign up

Export Citation Format

Share Document