S-Passivation of the Ge Gate Stack Using (NH4)2S

2012 ◽  
Vol 187 ◽  
pp. 23-26 ◽  
Author(s):  
Sonja Sioncke ◽  
Claudia Fleischmann ◽  
Dennis Lin ◽  
Evi Vrancken ◽  
Matty Caymax ◽  
...  

The last decennia, a lot of effort has been made to introduce new channel materials in a Si process flow. High mobility materials such as Ge need a good gate stack passivation in order to ensure optimal MOSFET operation. Several routes for passivating the Ge gate stack have been explored in the last years. We present here the S-passivation of the Ge gate stack: (NH4)2S is used to create a S-terminated Ge surface. In this paper the S-treatment is discussed. The S-terminated Ge surface is not chemically passive but can still react with air. After gate oxide deposition, the Ge-S bonds are preserved and an adequate passivation is found for pMOS operation.

2018 ◽  
Vol 924 ◽  
pp. 494-497 ◽  
Author(s):  
Jesus Urresti ◽  
Faiz Arith ◽  
Konstantin Vassilevski ◽  
Amit Kumar Tiwari ◽  
Sarah Olsen ◽  
...  

We report the development of a low-temperature (600 °C) gate oxidation approach to minimize the density of interface traps (DIT) at the SiC/SiO2interface, ultimately leading to a significantly higher channel mobility in SiC MOSFETs of 81 cm2·V-1·s-1, >11x higher than devices fabricated alongside but with a conventional 1150 °C gate oxide. We further report on the comparison made between the DITand channel mobilities of MOS capacitors and n-MOSFETs fabricated using the low-and high-temperature gate oxidation.


2009 ◽  
Vol 45 (10) ◽  
pp. 527
Author(s):  
T. Sreenidhi ◽  
K. Baskar ◽  
A. DasGupta ◽  
N. DasGupta

2019 ◽  
Vol 66 (4) ◽  
pp. 1710-1716 ◽  
Author(s):  
J. Urresti ◽  
F. Arith ◽  
S. Olsen ◽  
N. Wright ◽  
A. O'Neill

2009 ◽  
Vol 1155 ◽  
Author(s):  
Serge Oktyabrsky ◽  
Padmaja Nagaiah ◽  
Vadim Tokranov ◽  
Sergei Koveshnikov ◽  
Michael Yakimov ◽  
...  

AbstractGroup III-V semiconductor materials are being studied as potential replacements for conventional CMOS technology due to their better electron transport properties. However, the excess scattering of carriers in MOSFET channel due to high-k gate oxide interface significantly depreciates the benefits of III-V high-mobility channel materials. We present results on Hall electron mobility of buried QW structures influenced by remote scattering due to InGaAs/HfO2 interface. Mobility in In0.77Ga0.23As QWs degraded from 12000 to 1200 cm2/V-s and the mobility vs. temperature slope changed from T-1.2 to almost T+1.0 in 77-300 K range when the barrier thickness is reduced from 50 to 0 nm. This mobility change is attributed to remote Coulomb scattering due to charges and dipoles at semiconductor/oxide interface. Elimination of the InGaAs/HfO2 interface via introduction of SiOx interface layer formed by oxidation of thin a-Si passivation layer was found to improve the channel mobility. The mobility vs. sheet carrier density shows the maximum close to 2×1012 cm-2.


2019 ◽  
Vol 33 (2) ◽  
pp. 9-23 ◽  
Author(s):  
Sonja Sioncke ◽  
Hang-Chun Lin ◽  
Christoph Adelmann ◽  
Guy Brammertz ◽  
A. Delabie ◽  
...  
Keyword(s):  

Author(s):  
N. Goel ◽  
D. Heh ◽  
S. Koveshnikov ◽  
I. Ok ◽  
S. Oktyabrsky ◽  
...  
Keyword(s):  

2016 ◽  
Vol 16 (3) ◽  
pp. 300-304 ◽  
Author(s):  
Chanjong Ju ◽  
Chulkwon Park ◽  
Hyeonseok Yang ◽  
Useong Kim ◽  
Young Mo Kim ◽  
...  

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