2.1: Invited Paper: 16.9‐Inch Flexible AMOLED Display with High Performance Top Gate Oxide TFT

2021 ◽  
Vol 52 (S2) ◽  
pp. 48-50
Author(s):  
YuanJun Hsu ◽  
Zhenguo Lin ◽  
Yihong Lu ◽  
BaiXiang Han ◽  
Weiran Cao ◽  
...  

2021 ◽  
Vol 52 (1) ◽  
pp. 21-24
Author(s):  
Weiran Cao ◽  
Yuan-Jun Hsu ◽  
Zheng Jiang ◽  
Fangmei Liu ◽  
Yuan-Chun Wu ◽  
...  


2013 ◽  
Vol 1538 ◽  
pp. 291-302
Author(s):  
Edward Yi Chang ◽  
Hai-Dang Trinh ◽  
Yueh-Chin Lin ◽  
Hiroshi Iwai ◽  
Yen-Ku Lin

ABSTRACTIII-V compounds such as InGaAs, InAs, InSb have great potential for future low power high speed devices (such as MOSFETs, QWFETs, TFETs and NWFETs) application due to their high carrier mobility and drift velocity. The development of good quality high k gate oxide as well as high k/III-V interfaces is prerequisite to realize high performance working devices. Besides, the downscaling of the gate oxide into sub-nanometer while maintaining appropriate low gate leakage current is also needed. The lack of high quality III-V native oxides has obstructed the development of implementing III-V based devices on Si template. In this presentation, we will discuss our efforts to improve high k/III-V interfaces as well as high k oxide quality by using chemical cleaning methods including chemical solutions, precursors and high temperature gas treatments. The electrical properties of high k/InSb, InGaAs, InSb structures and their dependence on the thermal processes are also discussed. Finally, we will present the downscaling of the gate oxide into sub-nanometer scale while maintaining low leakage current and a good high k/III-V interface quality.



The classical planar Metal Oxide Semiconductor Field Effect Transistors (MOSFET) is fabricated by oxidation of a semiconductor namely Silicon. In this generation, an advanced technique called 3D system architecture FETs, are introduced for high performance and low power quality of devices. Based on the limitations of Short Channel Effect (SCE), Silicon (Si) FET cannot be scaled under 10nm. Hence various performing measures like methods, principles, and geometrics are done to upscale the semiconductor. CMOS using alternate channel materials like GE and III-Vs on substrates is a highly anticipated technique for developing nanowire structures. By considering these issues, in this paper, we developed a simulation model that provides accurate results basing on Gate layout and multi-gate NW FET's so that the scaling can be increased few nanometers long and performance limits gradually increases. The model developed is SILVACO that tests the action of FET with different gate oxide materials.



2012 ◽  
Vol 20 (1) ◽  
pp. 47 ◽  
Author(s):  
Narihiro Morosawa ◽  
Yoshihiro Ohshima ◽  
Mitsuo Morooka ◽  
Toshiaki Arai ◽  
Tatsuya Sasaoka
Keyword(s):  


1993 ◽  
Author(s):  
Noriyoshi Yamauchi ◽  
Nobuhiko Kakuda ◽  
Tomoko Hisaki


1998 ◽  
Author(s):  
Hideo Oi ◽  
Yasuhito Shiho ◽  
Peter Chen ◽  
Navakant Bhat


2011 ◽  
Vol 42 (1) ◽  
pp. 479-482 ◽  
Author(s):  
Narihiro Morosawa ◽  
Yoshihiro Ohshima ◽  
Mitsuo Morooka ◽  
Toshiaki Arai ◽  
Tatsuya Sasaoka
Keyword(s):  


Sign in / Sign up

Export Citation Format

Share Document