Compact HMSIW four‐way filtering power divider with pre‐defined division ratio

Author(s):  
Yu‐Xing Yan ◽  
Wei Yu ◽  
Wei Qin ◽  
Ming‐Zhu Du ◽  
Jian‐Xin Chen
Keyword(s):  





Author(s):  
Dimitra Psychogiou ◽  
ZhengAn Yang ◽  
Dimitrios Peroulis


1989 ◽  
Vol 2 (7) ◽  
pp. 249-252 ◽  
Author(s):  
Jibendu Sekhar Roy ◽  
Dipak Ranjan Poddar ◽  
Amitava Mukherjee ◽  
Santorh Kumar Chowdhury


Author(s):  
Chuan Shao ◽  
Kai Xu ◽  
Xiao‐Hua Zhu ◽  
Jin Shi ◽  
Hui Chu


Frequenz ◽  
2017 ◽  
Vol 71 (11-12) ◽  
Author(s):  
Xing Jiang ◽  
Jia Wei ◽  
Lin Peng ◽  
Shao-Yu Tang

AbstractA broadband seven-port unequal power divider with large division ratio is designed based on the technique of T-shape stub. A T-shape stub is introduced to replace the conventional design for high characteristic impedance line in realization due to very small line width. The theoretical basis of the proposed T-shape stub is analyzed in detail using the Method of Matrix Algebra Analysis. The proposed design is simulated, fabricated and measured. The measured results are in good agreement with the simulated ones, and a large division ratio of 1:6 is achieved. The operation bandwidth of the proposed design is about 12 % (from 4.8 to 5.4 GHz).





2010 ◽  
Vol 4 (9) ◽  
pp. 1370 ◽  
Author(s):  
J.-X. Chen ◽  
Z.-H. Bao ◽  
Q. Xue


2016 ◽  
Vol 9 (3) ◽  
pp. 515-521 ◽  
Author(s):  
Ali-Reza Moznebi ◽  
Kambiz Afrooz

Design and realisation of a compact power divider based on half mode substrate integrated waveguide (HMSIW) with an arbitrary power dividing ratio is presented. This design consists of a substrate integrated waveguide (SIW) transition, two bisected HMSIW transitions by a gap, an SIW-to-microstrip transition, and two microstrip feed lines. In addition, a resistor is attached between two HMSIW transitions. To adjust the power division ratio, four parameters are introduced. Furthermore, four graphs are plotted using a three-dimensional electronmagnetic (3D EM) simulator to graphically determine the introduced parameters. In this study, three circuits with power division ratios of 1:1, 1:4, and 1:8 are simulated using the 3D EM simulator and fabricated on a Rogers RO4003C substrate. The results show a good agreement between the simulated and measured results. The measured results display these circuits (1:1, 1:4, and 1:8) have the bandwidths of 70, 36, and 40%, respectively. Moreover, the proposed structures (1:1, 1:4, and 1:8) are compact and their overall sizes are$1.13 \times 1.04\lambda _g^2 $,$0.96 \times 0.91\lambda _g^2 $, and$0.81 \times 0.78\lambda _g^2 $, respectively. These structures have the advantages of the compactness in size, wide bandwidth, high power division ratio (from 1:1 to 1:16), and compatibility with planar circuits.



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