Microstructural evolution at large driving forces during grain growth of ultrafine-grained Ni–1.2wt%P

1992 ◽  
Vol 131 (2) ◽  
pp. 569-575 ◽  
Author(s):  
D. Osmola ◽  
P. Nolan ◽  
U. Erb ◽  
G. Palumbo ◽  
K. T. Aust
MRS Advances ◽  
2016 ◽  
Vol 1 (26) ◽  
pp. 1947-1952 ◽  
Author(s):  
Prabhu Balasubramanian ◽  
Chengjian Zheng ◽  
Yixuan Tan ◽  
Genevieve Kane ◽  
Antoinette Maniatty ◽  
...  

ABSTRACTAn integrated experimental – simulation – control theory approach designed to enable adaptive control of microstructural evolution in polycrystalline metals is described. A micro-heater array, containing ten addressable channels, is used to create desired temperature profiles across thin polycrystalline films in situ to a scanning electron microscope (SEM). The goal is that on heating with controlled temperature profiles, the evolution of grain growth within the film can be continuously monitored and compared to Monte Carlo simulations of trajectories towards a desired microstructure. Feed-forward and feedback control strategies are then used to guide the microstructure along the desired trajectory.


2008 ◽  
Vol 584-586 ◽  
pp. 728-733 ◽  
Author(s):  
Takatoshi Sato ◽  
Daisuke Terada ◽  
Nobuhiro Tsuji

An Al-0.2wt%Zr alloy was severely deformed up to a strain of 8.0 by accumulative roll bonding (ARB) process, started from the solution-treated state. The microstructural evolution during ARB and its aging behavior were investigated. With increasing the number of ARB cycles, Vickers hardness of the specimens increased and reached to a constant value. The microstructural evolution during the ARB could be understood in terms of grain subdivision. The ultrafine grained (UFG) materials whose mean grain size was 0.4 -m were obtained by 10-cycle ARB process. In aging of the ARB processed specimens at high temperatures above 673K, the UFG microstructures quickly coarsened. On the other hand, it was suggested that the precipitation behaviors of the ARB specimen at 623K were quite unique and completely different from those of the conventionally solution-treated material with coarse grain size.


1998 ◽  
Vol 538 ◽  
Author(s):  
C.C. Battaile ◽  
T.E. Buchheit ◽  
E.A. Holm ◽  
G.W. Wellman ◽  
M.K. Neilsen

AbstractThe microstructural evolution of heavily deformed polycrystalline Cu is simulated by coupling a constitutive model for polycrystal plasticity with the Monte Carlo Potts model for grain growth. The effects of deformation on boundary topology and grain growth kinetics are presented. Heavy deformation leads to dramatic strain-induced boundary migration and subsequent grain fragmentation. Grain growth is accelerated in heavily deformed microstructures. The implications of these results for the thermomechanical fatigue failure of eutectic solder joints are discussed.


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