High-Speed Tensile Testing of Optical Fibers— New Understanding for Reliability Prediction

Author(s):  
Sergey Semjonov ◽  
G. Scott Glaesemann
2019 ◽  
Vol 1425 ◽  
pp. 012195
Author(s):  
S F Noller ◽  
A Pfennig ◽  
R Heiler
Keyword(s):  

Sensors ◽  
2021 ◽  
Vol 21 (14) ◽  
pp. 4865
Author(s):  
Kinzo Kishida ◽  
Artur Guzik ◽  
Ken’ichi Nishiguchi ◽  
Che-Hsien Li ◽  
Daiji Azuma ◽  
...  

Distributed acoustic sensing (DAS) in optical fibers detect dynamic strains or sound waves by measuring the phase or amplitude changes of the scattered light. This contrasts with other distributed (and more conventional) methods, such as distributed temperature (DTS) or strain (DSS), which measure quasi-static physical quantities, such as intensity spectrum of the scattered light. DAS is attracting considerable attention as it complements the conventional distributed measurements. To implement DAS in commercial applications, it is necessary to ensure a sufficiently high signal-noise ratio (SNR) for scattered light detection, suppress its deterioration along the sensing fiber, achieve lower noise floor for weak signals and, moreover, perform high-speed processing within milliseconds (or sometimes even less). In this paper, we present a new, real-time DAS, realized by using the time gated digital-optical frequency domain reflectometry (TGD-OFDR) method, in which the chirp pulse is divided into overlapping bands and assembled after digital decoding. The developed prototype NBX-S4000 generates a chirp signal with a pulse duration of 2 μs and uses a frequency sweep of 100 MHz at a repeating frequency of up to 5 kHz. It allows one to detect sound waves at an 80 km fiber distance range with spatial resolution better than a theoretically calculated value of 2.8 m in real time. The developed prototype was tested in the field in various applications, from earthquake detection and submarine cable sensing to oil and gas industry applications. All obtained results confirmed effectiveness of the method and performance, surpassing, in conventional SM fiber, other commercially available interrogators.


2007 ◽  
Vol 1054 ◽  
Author(s):  
Ruth Houbertz ◽  
Herbert Wolter ◽  
Volker Schmidt ◽  
Ladislav Kuna ◽  
Valentin Satzinger ◽  
...  

ABSTRACTThe integration of optical interconnects in printed circuit boards (PCB) is a rapidly growing field worldwide due to a continuously increasing need for high-speed data transfer. There are any concepts discussed, among which are the integration of optical fibers or the generation of waveguides by UV lithography, embossing, or direct laser writing. The devices presented so far require many different materials and process steps, but particularly also highly-sophisticated assembly steps in order to couple the optoelectronic elements to the generated waveguides. In order to overcome these restrictions, an innovative approach is presented which allows the embedding of optoelectronic components and the generation of optical waveguides in only one optical material. This material is an inorganic-organic hybrid polymer, in which the waveguides are processed by two-photon absorption (TPA) processes, initiated by ultra-short laser pulses. In particular, due to this integration and the possibility ofin situpositioning the optical waveguides with respect to the optoelectronic components by the TPA process, no complex packaging or assembly is necessary. Thus, the number of necessary processing steps is significantly reduced, which also contributes to the saving of resources such as energy or solvents. The material properties and the underlying processes will be discussed with respect to optical data transfer in PCBs.


2004 ◽  
Vol 126 (5) ◽  
pp. 852-857 ◽  
Author(s):  
Xu Cheng ◽  
Yogesh Jaluria

The domain of operating conditions, in which the optical fiber-drawing process is successful, is an important consideration. Such a domain is mainly determined by the stresses acting on the fiber and by the stability of the process. This paper considers an electrical resistance furnace for fiber drawing and examines conditions for process feasibility. In actual practice, it is known that only certain ranges of furnace temperature and draw speed lead to successful fiber drawing. The results obtained here show that the length of the heated zone and the furnace temperature distribution are other important parameters that can be varied to obtain a feasible process. Physical behavior close to the boundary of the feasible domain is also studied. It is found that the iterative scheme for neck-down profile determination diverges rapidly when the draw temperature is lower than that at the acceptable domain boundary due to the lack of material flow. However, the divergence rate becomes much smaller as the temperature is brought close to the domain boundary. Additional information on the profile determination as one approaches the acceptable region is obtained. It is found that it is computationally expensive and time-consuming to locate the exact boundary of the feasible drawing domain. From the results obtained, along with practical considerations of material rupture, defect concentration, and flow instability, an optimum design of a fiber-drawing system can be obtained for the best fiber quality.


1985 ◽  
Vol 3 (3) ◽  
pp. 669-673 ◽  
Author(s):  
S. Sakaguchi ◽  
T. Kimura
Keyword(s):  

1965 ◽  
Vol 36 (8) ◽  
pp. 1262-1262
Author(s):  
Glenn E. Fulmer ◽  
James F. Light ◽  
John F. Arnreich
Keyword(s):  

2015 ◽  
Vol 2015 (1) ◽  
pp. 000609-000615 ◽  
Author(s):  
John Mazurowski

Present fiber optic connections need to align two or more optical fibers to accuracies of microns (multimode fiber) and tenths of a micron (single more fiber). For connections in rugged applications, consisting of wide temperature ranges, substantial vibration, or in the presence of contaminants, the alignment of normal physical contact connections becomes even more difficult. New expanded beam connectors make fiber optic connections more durable, and help stabilize the transmission of high speed optical signals between systems, boxes, boards, and devices in these harsh environments.


Science ◽  
1985 ◽  
Vol 228 (4703) ◽  
pp. 1043-1048 ◽  
Author(s):  
H. Kogelnik
Keyword(s):  

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