Solder Joint Reliability Prediction for Multiple Environments

2009 ◽  
Author(s):  
Andrew E. Perkins ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Reliability Prediction ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Multiple Environments

scholarly journals Improving the Solder Joint Reliability Prediction Accuracy for Quad Flat No Lead Packages

2021 ◽  
pp. 81-89
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Prediction Model ◽  
Life Prediction ◽  
Correlation Equation ◽  
Experimental Result ◽  
Reliability Prediction ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Finite Element Analysis Simulation

This paper discusses the modeling approach used in improving the solder joint reliability prediction for Quad Flat No Lead (QFN) packages. A new power equation fatigue prediction model was developed based on the accumulated creep strain energy density from FEA (finite element analysis) simulation and the corresponding actual experimental result in terms of solder characteristic life of different QFN packages. The new curve fitted fatigue life correlation equation was then used in the solder joint reliability modeling together with the use of a hyperbolic sine constitutive model for lead-free solder. The model prediction using the new curve fitted equation was compared with the result from using the equation previously published. Based on the results, the new curve-fitted life prediction equation was able to improve the accuracy of solder life prediction. This study shows that solder joint reliability prediction could be improved by developing a prediction model based on actual data and consistent FEA modeling considerations in terms of methodology, material model and properties.

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability
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