RESIDUAL STRESS EVOLUTION DURING ENERGETIC PARTICLE BOMBARDMENT OF THIN FILMS

2007 ◽  
pp. 487-534 ◽  
Author(s):  
Amit Misra ◽  
Michael Nastasi
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Particle Bombardment ◽  
Energetic Particle ◽  
Stress Evolution

Microstructure and residual stress evolution in nanocrystalline Cu-Zr thin films

2021 ◽  
pp. 162799
Author(s):  
J. Chakraborty ◽  
T. Oellers ◽  
R. Raghavan ◽  
A. Ludwig ◽  
G. Dehm
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Stress Evolution

Residual Stress Evolution by the ex-situ Annealing of TiN Thin Films Deposited on Steel Substrates

1998 ◽  
Vol 287-288 ◽  
pp. 275-282 ◽  
Author(s):  
M. Ye ◽  
G. Berton ◽  
J-.L. Delplancke ◽  
M.-P. Delplancke ◽  
Luc Segers ◽  
...  
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Ex Situ ◽  
Stress Evolution ◽  
Tin Thin Films ◽  
Steel Substrates

Residual Stress Evolution in Dielectric Thin Films Prepared from Poly(methylsilsesquioxane) Precursor

2002 ◽  
Vol 203 (5-6) ◽  
pp. 801-811 ◽  
Author(s):  
Weontae Oh ◽  
Tae Joo Shin ◽  
Moonhor Ree ◽  
Moon Young Jin ◽  
Kookheon Char
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Stress Evolution ◽  
Dielectric Thin Films

Rapid Thermal Annealing for Residual-Stress Relaxation in Undoped or Doped Polysilicon Thin Films

1998 ◽  
Vol 546 ◽  
Author(s):  
Xin Zhang ◽  
Tong-Yi Zhang ◽  
Yitshak Zohar
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Stress Relaxation ◽  
Residual Stresses ◽  
Thermal Annealing ◽  
Rapid Thermal Annealing ◽  
Stress Evolution ◽  
Before And After ◽  
Polysilicon Films ◽  
Compressive Residual Stresses

AbstractThe residual stress in doped and undoped polysilicon films, before and after rapid thermal annealing (RTA), is investigated using both wafer-curvature and micro-rotating structures techniques. Microstructure characterization has been conducted as well to understand the mechanism of the stress evolution. The results show that the compressive residual stresses in undoped polysilicon films can be reduced or eliminated within a few seconds RTA. Surface nitridation and grain growth are identified as the mechanisms responsible for the stress evolution.

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