Residual Strain Variations in MBE-Grown InN Thin Films

Author(s):  
A Delimitis ◽  
Ph Komninou ◽  
J Arvanitidis ◽  
M Katsikini ◽  
S-L Sahonta ◽  
...  
Keyword(s):  
1998 ◽  
Vol 36 (1-4) ◽  
pp. 1-6 ◽  
Author(s):  
P Scardi ◽  
M Leoni ◽  
R Checchetto
Keyword(s):  

2001 ◽  
Vol 33 (1-4) ◽  
pp. 59-69 ◽  
Author(s):  
Keisuke Saito ◽  
Katsuyuki Ishikawa ◽  
Atsushi Saiki ◽  
Isao Yamaji ◽  
Takao Akai ◽  
...  

Author(s):  
G.T. Gray

Under shock-loading, twinning is observed in metals that do not twin under conventional loading conditions, for example copper and nickel where the stacking fault energy is about 78 and 128 ergs/cm2, respectively. Contradictions in the published data on the twinning stress in copper (from 1.6 GPa in thin films to 14.5-20 GPa in bulk specimens suggest differences associated with experimental techniques. This study examines the role of residual plastic strain (eres) on the deformation substructures, particularly twinning, in shock-roaded copper.


1991 ◽  
Vol 243 ◽  
Author(s):  
Winnie Wong-Ng ◽  
Ting C. Huang ◽  
Lawrence P. Cook ◽  
Peter K. Schenck ◽  
M.D. Vaudin ◽  
...  

AbstractX-ray diffraction techniques were used to study the crystallography of PZT thin films prepared by the laser deposition technique. This investigation included identification of phases formed during the annealing process and also the analysis of the profiles of selected diffraction peaks. The PZT films annealed below 800°C typically showed powder x-ray diffraction patterns corresponding to a cubic structure (i.e no peak splitting) instead of the tetragonal patterns characteristic of the target materials. The upper bound contribution of the macro and micro strain to the observed X-ray peak profile and positions was estimated. It was believed that the combined effect of small crystallite size together with residual strain, and possible local inhomogeneity gave rise to the broadening and displacement of the x-ray peaks, which subsequently masked off the splittings. At this stage the physical effect of high temperature annealing is not known. It is possible that as the annealing temperature increased, grain growth took place along with relaxation of residual strain, allowing peak splitting to be observed.


2012 ◽  
Vol 510-511 ◽  
pp. 335-342
Author(s):  
S.K. Mehmood ◽  
M. Mansoor ◽  
M.M. Asim ◽  
S. Zaman

Copper thin films are potentially used in optical and laser applications due to their intrinsic reflective indexes in visible and infrared region of the spectrum. The reflective properties of the thin films are mainly driven by their thickness, structure, and residual strain induced during the processing stages. Copper thin films of various thicknesses were deposited on glass slides using a thermal evaporation unit. The deposited substrates were thermally treated, in inert environment for 30 minutes, for various temperatures. Further, the substrates were characterized using various techniques. Structural studies of the thin films were carried out using XRD on the as deposited and heat treated films to study the phases, the crystallographic preferred orientation, residual strain and crystallite size. The polycrystalline Cu phase was revealed and no oxide phases were identified. The films were preferentially oriented along (111). The crystallite size increases while the residual strain decreases as the film thickness increases. The crystallite sizes were very small as compared to the film thickness. The optical properties of these coatings were investigated by double beam spectrophotometer. It was found that reflectance of these coatings strongly depends upon the film thickness and post deposition heat treatment. The optimum deposition procedure was established to obtain the enhanced reflecting power.


2020 ◽  
Vol 137 ◽  
pp. 103821 ◽  
Author(s):  
Gayatri K. Cuddalorepatta ◽  
Wim M. van Rees ◽  
Li Han ◽  
Daniel Pantuso ◽  
L. Mahadevan ◽  
...  

2004 ◽  
Vol 19 (9) ◽  
pp. 2708-2713 ◽  
Author(s):  
Roger M. Smith ◽  
Xiao-Dong Zhou ◽  
Wayne Huebner ◽  
Harlan U. Anderson

An acetate-based polymeric precursor for producing yttrium-stabilized zirconia (YSZ) was developed. The precursor was prepared under ambient conditions and contains only yttrium and zirconium cations. Dense, crack-free films were fabricated with this precursor on alumina substrates at a rate of 60 nm per deposition, producing polycrystalline YSZ at temperatures as low as 600 °C. Grain growth in thin YSZ films followed Arrhenius equation with an activation energy approximately 0.45 eV. The residual strain in YSZ films decreased with increasing annealing temperature from 600 to 900 °C.


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