The Fabrication and Characterization of Spreading Resistance Temperature Sensors Using NTD Silicon

Fabrication and Characterization of Wrapped Metal Yarns-based Fabric Temperature Sensors

Polymers ◽

10.3390/polym11101549 ◽

2019 ◽

Vol 11 (10) ◽

pp. 1549

Author(s):

Qian Yang ◽

Xi Wang ◽

Xin Ding ◽

Qiao Li

Keyword(s):

Mechanical Properties ◽

Body Temperature ◽

Heat Source ◽

Human Body ◽

Temperature Sensors ◽

Temperature Sensitive ◽

Maximum Strain ◽

Human Body Temperature ◽

Fabrication And Characterization

Textile temperature sensors are highly in demanded keep a real-time and accurate track of human body temperature for identification of healthy conditions or clinical diagnosis. Among various materials for textile temperature sensors, temperature-sensitive metal fibers have highest precision. However, those metal fibers are mechanically too weak, and break constantly during the weaving process. To enhance the mechanical strength of the metal fibers, this paper proposes to make wrapped metal fibers using wrapping technology, and characterize the effect of wrapped metal yarns on both mechanical properties and sensing behaviors. The wrapped yarns were woven into fabrics, forming the fabric temperature sensors. Results show that strength and maximum strain of the wrapped yarns are 2.69 and 1.82 times of pure Pt fibers. The response time of fabric temperature sensors using wrapped yarns was observed as 0.78 s and 1.1 s longer compared to that using Pt fibers when front and back sides contacted heat source, respectively. It is recommended that the wrapping method should be implemented for the protection of Pt fibers in fabric temperature sensors.

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Fabrication and characterization of long-period-grating temperature sensors using Ge–B-co-doped photosensitive fibre and single-mode fibre

Measurement Science and Technology ◽

10.1088/0957-0233/15/8/006 ◽

2004 ◽

Vol 15 (8) ◽

pp. 1467-1473 ◽

Cited By ~ 18

Author(s):

Toru Mizunami ◽

Terumasu Fukuda ◽

Akihiko Hayashi

Keyword(s):

Single Mode ◽

Temperature Sensors ◽

Long Period Grating ◽

Single Mode Fibre ◽

Long Period ◽

Fabrication And Characterization ◽

Mode Fibre ◽

Co Doped

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Fabrication and characterization of aluminum thin film heaters and temperature sensors on a photopolymer for lab-on-chip systems

Sensors and Actuators A Physical ◽

10.1016/j.sna.2013.01.035 ◽

2013 ◽

Vol 193 ◽

pp. 170-181 ◽

Cited By ~ 20

Author(s):

J. Martinez-Quijada ◽

S. Caverhill-Godkewitsch ◽

M. Reynolds ◽

L. Gutierrez-Rivera ◽

R.W. Johnstone ◽

...

Keyword(s):

Thin Film ◽

Temperature Sensors ◽

Lab On Chip ◽

Aluminum Thin Film ◽

Fabrication And Characterization ◽

On Chip

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Fabrication and characterization of doubly cladding fiber optical temperature sensors

10.1117/12.837808 ◽

2009 ◽

Author(s):

Xiao-Kang Zhang ◽

Delin Yan ◽

Shupei Mo ◽

Zhenming Nong ◽

Zhenshi Chen

Keyword(s):

Temperature Sensors ◽

Fiber Optical ◽

Fabrication And Characterization

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Design, Fabrication and Characterization of a 5x5 Array of Piezoresistive Stress and Temperature Sensors

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.503.43 ◽

2012 ◽

Vol 503 ◽

pp. 43-48 ◽

Cited By ~ 3

Author(s):

Chuan Guo Dou ◽

Yan Hong Wu ◽

Heng Yang ◽

Xin Xin Li

Keyword(s):

Printed Circuit Board ◽

Temperature Sensors ◽

Absolute Temperature ◽

Silicon On Insulator ◽

Circuit Board ◽

Crystal Direction ◽

Flexible Printed Circuit ◽

On Line ◽

Fabrication And Characterization

This paper reports on the development and characterization of piezoresistive stress and temperature sensors fabricated on silicon-on-insulator (SOI) wafer. The sensor chip consists of a 5x5 array elements enabling the simultaneous measurement of the absolute temperature as well as in-plane stress components in a temperature compensated manner. Each cell comprises a p-type piezoresistor rosette paralleling to the [110] crystal direction of silicon, an n-type piezoresistor rosette along the [100] crystal direction and a temperature sensor. Design, fabrication and characterization of piezoresistive and temperature sensors are described in detail. Moreover, based on the flexible printed circuit board, the prepackaging technique of sensors is reported and the electrical connections between the testing sensors and external measuring devices are achieved, then the changes in resistance versus temperature changes are measured in our experiment, the results show that this approach can be used for the signal measurement of sensor before the second packaging and on-line measurement of packaging stresses.

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