Study of the Processes of Formation of Intermediate Layers at the Base Metal—Coating Metal Interface in Electrodeposition

ABSTRACTThe microstructure of a Cu3Au v. Pb-5wt%Sn diffusion couple was examined in the as-dipped and annealed conditions. The as-dipped couple showed no reaction between the solder and the base metal. The couple developed intermediate layers of two intermetallic phases upon annealing for 289 hours at 169°C. These phases were identified as phi and eta’ which are contained in the Au-Cu-Sn ternary system. No phases containing significant amounts of Pb formed, indicating that even at low concentrations in a Pb-Sn solder, Sn is the active chemical specie in the solder for the Au-Cu-Pb-Sn system. The microhardness of the eta’ phase was found to be equal to that of Cu3Sn, which forms in the absence of Au in the Cu base metal. However, the the phi phase was harder, and therefore the presence of Au in the base metal may adversely affect the thermal fatigue resistance of the solder joint.

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Breaking Strength and Stressed State of Base Metal-Coating Composition

Coated Metal - Engineering Materials ◽

10.1007/978-3-662-06276-0_8 ◽

2002 ◽

pp. 397-438

Author(s):

Leonid I. Tushinsky ◽

Iliya Kovensky ◽

Alexandr Plokhov ◽

Victor Sindeyev ◽

Peter Reshedko

Keyword(s):

Stressed State ◽

Base Metal ◽

Breaking Strength ◽

Metal Coating ◽

Coating Composition

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Breaking strength of base metal-coating composition

Proceedings 6th Russian-Korean International Symposium on Science and Technology. KORUS-2002 (Cat. No.02EX565) ◽

10.1109/korus.2002.1027992 ◽

2003 ◽

Author(s):

L.I. Tushinsky ◽

A.V. Plokhov ◽

E.G. Shaidurova ◽

J.V. Ovcharenko

Keyword(s):

Base Metal ◽

Breaking Strength ◽

Metal Coating ◽

Coating Composition

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Study on Temperature Influence on Lack of Fusion Formation in Spatter/Base Metal Interface

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.875-877.1421 ◽

2014 ◽

Vol 875-877 ◽

pp. 1421-1428 ◽

Cited By ~ 1

Author(s):

Pei Gang Li ◽

Lars Erik Svensson ◽

Nicolaie Markocsan

Keyword(s):

Base Metal ◽

Empirical Relationship ◽

Life Time ◽

Fatigue Properties ◽

Metal Interface ◽

Lack Of Fusion ◽

Load Carrying ◽

Influence Of Temperature On ◽

Tandem Gmaw ◽

Cold Lap

In the development of modern welded structures with longer life-time and/or higher load-carrying ability, fatigue properties are becoming more and more important. A lot of researches have been done to investigate which factors can elongate the fatigue life of weldments. Cold lap defects, were found to be important initiation sites of the fatigue failure in 1990s. In the ISO standard, cold lap is referred to as a type of micro-lack of fusion. Previous study found that most of the cold laps in GMAW process are formed in spatters. In this paper the interface of spatter/base metal was cut, polished and investigated by conventional metallographic methods. The aim is to reveal the influence of temperature on cold lap formation. In the experiments, different pre-heating temperatures of the parent plate were used in tandem GMAW. Results showed linear empirical relationship between the temperature of the parent plate and the amount of lack of fusion in the spatter/base metal interface.

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