Al-Based Nanocomposites Produced via Spark Plasma Sintering: Effect of Processing Route and Reinforcing Phases

Author(s):  
Pasquale Cavaliere ◽  
B. Sadeghi ◽  
M. Shamanian ◽  
F. Ashrafizadeh
2013 ◽  
Vol 738-739 ◽  
pp. 579-583
Author(s):  
Silethelwe Chikosha ◽  
Hilda Kundai Chikwanda

Titanium-platinum (Ti50Pt50) alloy has been identified as a potential candidate for high temperature shape memory alloy (HTSMA) applications such as actuators in jet engines. This work evaluates powder metallurgy as an alternative processing route with the added benefit that near net shaped components can be formed. Spark plasma sintering (SPS) of blended elemental titanium and platinum powders was carried out. The sintering conditions used were: temperatures ranging from 1200 to 1400 °C and sintering times ranging from 10 to 30 minutes. SEM with EDS, XRD and DSC were carried out to study the results. Results showed that SPS only achieved high density, but not homogenisation of the alloys. All sintering conditions resulted in formation of the martensitic TiPt phase of interest, together with some or all of the following phases: Ti, Ti3Pt, Ti4Pt3, Ti3Pt5 and Pt. Post sintering annealing treatments were carried out to homoginise the alloys at 1300 °C for times ranging from 5 to 15 hours. With sufficient annealing times a two phase microstructure was produced with TiPt as the majority matrix phase and Ti3Pt5 as the precipitate phase.


2005 ◽  
Vol 88 (7) ◽  
pp. 1870-1874 ◽  
Author(s):  
Jurgen Schmidt ◽  
Rainer Niewa ◽  
Marcus Schmidt ◽  
Yuri Grin

2020 ◽  
Vol 405 ◽  
pp. 391-395
Author(s):  
Juraj Szabo ◽  
Katarína Ďurišinová ◽  
Ondrej Milkovič ◽  
Juraj Ďurišin

Dispersion strengthened Cu composites are studied over recent years to find an optimum processing route to obtain a high strength, thermal-stable copper alloy designed for modern applications in electrical engineering. The experimental Cu–4Al2O3–1MgO material was prepared by in situ thermo-chemical technique and mechanical milling followed by spark plasma sintering (SPS). The study analyses the influence of the Al2O3 and MgO secondary phases on strengthening the copper matrix. Microstructure of the composite was studied by X-ray diffraction analysis, scanning and transmission electron microscopy. The sintered microstructure shows a grain size distribution characterized by ultrafine grains/twins embedded inside the matrix of nanocrystalline grains. The microstructure is thermal stable up to 900 °C due to the dispersed alumina nano-particles that effectively strengthen crystallite/grain boundaries during the SPS process and annealing of the sintered compact at elevated temperatures. On the other hand, the coarsened MgO particles are responsible for ultrafine grains/twins formation. The obtained microstructure is important for practical utilization of the material because this structure is characterized by a good combination of strength and ductility.


2019 ◽  
Vol 785 ◽  
pp. 1137-1143 ◽  
Author(s):  
S.S. Kalyan Kamal ◽  
Y. Sushma ◽  
J. Vimala ◽  
B. Shankar ◽  
P. Ghosal ◽  
...  

2016 ◽  
Vol 122 ◽  
pp. 5-9 ◽  
Author(s):  
Guilhem Martin ◽  
Damien Fabrègue ◽  
Florian Mercier ◽  
Juan-Antonio Chafino-Aixa ◽  
Rémy Dendievel ◽  
...  

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