High-Speed, Low-Cost Simulation of Power Electronic Systems—A 50+ Year Collaboration

The development of 3D integration is necessarily required for high speed, high density, small size, and multi-functional electronic devices. Through silicon via (TSV) technology has been rapidly developed to fulfill the demand of the next generation of multifunctional electronic systems as one of the most alternative applications for 3D packaging. In this study, low cost and high speed molten solder-filling of TSV and bonding process by using micro bump was investigated. Micro bumps were formed with two step, Cu pillar bump and Sn-Ag cap bump by using electroplating. The size of micro-bumps was 10 and 20um and the precise content of the bump was developed with good planarity by adding reflow process. Additionally, the SiC nanoparticle composite solder was fabricated for low CTE filling material. From the results, it is possible that the CTE of composite solder added 1.0wt% SiC nanoparticles had decreased until 15.0ppm/°C. Comparing CTE of pure Sn, which was about 24.0ppm/°C, it was very low CTE and lower then CTE of Cu (16.5ppm/°C). Even if the electrical resistance of nanopowder composite solder is increased, the increasing rate is very slow until 1.0 wt%. However, the resistance changing rate is rapidly increased over the 1.0wt%. From the result, it is expected that nanopowder composite solder can contribute high reliability of molten solder filling TSV.

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High Speed and Optically Isolated Communication Unit for System Sampling in Power Electronic Building Blocks

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.494-495.1496 ◽

2014 ◽

Vol 494-495 ◽

pp. 1496-1499

Author(s):

De Hua Zhang ◽

Xiao Guang Jin ◽

Jiao He

Keyword(s):

System Design ◽

High Speed ◽

Building Blocks ◽

Propagation Delay ◽

Experimental Result ◽

Electronic Systems ◽

Power Electronic ◽

Sampled Data ◽

Excellent Performance ◽

Multiple Fibers

The reliability of Sampling and Transmitting Units (STU) are of great significance in power electronic systems. In order to reduce the sampling interruption, an FPGA-based and optic-isolated communication unit is proposed. The design philosophy and highlights of this method are described in detail. The sampled data is transmitted and received in digital mode in the STU. This unit realizes multi-channel sampling and supports simultaneous decoding of multiple fibers. It is pointed out that applications of this unit have practical value and excellent performance in isolation and transient properties in complicated power electronic systems. Waveforms and propagation delay between two nodes are presented by experimental result. The feasibility of the system design is shown through capacity calculations.

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Performance Analysis of Various Phases of SRM with Classical and New Compact Converter

TELKOMNIKA Indonesian Journal of Electrical Engineering ◽

10.11591/tijee.v16i2.1610 ◽

2015 ◽

Vol 16 (2) ◽

pp. 256

Author(s):

S.M. Mohamed Saleem ◽

L. Senthil Murugan

Keyword(s):

High Speed ◽

Low Cost ◽

Power Converter ◽

Rotary Compressor ◽

Power Electronic ◽

Power Electronic Converters ◽

Switched Reluctance ◽

Switching Losses ◽

Reluctance Motor ◽

Converter Topology

In recent years, considerable attention has been given to find the compact and low cost power converter topology for Switched Reluctance Motor (SRM) drive to meet the emerging applications such as plotters, fans, pumps, screw rotary compressor drives, high speed application drives above 30,000 RPM. This paper is concerned with such as attempt to formulate a new compact power converter for SRM drive. The proposed power converter has reduced number of power electronic components which makes the converter compact and also reduce the switching losses. The power factor plays a vital issue in the usage of power electronic converters. The power boost converter and PI controller. A Simulink system is developed for 3Φ SRM by using MATLAB software. The proposed converter performance is compared with the classical converter and analysis results are presented.<strong> </strong>

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High-speed and low-power electronic systems

24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492) ◽

10.1109/isse.2001.931021 ◽

2002 ◽

Author(s):

P. Schiopu ◽

C.L. Schiopu

Keyword(s):

Low Power ◽

High Speed ◽

Electronic Systems ◽

Power Electronic

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Quantum Sizing of Power Electronics: A Trend Towards Miniaturiation of Power Electronic Systems and Equipments

MRS Proceedings ◽

10.1557/proc-872-j18.28 ◽

2005 ◽

Vol 872 ◽

Cited By ~ 2

Author(s):

Arindam Chakraborty ◽

Ali Emadi

Keyword(s):

Power Electronics ◽

High Speed ◽

Electron Tunneling ◽

Differential Resistance ◽

Basic Structure ◽

Electronic Systems ◽

Power Electronic ◽

Tunneling Diodes ◽

Tunneling Diode ◽

Human Ability

AbstractHuman ability to manipulate atoms and molecules on quantum basis has generated a new dimension of physical structures for molecular scale transistors and devices. We will discuss about nanodimensional single electron transistor. This molecular device works as a switching element by controlling the electron tunneling for amplifying the current. The basic structure consists of two tunnel junctions isolated by a common insulator of nanodimensional length.One broader aspect of nano power electronics is that, it has got significant role in nanodimensional device regime as tunneling diodes. They have got inherently fast tunneling rate, which makes them highly suitable for high-speed operation. A special type of tunneling diode is an interband tunneling diode (ITD), which is actually, a p-n diode. The V-I characteristics of such diodes are dependent upon the tunneling barrier and tunneling process itself. Another special feature of these diodes is their negative-differential-resistance characteristics. This special characteristic of such diodes makes them very useful in switching digital circuits.

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High-Speed Real-Time Simulation for Power Electronic Systems

SIMULATION ◽

10.1177/0037549708098830 ◽

2008 ◽

Vol 84 (8-9) ◽

pp. 441-456 ◽

Cited By ~ 3

Author(s):

Dale Word ◽

Richard Bednar ◽

John J. Zenor ◽

Nari G. Hingorani

Keyword(s):

Real Time ◽

High Speed ◽

Electronic Systems ◽

Power Electronic ◽

Real Time Simulation ◽

Time Simulation

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Development and production experience of the multilayer curtain-coated linerboard of Ji’an PM No. 3,

TAPPI Journal ◽

10.32964/tj13.2.17 ◽

2014 ◽

Vol 13 (2) ◽

pp. 17-25

Author(s):

JUNMING SHU ◽

ARTHAS YANG ◽

PEKKA SALMINEN ◽

HENRI VAITTINEN

Keyword(s):

Titanium Dioxide ◽

High Speed ◽

Food Packaging ◽

Production Efficiency ◽

Positive Impact ◽

Low Cost ◽

Board Structure ◽

Flexographic Printing ◽

Curtain Coating ◽

Coating Formulations

The Ji’an PM No. 3 is the first linerboard machine in China to use multilayer curtain coating technology. Since successful startup at the end of 2011, further development has been carried out to optimize running conditions, coating formulations, and the base paper to provide a product with satisfactory quality and lower cost to manufacture. The key challenges include designing the base board structure for the desired mechanical strength, designing the surface properties for subsequent coating operations, optimizing the high-speed running of the curtain coater to enhance production efficiency, minimizing the amount of titanium dioxide in the coating color, and balancing the coated board properties to make them suitable for both offset and flexographic printing. The pilot and mill scale results show that curtain coating has a major positive impact on brightness, while smoothness is improved mainly by the blade coating and calendering conditions. Optimization of base board properties and the blade + curtain + blade concept has resulted in the successful use of 100% recycled fiber to produce base board. The optical, mechanical, and printability properties of the final coated board meet market requirements for both offset and flexographic printing. Machine runnability is excellent at the current speed of 1000 m/min, and titanium dioxide has been eliminated in the coating formulations without affecting the coating coverage. A significant improvement in the total cost of coated white liner production has been achieved, compared to the conventional concept of using virgin fiber in the top ply. Future development will focus on combining low cost with further quality improvements to make linerboard suitable for a wider range of end-use applications, including frozen-food packaging and folding boxboard.

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