Advanced TSV Filling Technology for 3-Dimensional Electronic Packaging

2014 ◽  
Vol 783-786 ◽  
pp. 2758-2764
Author(s):  
Chang Woo Lee ◽  
Young Ki Ko ◽  
Yong Ho Ko ◽  
Jung Hwan Bang
Keyword(s):  
High Speed ◽  
Composite Solder ◽  
High Reliability ◽  
Low Cost ◽  
Molten Solder ◽  
Electronic Systems ◽  
Filling Material ◽  
3 Dimensional ◽  
Cu Pillar Bump ◽  
3D Packaging

The development of 3D integration is necessarily required for high speed, high density, small size, and multi-functional electronic devices. Through silicon via (TSV) technology has been rapidly developed to fulfill the demand of the next generation of multifunctional electronic systems as one of the most alternative applications for 3D packaging. In this study, low cost and high speed molten solder-filling of TSV and bonding process by using micro bump was investigated. Micro bumps were formed with two step, Cu pillar bump and Sn-Ag cap bump by using electroplating. The size of micro-bumps was 10 and 20um and the precise content of the bump was developed with good planarity by adding reflow process. Additionally, the SiC nanoparticle composite solder was fabricated for low CTE filling material. From the results, it is possible that the CTE of composite solder added 1.0wt% SiC nanoparticles had decreased until 15.0ppm/°C. Comparing CTE of pure Sn, which was about 24.0ppm/°C, it was very low CTE and lower then CTE of Cu (16.5ppm/°C). Even if the electrical resistance of nanopowder composite solder is increased, the increasing rate is very slow until 1.0 wt%. However, the resistance changing rate is rapidly increased over the 1.0wt%. From the result, it is expected that nanopowder composite solder can contribute high reliability of molten solder filling TSV.

Low-Cost High-Speed Techniques for Real-Time Simulation of Power Electronic Systems

2007 ◽  
Author(s):  
R. E. Crosbie ◽  
J. J. Zenor ◽  
R. Bednar ◽  
D. Word ◽  
N. G. Hingorani
Keyword(s):  
Real Time ◽  
High Speed ◽  
Low Cost ◽  
Electronic Systems ◽  
Power Electronic ◽  
Real Time Simulation ◽  
Time Simulation

Research and Application on a Multi Head Conjugate Disc Indexing Cam Mechanism

2012 ◽  
Vol 184-185 ◽  
pp. 384-388
Author(s):  
Bing Tian Gao
Keyword(s):  
High Speed ◽  
Production Efficiency ◽  
High Reliability ◽  
Low Cost ◽  
Domestic Industry ◽  
Cam Mechanism ◽  
Technical Performance ◽  
Working Performance ◽  
Research Achievement ◽  
Indexing Mechanism

In order to realize the technical performance of high speed, high precision, high stability and high reliability for conjugated indexing mechanism with periodic intermittent rotary motion, a two cams structure has been designed, and its geometry size and profile curve was carefully determined. Also the calculation formula of the contour curve for CAM was deduced. Research achievement has been applied to new equipment of enterprise development, the working performance is stable and reliable, the production efficiency raised by 30% compared to the domestic industry. The mechanism has characteristics of simplified structure, improved transmission performance and low cost.

scholarly journals Design of Airport Obstacle-Free Zone Monitoring UAV System Based on Computer Vision

Sensors ◽  
2020 ◽  
Vol 20 (9) ◽  
pp. 2475
Author(s):  
Liang Wang ◽  
Jianliang Ai ◽  
Li Zhang ◽  
Zhenlin Xing
Keyword(s):  
Computer Vision ◽  
High Speed ◽  
Degrees Of Freedom ◽  
High Reliability ◽  
Low Cost ◽  
Pid Algorithm ◽  
Free Zone ◽  
Speed Tracking ◽  
Kernel Correlation ◽  
Tracking Technology

In recent years, a rising number of incidents between Unmanned Aerial Vehicles (UAVs) and planes have been reported at airports and airfields. A design scheme for an airport obstacle-free zone monitoring UAV system based on computer vision is proposed. The system integrates the functions of identification, tracking, and expelling and is mainly used for low-cost control of balloon airborne objects and small aircrafts. First, a quadcopter dynamic model and 2-Degrees of Freedom (2-DOF) Pan/Tilt/Zoom (PTZ) model are analyzed, and an attitude back-stepping controller based on disturbance compensation is designed. Second, a low and slow small-target self-identification and tracking technology is constructed against a complex environment. Based on the You Only Look Once (YOLO) and Kernel Correlation Filter (KCF) algorithms, an autonomous target recognition and high-speed tracking plan with great robustness and high reliability is designed. Third, a PTZ controller and automatic aiming strategy based on Anti-Windup Proportional Integral Derivative (PID) algorithm is designed, and a simplified, automatic-aiming expelling device, the environmentally friendly gel ball blaster, which features high speed and high accuracy, is built. The feasibility and stability of the project can be verified through prototype experiments.

scholarly journals Research on a Low-Cost, Open-Source, and Remote Monitoring Data Collector to Predict Livestock’s Habits Based on Location and Auditory Information: A Case Study from Vietnam

Agriculture ◽  
2020 ◽  
Vol 10 (5) ◽  
pp. 180 ◽  
Author(s):  
Ha Quang Thinh Ngo ◽  
Thanh Phuong Nguyen ◽  
Hung Nguyen
Keyword(s):  
Open Source ◽  
Real Time ◽  
High Speed ◽  
High Reliability ◽  
Low Cost ◽  
Monitoring Data ◽  
Farm Animals ◽  
Auditory Information ◽  
Fast Tracking ◽  
Data Collector

The supervision and feeding of grazing livestock are always difficult missions. Since animals act based on habits, the real-time monitoring data logger has become an indispensable instrument to assist farmers in recognizing the status of livestock. Position-tracked and acoustic monitoring have become commonplace as two of the best methods to characterize feeding performance in ruminants. Previously, the existing methods were limited to desktop computers and lacked a sound-collecting function. These restrictions impacted the late interventions from feeders and required a large-sized data memory. In this work, an open-source framework for a data collector that autonomously captures the health information of farm animals is introduced. In this portable hardware, a Wireless Location Acoustic Sensing System (WiLASS) is integrated to infer the health status through the activities and abnormal phenomena of farming livestock via chew–bite sound identification. WiLASS involves the open modules of ESP32-WROOM, GPS NEO-6M, ADXL335 accelerometer, GY-MAX4466 amplifier, temperature sensors, and other signal processing circuits. By means of wireless communication, the ESP32-WROOM Thing micro-processor offers high speed transmission, standard protocol, and low power consumption. Data are transferred in a real-time manner from the attached sensing modules to a digital server for further analysis. The module of GPS NEO-6M Thing brings about fast tracking, high precision, and a strong signal, which is suitable for highland applications. Some computations are incorporated into the accelerometer to estimate directional movement and vibration. The GY-MAX4466 Thing plays the role of microphone, which is used to store environmental sound. To ensure the quality of auditory data, they are recorded at a minimum sampling frequency of 10 KHz and at a 12-bit resolution. Moreover, a mobile software in pocket devices is implemented to provide extended mobility and social convenience. Converging with a cloud-based server, the multi-Thing portable platform can provide access to simultaneously supervise. Message Queuing Telemetry Transport (MQTT) protocol with low bandwidth, high reliability, and bi-direction, and which is appropriate for most operating systemsOS, is embedded into the system to prevent data loss. From the experimental results, the feasibility, effectiveness, and correctness of our approach are verified. Under the changes of climate, the proposed framework not only supports the improvement of farming techniques, but also provides a high-quality alternative for poor rural areas because of its low cost and its ability to carry out a proper policy for each species.

Multifunction Synchro-to-Digital Conversion on Software Design

2011 ◽  
Vol 225-226 ◽  
pp. 589-592
Author(s):  
Yan Liu ◽  
Ze Gang Ye
Keyword(s):  
Software Design ◽  
High Speed ◽  
Measurement Accuracy ◽  
High Reliability ◽  
Low Cost ◽  
High Accuracy ◽  
Industrial Applications ◽  
Digital Conversion ◽  
The Cost ◽  
The Military

The current Synchro-to-Digital conversion (S/DC)with high reliability, high accuracy and widely used in the military field, but it has high cost and low tracking speed, not suitable for high speed and low-cost industrial applications. In this work, the principle of synchro and the harmonics of the synchro output signals are investigated. Multifunction S/DC software design using FFT algorithm and IIR digital filter technology is proposed. It Integrated many functions, such as angle position, harmonics analysis and filter, it also improved measurement accuracy and speed, reduced the cost. The simulation results by Matlab show that the method is feasible.

Proposal of High-Quality Laser Hardening System for Shaft Parts Using Cylindrical Mirror and Ring-Beam Shaped by High-Speed Laser Scan System

2020 ◽  
Author(s):  
Hirotaka Tanabe ◽  
Keiji Ogawa ◽  
Heisaburo Nakagawa ◽  
Hirohito Tsukada ◽  
Yuki Goto
Keyword(s):  
Heat Treatment ◽  
Laser Beam ◽  
High Speed ◽  
High Efficiency ◽  
High Reliability ◽  
Low Cost ◽  
Treatment Method ◽  
Post Processing ◽  
High Quality ◽  
Almost All

Abstract Shaft parts are important parts used in almost all machines including automobiles. In addition, extremely high reliability is required since a shaft failure is directly linked to a fatal machine trouble. Therefore, a hardening process is usually conducted to improve strength and wear resistance. In this study, we propose a new laser heat treatment method to produce high-quality and high-accuracy shafts with high efficiency, low cost and low environmental impact. We will also develop a technique to derive the appropriate laser irradiation conditions quickly and systematically for shafts with various shapes and dimensions. There are the other hardening techniques including the electric furnace method and the induction method. These methods require post-processing for deformation correction, whereas the proposed method uses a laser to achieve thermal deformation-free hardening, eliminating the need for the post-processing. As a result, an improvement in yield can be expected due to a reduction of the products that cannot be corrected after heat treatment, which had to be waste disposed with conventional methods. By using our method, the entire circumference of the shaft was hardened by using a ring-shaped laser beam and a cylindrical inner mirror. Here, the ring-shaped laser beam was formed by high-speed scanning of a spot shapelaser. In the present paper, the details of this system were introduced and some experimental results were described.

SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS

2014 ◽  
Vol 2014 (1) ◽  
pp. 000165-000169
Author(s):  
Mary Liu ◽  
Wusheng Yin
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Low Cost ◽  
Organic Substrate ◽  
Advanced Materials ◽  
Assembly Process ◽  
Conductive Adhesives ◽  
Bump Height ◽  
3D Packaging ◽  
3D Package

3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20–40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won't help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail.

scholarly journals High Speed and Low Cost TSV Filling Technology by Using Molten Solder

2011 ◽  
Vol 29 (3) ◽  
pp. 14-18
Author(s):  
Young-Ki Ko ◽  
Min-Kuy Han ◽  
Se-Hoon Yoo ◽  
Chang-Woo Lee
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Molten Solder

The Application of Microcontroller MC9S08DZ60 in Automotive CAN Bus Electronic Control Unit

2013 ◽  
Vol 7 (1) ◽  
pp. 110-115 ◽  
Author(s):  
Yi Wang ◽  
Liren He
Keyword(s):  
Can Bus ◽  
High Reliability ◽  
Electronic Control Unit ◽  
Low Cost ◽  
Control Unit ◽  
Scientific Basis ◽  
Electronic Systems ◽  
Automotive Electronics ◽  
Electronic Control ◽  
Automotive Electronic

Being an excellent field-bus, CAN bus has increasingly been used in automotive electronic systems. MC9S08DZ60, an MCU of the S08D Series of Freescale company is an 8-bit universal automotive electronics controller with a CAN module. In this paper, the design of automotive electronic control unit is introduced based on the MC9S08DZ60. The hardware structure and software design processes have been shown. This circuit has characteristics of simple, low cost, high reliability and real-time. It has provided a scientific basis for the development of the CAN communication electronic control unit based on a microprocessor.

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