Application of Copper Thin Layer Electrical Resistance Sensor for Corrosion Monitoring in Aggressive Environments

2020 ◽  
pp. 232-244
Author(s):  
S. Yahi ◽  
A. Bensmaili ◽  
A. Haddad
Keyword(s):  
Thin Layer ◽  
Electrical Resistance ◽  
Corrosion Monitoring

scholarly journals Application of An Electrical Resistance Sensor-Based Automated Corrosion Monitor in the Study of Atmospheric Corrosion

Materials ◽  
2019 ◽  
Vol 12 (7) ◽  
pp. 1065 ◽  
Author(s):  
Zhuolin Li ◽  
Dongmei Fu ◽  
Ying Li ◽  
Gaoyuan Wang ◽  
Jintao Meng ◽  
...  
Keyword(s):  
Electrical Resistance ◽  
Atmospheric Corrosion ◽  
Continuous Measurement ◽  
Atmospheric Environment ◽  
Corrosion Monitoring ◽  
Metallic Materials ◽  
Actual Environment ◽  
The Internet Of Things ◽  
Corrosion Monitor ◽  
Corrosion Data

An automated corrosion monitor, named the Internet of Things atmospheric corrosion monitor (IoT ACM) has been developed. IoT ACM is based on electrical resistance sensor and enables accurate and continuous measurement of corrosion data of metallic materials. The objective of this research is to study the characteristics of atmospheric corrosion by analyzing the acquired corrosion data from IoT ACM. Employing data processing and data analysis methods to research the acquired corrosion data of steel, the atmospheric corrosion characteristics implied in the corrosion data can be discovered. Comparing the experiment results with the phenomenon of previous laboratory experiment and conclusions of previously published reports, the research results are tested and verified. The experiment results show that the change regulation of atmospheric corrosion data in the actual environment is reasonable and normal. The variation of corrosion depth is obviously influenced by relative humidity, temperature and part of air pollutants. It can be concluded that IoT ACM can be well applied to the conditions of atmospheric corrosion monitoring of metallic materials and the study of atmospheric corrosion by applying IoT ACM is effective and instructive under an actual atmospheric environment.

scholarly journals Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
Hao-Wen Hsueh ◽  
Fei-Yi Hung ◽  
Truan-Sheng Lui ◽  
Li-Hui Chen ◽  
Kuan-Jen Chen
Keyword(s):  
High Temperature ◽  
Thin Layer ◽  
Current Density ◽  
Electrical Resistance ◽  
Intermetallic Phase ◽  
Hexagonal Structure ◽  
Bonding Interface ◽  
Main Phase ◽  
High Temperature Storage ◽  
Temperature Storage

Three wires, Au, Cu, and Ag-Au-Pd, were bonded on an Al pad, inducing IMC growth by a 155 hr high temperature storage (HTS) so that the electrical resistance was increased and critical fusing current density (CFCD) decreased. Observations of the Ag-Au-Pd wire after HTS (0–1000 hr) indicated that IMC between the Ag-Au-Pd wire and Al Pad was divided into three layers: Ag2Al layers above and below the bonding interface and a polycrystal thin layer above the total IMC. A high percentage of Pd and Au existed in this 200 nm thin layer, and could suppress Al diffusion into the Ag matrix to inhibit IMC growth. After PCT-1000 hr, a noncontinuous structure still remained between the IMC layer and interface, and the main phase of IMC was (Ag, Au, Pd)2Al with a hexagonal structure.

Corrosion monitoring in archives by the electrical resistance technique

2014 ◽  
Vol 15 (2) ◽  
pp. 99-103 ◽  
Author(s):  
Milan Kouril ◽  
Tomas Prosek ◽  
Bert Scheffel ◽  
Yves Degres
Keyword(s):  
Electrical Resistance ◽  
Corrosion Monitoring

Corrosion Monitoring on a Large Steel Pressure Vessel by Thin-Layer Activation

CORROSION ◽  
1989 ◽  
Vol 45 (12) ◽  
pp. 1016-1019 ◽  
Author(s):  
G. Wallace ◽  
L. H. Boulton ◽  
D. Hodder
Keyword(s):  
Thin Layer ◽  
Pressure Vessel ◽  
Corrosion Monitoring ◽  
Large Steel ◽  
Thin Layer Activation ◽  
Layer Activation

Corrosion monitoring of different steels by thin layer activation

2004 ◽  
Vol 262 (2) ◽  
pp. 325-330 ◽  
Author(s):  
G. Laguzzi ◽  
L. Luvidi ◽  
N. De Cristofaro ◽  
M. F. Stroosnijder
Keyword(s):  
Thin Layer ◽  
Corrosion Monitoring ◽  
Thin Layer Activation ◽  
Layer Activation

Corrosion Commentary

1985 ◽  
Vol 32 (5) ◽  
pp. 3-3
Keyword(s):  
Technology Transfer ◽  
Thin Layer ◽  
Measurement System ◽  
Corrosion Monitoring ◽  
Sensitive Material ◽  
Material Loss ◽  
Monitoring Technique ◽  
Wear Measurement ◽  
Thin Layer Activation ◽  
Layer Activation

Commercial TLA system for corrosion monitoring. A programme of technology transfer is currently underway between Cormon and AERE Harwell to bring the sensitive material loss monitoring technique of Thin Layer Activation (TLA) to the market as a commercial corrosion, erosion and wear measurement system.

New Electrical Potential Method for Measuring Crack Growth in Nonconductive Materials

2003 ◽  
Author(s):  
H. Nayeb-Hashemi ◽  
D. Swet ◽  
A. Vaziri
Keyword(s):  
Thin Layer ◽  
Crack Length ◽  
Crack Growth ◽  
Electric Potential ◽  
Electrical Resistance ◽  
Electrical Potential ◽  
Bonded Joints ◽  
Adhesively Bonded ◽  
Adhesively Bonded Joints ◽  
Adhesively Bonded Joint

D.C. electric potential technique has been used to monitor crack growth in conductive materials. A constant DC current is ppased through thesse materials and the crack length is measured through the changes in the electrical voltage at the crack mouth. However, this method is not applicable in crack growth measurement in nonconductive materials or adhesively bonded joints. For these materials, a new method is developed and is shown to provide a very accurate method for measuring the crack length. The surface of these materials is coated with a thin layer of carbon paint and the crack lenght is measured through the changes in the electrical resistance of the carbon paint, as the crack grows both in the base material and the thin layer carbon paint. In contrast to the D.C. electric potential technique where the position of the probes for measuring the crack length is very important for an accurate measurement of the crack length, the new technique is little sensitive to the probe location. Crack growth is measured in adhesively bonded joints subjected to creep loadings. A modified Compact tension specimen is cut in two pieces across its notch area. The pieces are then glued jusing an adhensive. The surface of the specimen is painted with a thin layer of carbon paint and the changes in its electrical resistance are monitored. It is shown that the carbon paint method provides a quiet sensitive method for monitoring the crack growth. The creep crack growth rate in the adhesively bonded joint is related to Mode I energy release rate, G1. It is shown that the crack grows in the middle of the adhesive layer rather than at the interface of the joint. Micromechanisms of the crack growth are studied using a scanning electron microscope. The damage consists of numerous crazed regions at the crack tip. Crack grows by the linkage of the crazed region.

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