Design Considerations for Thermal Management of Electronics Enclosures

2015 ◽  
pp. 141-147
Author(s):  
Rachele Cocks ◽  
David Clendenen ◽  
Ludovic Chretien
Keyword(s):  
Thermal Management ◽  
Design Considerations ◽  
Thermal Management Of Electronics

DEVELOPMENT OF MINIATURE HEAT PIPES FOR THERMAL MANAGEMENT OF ELECTRONICS IN ISRO SPACECRAFT

2018 ◽  
Author(s):  
Akhil Jaiswal ◽  
A. R. Anand ◽  
Simhachal Rao Chikkala ◽  
Venkata Raghavendra
Keyword(s):  
Thermal Management ◽  
Heat Pipes ◽  
Thermal Management Of Electronics

scholarly journals An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics

2019 ◽  
Vol 9 (12) ◽  
pp. 2341-2351 ◽  
Author(s):  
Tianyu Yang ◽  
Thomas Foulkes ◽  
Beomjin Kwon ◽  
Jin Gu Kang ◽  
Paul V. Braun ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Thermal Management ◽  
Thermal Switch ◽  
Thermal Management Of Electronics

Characterization of Light Weight Heat Sink Materials for Thermal Management of Electronics

2007 ◽  
Author(s):  
Tunc Icoz ◽  
Mehmet Arik ◽  
John T. Dardis
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
High Efficiency ◽  
Computational Study ◽  
Heat Sinks ◽  
Advanced Materials ◽  
Air Cooling ◽  
Thermal Management Of Electronics ◽  
Thermal Solution

Thermal management of electronics is a critical part of maintaining high efficiency and reliability. Adequate cooling must be balanced with weight and volumetric requirements, especially for passive air-cooling solutions in electronics applications where space and weight are at a premium. It should be noted that there are systems where thermal solution takes more than 95% of the total weight of the system. Therefore, it is necessary to investigate and utilize advanced materials to design low weight and compact systems. Many of the advanced materials have anisotropic thermal properties and their performances depend strongly on taking advantage of superior properties in the desired directions. Therefore, control of thermal conductivity plays an important role in utilization of such materials for cooling applications. Because of the complexity introduced by anisotropic properties, thermal performances of advanced materials are yet to be fully understood. Present study is an experimental and computational study on characterization of thermal performances of advanced materials for heat sink applications. Numerical simulations and experiments are performed to characterize thermal performances of four different materials. An estimated weight savings in excess of 75% with lightweight materials are observed compared to the traditionally used heat sinks.

Design considerations for effective thermal management in mobile nanotweezers

2020 ◽  
Vol 16 (1) ◽  
pp. 33-42 ◽  
Author(s):  
Souvik Ghosh ◽  
Ambarish Ghosh
Keyword(s):  
Thermal Management ◽  
Design Considerations

scholarly journals Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

2018 ◽  
Vol 117 ◽  
pp. 1199-1204 ◽  
Author(s):  
Hafiz Muhammad Ali ◽  
Adeel Arshad ◽  
Mark Jabbal ◽  
P.G. Verdin
Keyword(s):  
Thermal Management ◽  
Heat Sinks ◽  
Pin Fin ◽  
Thermal Management Of Electronics
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