Preparation of Silica / Alumina Composite Abrasives and Their CMP Behavior on Hard Disk Substrate

2009 ◽  
pp. 633-635
Author(s):  
Fengling Chu ◽  
Hong Lei
Keyword(s):  
Hard Disk ◽  
Silica Alumina ◽  
Hard Disk Substrate ◽  
Alumina Composite ◽  
Disk Substrate

Effect of Ingredients in Slurry Containing Alumina on Polishing of Hard Disk Substrate

2009 ◽  
pp. 993-994
Author(s):  
Jiazhen Sun ◽  
Yan Zhou ◽  
Jianbin Luo ◽  
Yan Liu ◽  
Guoshun Pan ◽  
...  
Keyword(s):  
Hard Disk ◽  
Hard Disk Substrate ◽  
Disk Substrate

Abrasive-Free Polishing of Hard Disk Substrate with H2O2-K2S2O8-NaHSO3 Slurry

2013 ◽  
Vol 690-693 ◽  
pp. 3209-3212 ◽  
Author(s):  
Wei Tao Zhang ◽  
Hong Lei
Keyword(s):  
Removal Rate ◽  
Hard Disk ◽  
Corrosion Current ◽  
Polarization Measurement ◽  
Resonance Spectroscopy ◽  
Hydroxyl Free Radical ◽  
Potassium Peroxydisulfate ◽  
Hard Disk Substrate ◽  
Initiator System ◽  
Disk Substrate

The effect of potassium peroxydisulfate-sodium hydrogensulfite (K2S2O8- NaHSO3) as an initiator system in H2O2 –based slurry for the abrasive-free polishing (AFP) of hard disk substrate was investigated. The polishing experimental results showed that the H2O2-K2S2O8-NaHSO3 slurry had ten times higher material removal rate (MRR) than the H2O2 slurry in AFP of the hard disk. Further, the polishing mechanism of H2O2-K2S2O8-NaHSO3 slurry was investigated. Compared with the H2O2 slurry, electron spin-resonance spectroscopy (EPR) analysis showed that the H2O2-K2S2O8-NaHSO3 slurry provides twenty times higher concentration of hydroxyl free radical. Potentiodynamic polarization measurement showed that the corrosion current of disk substrate in the H2O2-K2S2O8-NaHSO3 slurry is larger than that in the H2O2 slurry. The results imply that K2S2O8-NaHSO3 as an initiator system for H2O2–based slurry has application prospects in abrasive-free polishing.

Effect of pH on Hard Disk Substrate Polishing in Glycine-Hydrogen Peroxide System Abrasive-Free Slurry

2013 ◽  
Vol 562-565 ◽  
pp. 691-696 ◽  
Author(s):  
Si Si Chen ◽  
Hong Lei ◽  
Ru Ling Chen
Keyword(s):  
Hydrogen Peroxide ◽  
Material Removal ◽  
Electrochemical Impedance ◽  
Removal Rate ◽  
Hard Disk ◽  
Reaction Scheme ◽  
Solution Ph ◽  
Effect Of Ph ◽  
Hard Disk Substrate ◽  
Disk Substrate

The effect of pH on the material removal rate (MRR) and surface roughness (Ra) of hard disk substrate in glycine–hydrogen peroxide system abrasive-free slurry was investigated. The results show that, the MRR of hard disk substrate increases when both glycine and H2O2 are used in acidic slurries (pH=3.0) and decreases drastically in alkaline slurries (pH=10.0). The Ra of hard disk substrates is small in acidic slurries and increases drastically in alkaline slurries. Further, the effects of glycine, H2O2, and solution pH on hard disk removal were investigated by auger electron spectroscopy (AES), electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization measurements. We also develop a reaction scheme describing the surface chemistry of the hard disk in this system.

CMP Behavior of α-Alumina-g-Polyvinylpyrrolidone Composite Abrasive on Hard Disk Substrate

2010 ◽  
Vol 97-101 ◽  
pp. 2135-2139 ◽  
Author(s):  
Hong Lei ◽  
Nai Jing Bu ◽  
Feng Ling Chu ◽  
Ping Hao ◽  
Xiao Li Hu
Keyword(s):  
Chemical Mechanical Polishing ◽  
Hard Disk ◽  
Lower Surface ◽  
Surface Grafting ◽  
Grafting Polymerization ◽  
Testing Conditions ◽  
Hard Disk Substrate ◽  
Α Al2o3 ◽  
Polished Substrate ◽  
Disk Substrate

A novel α-alumina-g-polyvinylpyrrolidone (α-Al2O3-g-PVP) composite abrasive was prepared by surface grafting polymerization. The chemical mechanical polishing (CMP) performances of the composite abrasive on hard disk substrate were investigated with a UNIPOL-1502 polishing machine. Analyses on the surface of polished substrate indicated that the α-Al2O3-g-PVP composite abrasive exhibited lower surface roughness, less scratch, and improved post-CMP cleaning performances than pure α-alumina abrasive under the same testing conditions.

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