The effect of gold-nickel metallization microstructure on fluxless soldering

R. B. Cinque; J. W. Morris

doi:10.1007/bf02670656

Fabrication and interfacial characterization of aluminum foam sandwich via fluxless soldering with surface abrasion

Composite Structures ◽

10.1016/j.compstruct.2014.12.055 ◽

2015 ◽

Vol 123 ◽

pp. 366-373 ◽

Cited By ~ 25

Author(s):

Long Wan ◽

Yongxian Huang ◽

Shixiong Lv ◽

Jicai Feng

Keyword(s):

Aluminum Foam ◽

Fluxless Soldering

The Joining Environment

10.31399/asm.tb.ps.t62440103 ◽

2004 ◽

pp. 103-143

Keyword(s):

Protective Atmosphere ◽

Health Safety ◽

Fluxless Soldering ◽

Industrial Use ◽

Materials Used

Abstract Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. This chapter addresses this issue in the context of soldering fluxes. It describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.

Study of fluxless soldering using formic acid vapor

IEEE Transactions on Advanced Packaging ◽

10.1109/6040.803451 ◽

1999 ◽

Vol 22 (4) ◽

pp. 592-601 ◽

Cited By ~ 50

Author(s):

Wei Lin ◽

Y.C. Lee

Keyword(s):

Formic Acid ◽

Acid Vapor ◽

Fluxless Soldering

C/sub 3/F/sub 8//O plasma treatment of lead free solders for fluxless soldering

10.1109/ecodim.2003.1322761 ◽

2003 ◽

Author(s):

Hosoda ◽

Suga

Keyword(s):

Plasma Treatment ◽

Lead Free ◽

Fluxless Soldering ◽

Lead Free Solders

Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering

Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) ◽

10.1109/iemt.1998.731073 ◽

2002 ◽

Cited By ~ 9

Author(s):

G. Takyi ◽

N.N. Ekere ◽

J.D. Philpott ◽

K.G. Snowdon ◽

C.G. Tanner

Keyword(s):

Nitrogen Atmosphere ◽

Fluxless Soldering

The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-013-1238-7 ◽

2013 ◽

Vol 24 (9) ◽

pp. 3255-3261 ◽

Cited By ~ 2

Author(s):

Jeong Hwan Lee ◽

Sung Woo Ma ◽

Young Min Kim ◽

Jin Su Lee ◽

Ki Bum Kim ◽

...

Keyword(s):

Interfacial Reaction ◽

Cu Substrates ◽

Fluxless Soldering

Fluxless soldering of liquid-crystal indicators

Welding International ◽

10.1533/wint.2005.3504 ◽

2005 ◽

Vol 19 (8) ◽

pp. 662-664

Author(s):

N G Kuz'min ◽

V P Sevost'yanov

Keyword(s):

Liquid Crystal ◽

Fluxless Soldering

Fluxless Soldering of Laminated Thin Metal Plates Using Au-Sn Alloy Solder.

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY ◽

10.2207/qjjws.15.38 ◽

1997 ◽

Vol 15 (1) ◽

pp. 38-44

Author(s):

Masaya Horino ◽

Keiji Watanabe ◽

Kunihiro Tamahashi

Keyword(s):

Thin Metal ◽

Metal Plates ◽

Alloy Solder ◽

Fluxless Soldering

The use of surfactants and post supercritical CO2 mixing on the electroless nickel metallization of blind holes in printed circuit board

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255947 ◽

2017 ◽

Author(s):

Jun-Wei Su ◽

Chen-Hsin Yao ◽

Chun-Ying Lee ◽

Wun-Jheng Zeng ◽

Chen-Shan Peng ◽

...

Keyword(s):

Printed Circuit Board ◽

Electroless Nickel ◽

Circuit Board ◽

Printed Circuit ◽

Nickel Metallization

Ultrasonic Fluxless Soldering of Eutectic SnPb and SnAgCu Alloys: A Feasibility Study

Volume 2B: Advanced Manufacturing ◽

10.1115/imece2014-39476 ◽

2014 ◽

Author(s):

Jing Shi ◽

Yachao Wang

Keyword(s):

Feasibility Study ◽

Focal Point ◽

Lead Free ◽

Ultrasonic Power ◽

Element Analysis ◽

Chemical Flux ◽

Soldering Time ◽

Fluxless Soldering ◽

Ultrasonic Soldering ◽

Eutectic Snpb

Compared with the traditional eutectic SnPb soldering, lead-free soldering has been a focal point for electronics packaging research in order for the industry to meet the regulations on environment protection. By eliminating the lead element from soldering process, the concerns on environmental pollution can be significantly reduced. However, the current lead-free soldering processes usually still require the flux chemicals for promoting wetting. The use of flux chemicals is not environmentally friendly. In this study, motivated by the potential benefits of soldering using ultrasonic energy, we carry out a feasibility study of ultrasonic fluxless soldering experiments on both the regular eutectic SnPb soldering alloy, Sn63Pb37 and the popular SnAgCu alloy, SAC305. By developing the appropriate testing conditions, the solder joints are successfully formed using the dipping ultrasonic soldering method regardless if chemical flux is applied. The effects of soldering time, temperature, and ultrasonic power are investigated. The results from SEM observation and EDS element analysis indicate that the use of chemical flux produces thicker intermetallic compound (IMC) layers for Sn63Pb37 alloy, and a longer soldering time leads to thicker IME layers for both solder alloys. However, a higher soldering temperature may not be beneficial to the growth of IME layer in ultrasonic soldering of SAC305 alloy. However, the driving mechanisms behind the phenomena remain to be investigated in the future.