Effect of ultrasonic vibration on polishing monocrystalline silicon: surface quality and material removal rate

2019 ◽  
Vol 103 (5-8) ◽  
pp. 2109-2119 ◽  
Author(s):  
Tianbiao Yu ◽  
Zhihui Wang ◽  
Xuepeng Guo ◽  
Pengfei Xu ◽  
Ji Zhao ◽  
...  
Keyword(s):  
Surface Quality ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Silicon Surface ◽  
Material Removal ◽  
Removal Rate ◽  
Monocrystalline Silicon

Optimization of μEDM process assisted with rotating magnetic pulling force and ultrasonic vibration

2021 ◽  
pp. 095440892098440
Author(s):  
Gurpreet Singh ◽  
DR Prajapati ◽  
PS Satsangi
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Electrical Discharge ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
Machining Process ◽  
Micro Electrical Discharge Machining ◽  
Pulling Force ◽  
Tool Rotation

The micro-electrical discharge machining process is hindered by low material removal rate and low surface quality, which bound its capability. The assistance of ultrasonic vibration and magnetic pulling force in micro-electrical discharge machining helps to overcome this limitation and increase the stability of the machining process. In the present research, an attempt has been made on Taguchi based GRA optimization for µEDM assisted with ultrasonic vibration and magnetic pulling force while µEDM of SKD-5 die steel with the tubular copper electrode. The process parameters such as ultrasonic vibration, magnetic pulling force, tool rotation, energy and feed rate have been chosen as process variables. Material removal rate and taper of the feature have been selected as response measures. From the experimental study, it has been found that response output measures have been significantly improved by 18% as compared to non assisted µEDM. The best optimal combination of input parameters for improved performance measures were recorded as machining with ultrasonic vibration (U1), 0.25 kgf of magnetic pulling force (M1), 600 rpm of tool rotation (R2), 3.38 mJ of energy (E3) and 1.5 mm/min of Tool feed rate (F3). The confirmation trail was also carried out for the validation of the results attained by Grey Relational Analysis and confirmed that there is a substantial improvement with both assistance applied simultaneously.

scholarly journals Assessment of CVD- and PVD-Coated Carbides and PVD-Coated Cermet Inserts in the Optimization of Surface Roughness in Turning of AISI 1045 Steel

Materials ◽  
2020 ◽  
Vol 13 (22) ◽  
pp. 5231
Author(s):  
Evandro Paese ◽  
Martin Geier ◽  
Fabiano R. Rodrigues ◽  
Tadeusz Mikolajczyk ◽  
Mozammel Mia
Keyword(s):  
Surface Quality ◽  
Material Removal Rate ◽  
Vapor Deposition ◽  
Material Removal ◽  
Removal Rate ◽  
Controllable Factors ◽  
Aisi 1045 Steel ◽  
Aisi 1045 ◽  
1045 Steel ◽  
Coated Carbide

In this study, an experimental and statistic investigation approach based on analysis of variance (ANOVA) and response surface methodology (RSM) techniques was performed to find the significant main effects and two-factor interaction effects and to determine how the controllable factors such as cutting speed, feed rate, depth of cut (DOC), tool nose radius, substrate and coating method of cutting tools influence surface quality in turning of AISI 1045 steel. The first optimal or near-optimal conditions for the quality of the generated surface and the second ones, including maximum material removal rate, were established using the proposed regression equations. The group mean roughness of the turned workpieces was lower from using chemical vapor deposition (CVD)-coated carbide inserts than the group means of other types of inserts; however they could not achieve the specific lowest roughness. The physical vapor deposition (PVD)-coated carbide and cermet inserts achieved the best surface quality when the specific combinations within the range interval of controllable factors were used in the experiment, showing that they may be applied to finish turning processes or even to particular high material removal rate conditions associated with the lowest roughness.

Study on Chemical Mechanical Polishing Removal Mechanism of Monocrystalline Silicon

2014 ◽  
Vol 538 ◽  
pp. 40-43
Author(s):  
Hong Wei Du ◽  
Yan Ni Chen
Keyword(s):  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Silicon Wafers ◽  
Monocrystalline Silicon ◽  
Mechanical Polishing ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Polishing Pressure

In this paper, material removal mechanism of monocrystalline silicon by chemical etching with different solutions were studied to find effective oxidant and stabilizer. Material removal mechanism by mechanical loads was analyzed based on the measured acoustic signals in the scratching processes and the observation on the scratched surfaces of silicon wafers. The chemical mechanical polishing (CMP) processes of monocrystalline silicon wafers were analyzed in detail according to the observation and measurement of the polished surfaces with XRD. The results show that H2O2 is effective oxidant and KOH stabilizer. In a certain range, the higher concentration of oxidant, the higher material removal rate; the higher the polishing liquid PH value, the higher material removal rate. The polishing pressure is an important factor to obtain ultra-smooth surface without damage. Experimental results obtained silicon polishing pressure shall not exceed 42.5kPa.

Comparative Study and Mathematical Modeling of Machining Parameters in Ultrasonic-Assisted EDM of AISI H13 Tool Steel by the Application of Workpiece Vibration

2010 ◽  
Vol 154-155 ◽  
pp. 1604-1613
Author(s):  
Mohammad Reza Shabgard ◽  
Babak Sadizadeh ◽  
Keivan Amini ◽  
Hamid Pourziaie
Keyword(s):  
Comparative Study ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Correct Selection ◽  
Machining Parameters ◽  
Machining Performance ◽  
Ultrasonic Assisted ◽  
Aisi H13

The correct selection of the machining parameters is one of the most significant issues to take into consideration in Ultrasonic-assisted Electrical Discharge Machining (US-EDM) and EDM processes. In the present work, a study has been made to develop and extract statistical models to show the relationship between important machining performance data (material removal rate (MRR), tool wear ratio (TWR) and surface roughness Ra) and the input machining parameters (pulse current, and pulse-on time) in the EDM and US-EDM of AISI H13. The models obtained were used to analyze the effects of input parameters on machining performance. In addition, a comparative study was carried out to investigate the effect of ultrasonic vibration of the workpiece on machining performance. The results show that Ultrasonic vibration of the workpiece can significantly reduce the inactive pulses and improves the stability of process. Also US-EDM is effective in attaining a high material removal rate (MRR) in finishing regime in comparison with conventional EDM. The results of Analysis of Variance (ANOVA) indicate that the proposed mathematical models can adequately explain the performance within the limits of the factors being studied.

Experimental Research on Ultrasonic Assisted Pulse Electrochemical Compound Finishing for Hard and Brittle Metal

2010 ◽  
Vol 42 ◽  
pp. 170-174
Author(s):  
Cheng Guang Zhang ◽  
Xue Ling Yang ◽  
Bo Zhao
Keyword(s):  
Particle Size ◽  
Surface Quality ◽  
Experimental Research ◽  
Material Removal Rate ◽  
Vibration Amplitude ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Ultrasonic Assisted ◽  
Metal Materials

The experiment of ultrasonic assisted pulse electrochemical compound finishing is carried in this paper. The machining principle of the compound finishing is discussed in this paper. Processing experiments of compound finishing are carried out to study the effects of the main processing para- meters, including the particle size, the ultrasonic vibration amplitude, the minimum gap between the tool head and workpiece and the pulse voltage, on the material removal rate and the surface quality for hard and brittle metal materials. The curves of the corresponding relationships are also obtained. The study indicates that the processing velocity, machining accuracy and surface quality can be improved under the compound finishing, obtaining the processing technology conductions of the compound finishing. Introductions

Study on the Mechanism of Engineering Ceramics in Rotary Ultrasonic-Vibration Grinding

2013 ◽  
Vol 372 ◽  
pp. 158-164
Author(s):  
Chang Chun Yu
Keyword(s):  
Fracture Mechanics ◽  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Paper Analysis ◽  
Engineering Ceramics

This paper analysis the process of Al2O3 engineering ceramics grinding and study the mechanism of rotary ultrasonic-vibration grinding. Then setting the model of the material removal rate and grinding force, which is based on Creasing fracture mechanics. Results indicate rotary ultrasonic-vibration grinding can apparently improve the material removal rate and cut down the grinding force.

High Efficient Mechanism of Material Removal in Two-Dimensional Ultrasonic Grinding from the Locus Perspective

2009 ◽  
Vol 416 ◽  
pp. 609-613
Author(s):  
Ming Li Zhao ◽  
Bo Zhao ◽  
Yu Qing Wang ◽  
Guo Fu Gao
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Material Surface ◽  
Grinding Wheel ◽  
Two Dimensional ◽  
Abrasive Grains ◽  
Ultrasonic Grinding ◽  
High Efficient

Relative motion of single abrasive is analyzed for the different applied directions of longitudinal ultrasonic vibration, and its locus is simulated in the present paper. The research results show that the locus in two-dimensional ultrasonic vibration is only similar to that in y-direction, and both are close to sinusoid curves. The width of grooves scratched by abrasive grains y-direction (axial direction of grinding wheel) is two times of the vibration amplitude, and the material removal rate increases remarkably. In case of x-direction (tangential direction of grinding wheel) ultrasonic vibration, abrasive grains with periodic force impact material surface with high frequency vibration, which make material fracture removal easy. Therefore, the high efficiency essence of material removal in two-dimensional ultrasonic grinding is revealed in view of locus. In addition, according to the results of grinding experiments, under same conditions good surface quality can be obtained in two-dimensional ultrasonic grinding and material removal rate in common grinding is the lowest. Consequently it is further proved that the method of two-dimensional ultrasonic vibration grinding is an effective one for ceramic materials.

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