The effect of Co addition on the electrical conductivity of Sr- and Mg-doped LaAlO3

2006 ◽  
Vol 17 (2-4) ◽  
pp. 787-791 ◽  
Author(s):  
Ji Young Park ◽  
Gyeong Man Choi
Keyword(s):  
Electrical Conductivity ◽  
Co Addition ◽  
Mg Doped

Spectroscopic and electrical conductivity investigation of Mg doped LiNbO3 single crystals

1986 ◽  
Vol 59 (6) ◽  
pp. 375-379 ◽  
Author(s):  
K. Polgár ◽  
L. Kovács ◽  
I. Földvári ◽  
I. Cravero
Keyword(s):  
Electrical Conductivity ◽  
Single Crystals ◽  
Mg Doped

Mg-doped Ta3N5nanorods coated with a conformal CoOOH layer for water oxidation: bulk and surface dual modification of photoanodes

2017 ◽  
Vol 5 (38) ◽  
pp. 20439-20447 ◽  
Author(s):  
Lang Pei ◽  
Zhe Xu ◽  
Zhan Shi ◽  
Heng Zhu ◽  
Shicheng Yan ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Water Oxidation ◽  
Carrier Density ◽  
Fold Increase ◽  
Mg Doping ◽  
Mg Doped

Benefiting from Mg doping to enhance electrical conductivity and carrier density together with a high conformal CoOOH layer as an OEC to make maximum use of surface reaching holes, the Ta3N5nanorod photoanode exhibits an over 4-fold increase in photocurrent.

scholarly journals Effects of Co Addition on the Properties and Microstructure of Cu-Ni-Si-P-Mg Alloys

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 368
Author(s):  
Jianyi Cheng ◽  
Fangxin Yu ◽  
Fu Huang
Keyword(s):  
Electrical Conductivity ◽  
Diffusion Rate ◽  
Mg Alloys ◽  
Mg Alloy ◽  
Peak Hardness ◽  
Electronic Industry ◽  
Aging Behavior ◽  
Co Addition ◽  
Lower Diffusion

Cu-Ni-Si alloys are widely used in electrical and electronic industry owing to excellent electrical conductivity and strength. A suitable addition of Co in the Cu-Ni-Si alloys can improve its strength and deteriorate its electrical conductivity. In this work, Cu-Ni-Co-Si-P-Mg alloys with different Co content are employed to investigate the effects of Co on the properties and microstructure. The results showed that Co addition lead to the formation of (Ni, Co)2Si precipitates. (Ni, Co)2Si precipitate is harder to coarsen than δ-Ni2Si during aging. The larger the Co content in the alloys is, the smaller the precipitates formed is. There exists a threshold content of Co to divide the studied alloys into two groups. One group of theses alloys with <1 wt.% Co or Co/Ni ratio <0.56 has the same aging behavior as the Cu-Ni-Si-P-Mg alloy. On the contrary, the time to reach the peak hardness of aging for another group can be obviously delayed and its electrical conductivity decreases slightly with the increase of Co content. It can be attributed to the lower diffusion rate of Co than that of Ni in the Cu matrix. Meanwhile, the Co addition can inhibit the formation of P-enriched Ni-P phase in Co-containing alloys during aging. The as-quenched Cu-1.6Ni-1.2Co-0.65Si-0.1P-0.05Mg alloy can reach 257 HV and 38.7%IACS after aging at 500 °C for 3 h, respectively.

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