scholarly journals Interface layer effect on the stress distribution of a wafer-bonded bilayer structure

2007 ◽  
Vol 43 (1) ◽  
pp. 88-97 ◽  
Author(s):  
Yin Zhang
2020 ◽  
Vol 10 (24) ◽  
pp. 8879
Author(s):  
Jie Zhang ◽  
Qiuhua Rao ◽  
Wei Yi

Study on viscoelastic properties of the multi-layered coarse-grained soil (CGS) is very important for safety assessment and disaster prevention of subgrade engineering. Current research work is mainly focused on the one-layered CGS and the actual pebble inclusion of irregular polyhedron is usually simplified as an ideal shape of sphere or ellipsoid. Very few studies are available for predicting viscoelastic parameters of the multi-layered CGS. In this paper, a new method is proposed to predict viscoelastic parameters of multi-layered CGS based on the homogenization method and elastic–viscoelastic corresponding principle, in which the interface-layer viscoelasticity and the actual shape of pebble inclusion are firstly taken into account. Research results show the creep deformation is decreased with the increase of the shape factor (ρ) of pebble inclusion, and the interface-layer height (h) and numbers (N). ρ is in the range of 1–1.8 and the suitable interface-layer height is 20–30% as much as the height of one-layered CGS. The tested creep curves of the multi-layered CGS agree well with the predicted ones and can prove the existence of the interface-layer (considering at least one interface-layer) and verify the validity of this new interface-layer method.


2008 ◽  
Vol 47 (7) ◽  
pp. 5770-5776 ◽  
Author(s):  
Tsukasa Nakai ◽  
Masahiko Yoshiki ◽  
Yasuhiro Satoh ◽  
Sumio Ashida

2013 ◽  
Vol 364 ◽  
pp. 154-158
Author(s):  
Lang Liu ◽  
Gong Yu Li ◽  
Jie Sun ◽  
Qing Bo Liu

The stress distribution of adhesive-bonded joint in a MW segmented assembly wind turbine blade under static loading is analysed using finite element method (FEM). It is shown that the maximum principal stress causes the adhesive layer destruction away from the loading end of the sleeve layer. Numerically, the interface layer destruction trend of the adhesive-bonded joint is investigated, and the influence of maximum principal stress distribution by altering the sleeve length is investigated.


Author(s):  
B. Van Meerbeek ◽  
L. J. Conn ◽  
E. S. Duke

Restoration of decayed teeth with tooth-colored materials that can be bonded to tooth tissue has been a highly desirable property in restorative dentistry for many years. Advantages of such an adhesive restorative technique over conventional techniques using non-adhesive metal-based restoratives include improved restoration retention with minimal sacrifice of sound tooth tissue for retention purposes, superior adaptation and sealing of the restoration margins in prevention of caries recurrence, improved stress distribution across the tooth-restoration interface throughout the whole tooth, and even reinforcement of weakened tooth structures. The dental adhesive technology is rapidly changing. An efficient resin bond to enamel has already long been achieved. Its bonding mechanism has been fully elucidated and has proven to be a durable and reliable clinical treatment. However, bonding to dentin represents a greater challenge. After the failures of a dentin acid-etch technique in imitation of the enamel phosphoric-acid-etch technique and a bonding procedure based on chemical adhesion, modern dentin adhesives are currently believed to bond to dentin by a micromechanical hybridization process. This process is developed by an initial demineralization of the dentin surface layer with acid etchants exposing a collagen fibril arrangement with interfibrillar microporosities that subsequently become impregnated by low-viscosity monomers. Although the development of such a hybridization process has well been documented in the literature, questions remain with respect to parameters of-primary importance to adhesive efficacy.


2002 ◽  
Vol 716 ◽  
Author(s):  
K.L. Ng ◽  
N. Zhan ◽  
M.C. Poon ◽  
C.W. Kok ◽  
M. Chan ◽  
...  

AbstractHfO2 as a dielectric material in MOS capacitor by direct sputtering of Hf in an O2 ambient onto a Si substrate was studied. The results showed that the interface layer formed between HfO2 and the Si substrate was affected by the RTA time in the 500°C annealing temperature. Since the interface layer is mainly composed of hafnium silicate, and has high interface trap density, the effective barrier height is therefore lowered with increased RTA time. The change in the effective barrier height will affect the FN tunneling current and the operation of the MOS devices when it is applied for nonvolatile memory devices.


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