The effects of temperature gradient and growth rate on the microstructure of directionally solidified Sn–3.5Ag eutectic solder
2011 ◽
Vol 23
(2)
◽
pp. 484-492
◽
Keyword(s):
2011 ◽
Vol 23
(1)
◽
pp. 31-40
◽
2014 ◽
Vol 1004-1005
◽
pp. 24-27
2003 ◽
Vol 12
(5)
◽
pp. 544-551
◽
2009 ◽
Vol 16
(02)
◽
pp. 191-201
◽
2008 ◽
Vol 202
(1-3)
◽
pp. 145-155
◽
Keyword(s):
2009 ◽
Vol 15
(5)
◽
pp. 741-751
◽
2015 ◽
Vol 51
(1)
◽
pp. 67-72
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EFFECTS OF TEMPERATURE GRADIENT ON LAMELLAR ORIENTATIONS OF DIRECTIONAL SOLIDIFIED TiAl--BASED ALLOY
2011 ◽
Vol 46
(10)
◽
pp. 1223-1229
◽