Improving thermal shock response of interfacial IMCs in Sn–Ag–Cu joints by using ultrathin-Ni/Pd/Au metallization in 3D-IC packages

2018 ◽  
Vol 30 (3) ◽  
pp. 2342-2350 ◽  
Author(s):  
Tzu-Ting Chou ◽  
Collin Jordon Fleshman ◽  
Hao Chen ◽  
Jenq-Gong Duh
Keyword(s):  
Thermal Shock ◽  
3D Ic ◽  
Interfacial Imcs ◽  
Shock Response

Enhanced thermal shock response of Al 2 O 3 –graphite composites through a layered architectural design

2018 ◽  
Vol 102 (6) ◽  
pp. 3673-3684 ◽  
Author(s):  
Junjie Song ◽  
Hui Yang ◽  
Raúl Bermejo ◽  
Jianmin Qu ◽  
Litian Hu ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Architectural Design ◽  
Shock Response ◽  
Graphite Composites

Thermal shock response of fine- and ultra-fine-grained tungsten-based materials

2011 ◽  
Vol T145 ◽  
pp. 014060 ◽  
Author(s):  
G Pintsuk ◽  
H Kurishita ◽  
J Linke ◽  
H Arakawa ◽  
S Matsuo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Fine Grained ◽  
Shock Response

Geometry Effect on the Thermal Shock Response of Al2O3/ZrO2 Multilayered Ceramics

2007 ◽  
Vol 333 ◽  
pp. 251-254
Author(s):  
Raúl Bermejo ◽  
Peter Supancic ◽  
Tanja Lube
Keyword(s):  
Crack Initiation ◽  
Thermal Shock ◽  
Architectural Design ◽  
Thermal Stresses ◽  
Slip Casting ◽  
Experimental Tests ◽  
Element Model ◽  
Distribution Profile ◽  
Geometry Effect ◽  
Shock Response

In this work, the geometry effect on the thermal shock behaviour of a nine layered Al2O3- 5%tZrO2/Al2O3-30%mZrO2 ceramic fabricated by slip casting has been studied. A finite element model has been used to estimate the magnitude and location of the maximum thermal stresses in the layered material as well as the influence of the variation of this layered architectural design in the thermal shock crack initiation and extend throughout the specimens of study. Experimental tests on various samples have been carried out to validate the model. The residual stress distribution profile in the laminate, due to the elastic mismatch of the different layers along with the zirconia phase transformation on the Al2O3-30%mZrO2 layers, conditions the thermal shock response of the material. It is demonstrated how the variation of the outer most layer thickness in the laminates modifies the stress state in the surface, affecting the thermal shock crack initiation.

Thermal shock response of deformed and recrystallised tungsten

2013 ◽  
Vol 88 (9-10) ◽  
pp. 1768-1772 ◽  
Author(s):  
M. Wirtz ◽  
G. Cempura ◽  
J. Linke ◽  
G. Pintsuk ◽  
I. Uytdenhouwen
Keyword(s):  
Thermal Shock ◽  
Shock Response

A thermodynamic framework to analyze the thermal shock response in an anisotropic hollow cylinder with energy dissipation

2018 ◽  
Vol 14 (3) ◽  
pp. 410-430 ◽  
Author(s):  
Siddhartha Biswas ◽  
Soumen Shaw
Keyword(s):  
Energy Dissipation ◽  
Thermal Shock ◽  
Hollow Cylinder ◽  
Integral Transform ◽  
Generalized Thermoelasticity ◽  
High Rate ◽  
Content Type ◽  
Short Period ◽  
Shock Response ◽  
Consistent Manner

Purpose The purpose of this paper is to analyze the thermal shock response on the deformation of circular hollow cylinder in a thermodynamically consistent manner. Design/methodology/approach The investigation is carried out under the light of generalized thermoelasticity theory with energy dissipation. In order to obtain the analytical expressions of the components of stress and strain fields, appropriate integral transform technique is adopted and the salient features are emphasized. Findings It has been observed that the existence of energy dissipation can minimize the development of the stress components into the cylindrical wall. Since more amount of heat is propagate into the medium in a short period of time consequently, the medium deformed in a high rate in presence of energy dissipation. Two special phenomena are also revealed in the particular cases. Originality/value The numerical simulated results are demonstrated through a numerous diagrams and some important observations are explained. This work may be helpful for those researchers who are devoted on several types of heat or fluid flow into the pipeline made with anisotropic solids.

scholarly journals Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

2018 ◽  
Vol 8 (11) ◽  
pp. 2056 ◽  
Author(s):  
Chunjin Hang ◽  
Ruyu Tian ◽  
Liyou Zhao ◽  
Yanhong Tian
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Extreme Temperature ◽  
Bulk Diffusion ◽  
Thermal Shock Test ◽  
Interfacial Imcs ◽  
Deep Space Exploration ◽  
Pull Strength ◽  
Quad Flat Package ◽  
Interfacial Intermetallic Compounds

Solder joints in thermally uncontrolled microelectronic assemblies have to be exposed to extreme temperature environments during deep space exploration. In this study, extreme temperature thermal shock test from −196 °C to 150 °C was performed on quad flat package (QFP) assembled with Sn-37Pb solder joints to investigate the evolution and growth behavior of interfacial intermetallic compounds (IMCs) and their effect on the pull strength and fracture behavior of Sn-37Pb solder joints under extreme temperature environment. Both the scallop-type (Cu, Ni)6Sn5 IMCs at the Cu lead side and the needle-type (Ni, Cu)3Sn4 IMCs at the Ni-P layer side changed to plane-type IMCs during extreme temperature thermal shock. A thin layer of Cu3Sn IMCs was formed between the Cu lead and (Cu, Ni)6Sn5 IMC layer after 150 cycles. The growth of the interfacial IMCs at the lead side and the Ni-P layer side was dominated by bulk diffusion and grain-boundary diffusion, respectively. The pull strength was reduced about 31.54% after 300 cycles. With increasing thermal shock cycles, the fracture mechanism changed from ductile fracture to mixed ductile–brittle fracture, which can be attributed to the thickening of the interfacial IMCs, and the stress concentration near the interface caused by interfacial IMC growth.

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