scholarly journals Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

2018 ◽  
Vol 8 (11) ◽  
pp. 2056 ◽  
Author(s):  
Chunjin Hang ◽  
Ruyu Tian ◽  
Liyou Zhao ◽  
Yanhong Tian
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Extreme Temperature ◽  
Bulk Diffusion ◽  
Thermal Shock Test ◽  
Interfacial Imcs ◽  
Deep Space Exploration ◽  
Pull Strength ◽  
Quad Flat Package ◽  
Interfacial Intermetallic Compounds

Solder joints in thermally uncontrolled microelectronic assemblies have to be exposed to extreme temperature environments during deep space exploration. In this study, extreme temperature thermal shock test from −196 °C to 150 °C was performed on quad flat package (QFP) assembled with Sn-37Pb solder joints to investigate the evolution and growth behavior of interfacial intermetallic compounds (IMCs) and their effect on the pull strength and fracture behavior of Sn-37Pb solder joints under extreme temperature environment. Both the scallop-type (Cu, Ni)6Sn5 IMCs at the Cu lead side and the needle-type (Ni, Cu)3Sn4 IMCs at the Ni-P layer side changed to plane-type IMCs during extreme temperature thermal shock. A thin layer of Cu3Sn IMCs was formed between the Cu lead and (Cu, Ni)6Sn5 IMC layer after 150 cycles. The growth of the interfacial IMCs at the lead side and the Ni-P layer side was dominated by bulk diffusion and grain-boundary diffusion, respectively. The pull strength was reduced about 31.54% after 300 cycles. With increasing thermal shock cycles, the fracture mechanism changed from ductile fracture to mixed ductile–brittle fracture, which can be attributed to the thickening of the interfacial IMCs, and the stress concentration near the interface caused by interfacial IMC growth.

Characteristics of Sn-2.5Ag flip chip solder joints under thermal shock test conditions

2009 ◽  
Vol 23 (2) ◽  
pp. 435-441 ◽  
Author(s):  
Kyoung Chun Yang ◽  
Seong Hyuk Lee ◽  
Jong-Min Kim ◽  
Young Ki Choi ◽  
Dave F. Farson ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Flip Chip ◽  
Solder Joints ◽  
Thermal Shock Test ◽  
Shock Test ◽  
Test Conditions

scholarly journals Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Metals ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 586 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Ming Yang ◽  
Yong-Ho Ko ◽  
Jeong-Won Yoon ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Low Cost ◽  
Thermal Shock Test ◽  
Shock Condition ◽  
Joint Reliability ◽  
Cu3sn Layer ◽  
Kirkendall Voids ◽  
Free Solder ◽  
Thermomechanical Reliability

The exemption of Pb-bearing automobile electronics in the End of Life Vehicle (ELV) directive has recently expired, bring an urgent need to find Pb-free alloys that can maintain good performance under high-temperature and vibration conditions for automobile application. In this study, a new lead-free solder, Sn-0.7Cu-0.2Cr (wt.%) alloy, was developed. To evaluate the thermomechanical reliability of the new solder alloy in automobile electronics, a thermal shock test was performed. The results show that the presence of Cr in solder inhibits the growth of interfacial Cu3Sn layer and the formation of Kirkendall voids, which effectively improves the joint reliability under intense thermal shock condition compared with the commercial SAC305 and SC07 solders. Specifically, the shear strength of the Sn-0.7Cu-0.2Cr/Cu solder joints was higher by 23% and 44% than that of SAC305 and SC07 solder joints after 2000 cycles of thermal shock at 1 m/s shear speed.

Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock

2021 ◽  
Vol 32 (6) ◽  
pp. 6890-6899
Author(s):  
Ruyu Tian ◽  
Yanhong Tian ◽  
Yilong Huang ◽  
Dongsheng Yang ◽  
Cheng Chen ◽  
...  
Keyword(s):  
Comparative Study ◽  
Thermal Shock ◽  
Solder Joints ◽  
Extreme Temperature

scholarly journals Examination the effect of thermal shock test on SAC solder joints fabricated by THRS and multiwave soldering techniques

2019 ◽  
Vol 4 (1) ◽  
pp. 1-6 ◽  
Author(s):  
Daniel Koncz-Horvath ◽  
Aliz Molnar ◽  
Greta Gergely ◽  
Manoj Kumar Pal ◽  
Zoltan Gacsi
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Thermal Shock Test ◽  
Shock Test ◽  
Sac Solder

Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test

2008 ◽  
Vol 580-582 ◽  
pp. 247-250
Author(s):  
S.W. Han ◽  
Kyong Ho Chang ◽  
J.G. Han ◽  
Il Je Cho ◽  
Jong Min Kim ◽  
...  
Keyword(s):  
Fracture Surface ◽  
Solder Joint ◽  
Thermal Shock ◽  
Fracture Mode ◽  
Lead Free ◽  
Composition Analysis ◽  
Thermal Shock Test ◽  
Solder Paste ◽  
Shock Test ◽  
Pull Strength

The reliability of QFP (Quad flat package) solder joint using Sn-8Zn-3Bi solder paste under the thermal shock test was investigated. Considering the environmental restriction such as ROHS, the QFP Cu LF (Lead-frame) was coated with lead-free materials (Sn, Sn-3Bi). To analyze the reliability under thermal shock treatment, the samples were placed in the thermal shock chamber (248K/423K, Dwell time: 30min). During the thermal shock test, the solder joint cross-sections were observed every 500 cycles. No crack initiation and propagation was observed through all type of plated Cu LF. The measured pull strength slightly decreased, as the number of cycles increased. After 1000 cycles, the pull strength of Sn and SnBi plated Cu LF reduced by 30% and 20%, respectively, compared with that of initial condition. Observing the fracture surface morphology by FE-SEM, the fracture mode changed and the IMC fractured area on the both fracture surface was increased. The IMC was identified as γ-Cu5Zn8 by chemical composition analysis using EDS. The reduced pull strength was affected by IMC fracture and fracture mode change. However, the pull strength does not decrease steeply but gradually. Consequently, the Sn-8Zn-3Bi solder joint shows the reliable solder joint strength, fracture mechanism, and compatibility with lead-free plated Cu LF during the thermal shock temperature of 248K to 423K.

scholarly journals Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints

Materials ◽  
2019 ◽  
Vol 13 (1) ◽  
pp. 94 ◽  
Author(s):  
Jiajie Fan ◽  
Jie Wu ◽  
Changzhen Jiang ◽  
Hao Zhang ◽  
Mesfin Ibrahim ◽  
...  
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Flip Chip ◽  
Heat Dissipation ◽  
Solder Joints ◽  
Light Emitting Diode ◽  
Shock Load ◽  
Thermal Shock Test ◽  
Mechanical Reliability ◽  
Light Emitting

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and reliability of solder joints. This paper models the 3D random voids generation in the LED flip chip Sn96.5–Ag3.0–Cu0.5 (SAC305) solder joint, and investigates the effect of thermal shock load on its mechanical reliability with both simulations and experiments referring to the JEDEC thermal shock test standard (JESD22-A106B). The results reveal the following: (1) the void rate of the solder joint increases after thermal shock ageing, and its shear strength exponentially degrades; (2) the first principal stress of the solder joint is not obviously increased, however, if the through-hole voids emerged in the corner of solder joints, it will dramatically increase; (3) modelling of the fatigue failure of solder joint with randomly distributed voids utilizes the approximate model to estimate the lifetime, and the experimental results confirm that the absolute prediction error can be controlled around 2.84%.

scholarly journals Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

Metals ◽  
2020 ◽  
Vol 10 (10) ◽  
pp. 1373
Author(s):  
Ziyi Wang ◽  
Songbai Xue ◽  
Weimin Long ◽  
Bo Wang ◽  
Jianhao Wang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Shock ◽  
Fracture Mode ◽  
Extreme Temperature ◽  
Interface Layer ◽  
Thin Layers ◽  
Thermal Shock Test ◽  
Micro Cracks ◽  
Microstructure Morphology ◽  
Interface Layers

Extreme temperature change has generally been the great challenge to spacecraft electronic components, particularly in long, periodic, deep-space exploration missions. Hence, researchers have paid more attention to the reliability of component packaging materials. In this study, the microstructure evolution on the interface of Cu/Ni/Au/Au-12Ge/Au/Ni/Cu joints, as well as the effects of extreme thermal shock on mechanical properties and the fracture mode in the course of extreme thermal changes between −196 and 150 °C, have been investigated. Results revealed that the interface layers comprised of two thin layers of NiGe and Ni5Ge3 compounds after Au-12Ge solder alloy was soldered on the Au/Ni/Cu substrate. After extreme thermal shock tests, the microstructure morphology converted from scallop type to planar one due to the translation from NiGe to Ni5Ge3. Meanwhile, the thickness of interface layer hardly changed. The shear strength of the joints after 300 cycles of extreme thermal shock was 35.1 MPa, which decreased by 19.61%. The fracture location changed from the solder to solder/NiGe interface, and then to the interface of NiGe/Ni5Ge3 IMC layer. Moreover, the fracture type of the joints gradually transformed from ductile fracture mode to brittle mode during thermal shock test. Simultaneously, the formation and extension of defects, such as micro-voids and micro-cracks, were found during the process of thermal shock due to the different thermal expansion coefficient among the solder, interface layer and substrate.

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