An improved quasi-zero stiffness isolator with two pairs of oblique springs to increase isolation frequency band

2021 ◽  
Author(s):  
Feng Zhao ◽  
Jinchen Ji ◽  
Quantian Luo ◽  
Shuqian Cao ◽  
Lumin Chen ◽  
...  
Keyword(s):  
Frequency Band ◽  
Isolation Frequency

Contact Current Density Analysis Inside Human Body in Low-Frequency Band Using Geometric Multi-Grid Solver

2020 ◽  
Vol E103.C (11) ◽  
pp. 588-596
Author(s):  
Masamune NOMURA ◽  
Yuki NAKAMURA ◽  
Hiroo TARAO ◽  
Amane TAKEI
Keyword(s):  
Frequency Band ◽  
Current Density ◽  
Human Body ◽  
Low Frequency ◽  
Density Analysis

CONTROL AND STABILIZATION OF TEMPERATURE (0.8÷300 K) IN THE CRYODIELECTROMETER OF A GIGAHERTZ FREQUENCY BAND

2014 ◽  
Vol 73 (11) ◽  
pp. 993-1003 ◽  
Author(s):  
R. V. Golovashchenko ◽  
V. N. Derkach ◽  
M. K. Zaetz ◽  
V. G. Korzh ◽  
A. S. Plevako ◽  
...  
Keyword(s):  
Frequency Band

Quasi-Optical Polarization Attenuators in the Terahertz Frequency Band

2008 ◽  
Vol 67 (13) ◽  
pp. 1207-1215 ◽  
Author(s):  
V. K. Kiselyov ◽  
M. S. Yanovsky ◽  
V. I. Bezborodov ◽  
Ye. M. Kuleshov
Keyword(s):  
Frequency Band ◽  
Optical Polarization ◽  
Terahertz Frequency

Acoustic and Photoacoustic Inspection of Through-Silicon Vias in the GHz-Frequency Band

2017 ◽  
Author(s):  
Sebastian Brand ◽  
Michael Kögel ◽  
Frank Altmann ◽  
Ingrid DeWolf ◽  
Ahmad Khaled ◽  
...  
Keyword(s):  
Quality Assessment ◽  
Frequency Band ◽  
Process Development ◽  
Three Dimensional ◽  
Non Destructive Testing ◽  
Destructive Testing ◽  
Vertical Interconnection ◽  
Testing Techniques ◽  
Silicon Vias ◽  
Non Destructive

Abstract Through Silicon Via (TSV) is the most promising technology for vertical interconnection in novel three-dimensional chip architectures. Reliability and quality assessment necessary for process development and manufacturing require appropriate non-destructive testing techniques to detect cracks and delamination defects with sufficient penetration and imaging capabilities. The current paper presents the application of two acoustically based methods operating in the GHz-frequency band for the assessment of the integrity of TSV structures.

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